公开(公告)号：US5667130A

公开(公告)日：1997-09-16

申请号：US382527

申请日：1995-02-02

申请人： Makoto Morita ,  Masaru Nagaike ,  Richard Gueler ,  Makoto Imanishi ,  Takahiro Yonezawa

发明人： Makoto Morita ,  Masaru Nagaike ,  Richard Gueler ,  Makoto Imanishi ,  Takahiro Yonezawa

IPC分类号： H01L21/60 ,  B23K20/00 ,  H01L21/607 ,  B23K20/10

CPC分类号： H01L24/85 ,  B23K20/005 ,  B23K20/007 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78901 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/3025

摘要： An ultrasonic wire bonding apparatus and method is capable of maintaining a sufficient clearance between the horn and bonding surface, and thereby increase the working area without using a long horn. In the ultrasonic wire bonding apparatus, a capillary is located at the front end of a horn for holding a wire that is directly supported at the front end of the horn. The capillary is long enough to maintain a sufficient clearance between the horn and the bonding surface. Alternatively, a capillary, which is located at the front end of a horn for holding a wire, is short and is supported at the front end of the horn through a joint or extension. The total length of the joint and the capillary is enough to maintain a sufficient clearance between the horn and the bonding surface.

摘要翻译： 超声波引线接合装置和方法能够在喇叭和接合面之间保持足够的间隙，从而在不使用长喇叭的情况下增加工作面积。 在超声波引线接合装置中，毛细管位于喇叭的前端，用于保持直接支撑在喇叭前端的线材。 毛细管足够长以保持喇叭和接合表面之间的足够的间隙。 或者，位于用于保持电线的喇叭的前端的毛细管是短的，并且通过接头或延伸部支撑在喇叭的前端。 接头和毛细管的总长度足以在喇叭和接合表面之间保持足够的间隙。

公开(公告)号：US07010388B2

公开(公告)日：2006-03-07

申请号：US10444019

申请日：2003-05-22

申请人： Robert J. Mitchell ,  Allan D. Weed ,  Richard Gueler

发明人： Robert J. Mitchell ,  Allan D. Weed ,  Richard Gueler

IPC分类号： G06F7/00

CPC分类号： H01L21/67763 ,  H01L21/67213 ,  H01L21/67745 ,  Y10S414/139 ,  Y10S414/141

摘要： A transfer system for use with a tool for treating a work-piece at sub-atmospheric pressure such as an ion implanter for implanting silicon wafers. An enclosure defines a low pressure region for treatment of work-pieces placed at a work-piece treatment station within the low pressure region. Multiple work-piece isolation load locks transfer work-pieces, one or two at a time, from a higher pressure region to the lower pressure for treatment and back to said higher pressure subsequent to said treatment. A first robot transfers work-pieces within the low pressure region from the load locks to a treatment station within the low pressure region. Multiple other robots positioned outside the low pressure region transfers work-pieces to and from the multiple work-piece isolation load locks from a source of said work-pieces prior to treatment and to a destination of said work-pieces after said treatment.

摘要翻译： 一种用于处理亚大气压下的工件的工具的转移系统，例如用于植入硅晶片的离子注入机。 外壳限定了用于处理放置在低压区域内的工件处理站的工件的低压区域。 多个工件隔离负载锁将工件一次一个或两个从较高压力区域传递到较低压力以进行处理，并在所述处理之后返回到所述较高压力。 第一机器人将低压区域内的工件从负载锁转移到低压区域内的处理站。 定位在低压区域之外的多个其它机器人在处理之前将工件从多个工件隔离负载锁转移到所述工件的源并在所述处理之后传送到所述工件的目的地。

公开(公告)号：US07344352B2

公开(公告)日：2008-03-18

申请号：US11219281

申请日：2005-09-02

申请人： Richard Gueler

发明人： Richard Gueler

IPC分类号： B66C1/00

CPC分类号： H01L21/68707

摘要： A workpiece transfer assembly for manipulating one or more workpieces, such as semiconductor wafers includes a plurality of coacting arms that include one or more arcuate portions corresponding to an outer diameter of a workpiece. The arcuate portion has a workpiece engaging surface adapted to engage an outer edge of the workpiece. At least one of the coacting arms includes a flexure assembly that allows deformation of the workpiece engaging surface in a direction away from the workpiece in response to pressure on the outer edge of the workpiece from the workpiece engaging surface.

摘要翻译： 用于操作一个或多个工件（例如半导体晶片）的工件传送组件包括多个共同作用臂，其包括对应于工件的外径的一个或多个弓形部分。 弓形部分具有适于接合工件的外边缘的工件接合表面。 共同作用臂中的至少一个包括挠曲组件，其允许工件接合表面在远离工件的方向上响应于工件的外边缘上的压力从工件接合表面变形。

公开(公告)号：US20050039685A1

公开(公告)日：2005-02-24

申请号：US10646249

申请日：2003-08-22

申请人： Ari Eiriksson ,  Richard Gueler ,  Michel Pharand

发明人： Ari Eiriksson ,  Richard Gueler ,  Michel Pharand

IPC分类号： H01L21/683 ,  C23C16/00

CPC分类号： H01L21/6838

摘要： A workpiece is supported on a gas cushion to reduce mechanical stresses on the workpiece during processing. A plenum having a workpiece support flange for receiving the workpiece is connected to a gas supply. When gas flows into the plenum and pressure increases sufficiently to lift the workpiece, the workpiece is lifted and the gas flows out of the plenum between the flange and the workpiece edge. The workpiece is thus supported above the flange by the gas during processing.

摘要翻译： 工件被支撑在气垫上，以减少加工过程中工件的机械应力。 具有用于接收工件的工件支撑凸缘的气室连接到气体供应。 当气体流入增压室并且压力增加到足以提升工件时，工件被提升，并且气体在凸缘和工件边缘之间流出增压室。 因此，工件在加工过程中被气体支撑在法兰上方。

公开(公告)号：US20070065267A1

公开(公告)日：2007-03-22

申请号：US11219281

申请日：2005-09-02

申请人： Richard Gueler

发明人： Richard Gueler

IPC分类号： B65G1/133

CPC分类号： H01L21/68707

摘要： A workpiece transfer assembly for manipulating one or more workpieces, such as semiconductor wafers includes a plurality of coacting arms that include one or more arcuate portions corresponding to an outer diameter of a workpiece. The arcuate portion has a workpiece engaging surface adapted to engage an outer edge of the workpiece. At least one of the coacting arms includes a flexure assembly that allows deformation of the workpiece engaging surface in a direction away from the workpiece in response to pressure on the outer edge of the workpiece from the workpiece engaging surface.

摘要翻译： 用于操作一个或多个工件（例如半导体晶片）的工件传送组件包括多个共同作用臂，其包括对应于工件的外径的一个或多个弓形部分。 弓形部分具有适于接合工件的外边缘的工件接合表面。 共同作用臂中的至少一个包括挠曲组件，其允许工件接合表面在远离工件的方向上响应于工件的外边缘上的压力从工件接合表面变形。

公开(公告)号：US07070661B2

公开(公告)日：2006-07-04

申请号：US10646249

申请日：2003-08-22

申请人： Ari Eiriksson ,  Richard Gueler ,  Michel Pharand

发明人： Ari Eiriksson ,  Richard Gueler ,  Michel Pharand

IPC分类号： H01L21/00 ,  C23C16/00

CPC分类号： H01L21/6838

摘要： A workpiece is supported on a gas cushion to reduce mechanical stresses on the workpiece during processing. A plenum having a workpiece support flange for receiving the workpiece is connected to a gas supply. When gas flows into the plenum and pressure increases sufficiently to lift the workpiece, the workpiece is lifted and the gas flows out of the plenum between the flange and the workpiece edge. The workpiece is thus supported above the flange by the gas during processing.

摘要翻译： 工件被支撑在气垫上，以减少加工过程中工件的机械应力。 具有用于接收工件的工件支撑凸缘的气室连接到气体供应。 当气体流入增压室并且压力增加到足以提升工件时，工件被提升，并且气体在凸缘和工件边缘之间流出增压室。 因此，工件在加工过程中被气体支撑在法兰上方。

公开(公告)号：US07026581B2

公开(公告)日：2006-04-11

申请号：US10646228

申请日：2003-08-22

申请人： Michel Pharand ,  Thomas L. Durant ,  Ari Eiriksson ,  Richard Gueler

发明人： Michel Pharand ,  Thomas L. Durant ,  Ari Eiriksson ,  Richard Gueler

IPC分类号： F27B5/14 ,  F27D11/00

CPC分类号： H01L21/67126 ,  H01L21/324 ,  H01L21/67748 ,  H01L21/67751

摘要： A wafer support position control mechanism selectively positions a semiconductor wafer along an axis of excursion within a process chamber. An elevator tube protrudes through an orifice in the chamber surface and is connected at a first distal end to the wafer support. A compliant, dynamic seal within the orifice engages the elevator tube to form a gas curtain within a gap between the seal and the elevator tube to seal the process chamber. A moveable carriage is connected to the elevator tube at a second distal end for moving the wafer support along the axis of excursion. Rigid mechanical structure couples the second distal end of the elevator tube to the moveable carriage.

摘要翻译： 晶片支撑位置控制机构选择性地将半导体晶片沿着处理室内的偏移轴定位。 电梯管通过腔室表面中的孔突出，并且在第一远端处连接到晶片支撑件。 孔内的柔性动态密封件接合电梯管，以在密封件和电梯管之间的间隙内形成气帘，以密封处理室。 可移动的托架在第二远端处连接到电梯管，用于沿着偏移轴线移动晶片支撑件。 刚性机械结构将电梯管的第二远端连接到可移动的托架上。

公开(公告)号：US20050042807A1

公开(公告)日：2005-02-24

申请号：US10646228

申请日：2003-08-22

申请人： Michel Pharand ,  Thomas Durant ,  Ari Eiriksson ,  Richard Gueler

发明人： Michel Pharand ,  Thomas Durant ,  Ari Eiriksson ,  Richard Gueler

IPC分类号： H01L21/00 ,  H01L21/324 ,  H01L21/677 ,  H01L21/335

CPC分类号： H01L21/67126 ,  H01L21/324 ,  H01L21/67748 ,  H01L21/67751

摘要： A wafer support position control mechanism selectively positions a semiconductor wafer along an axis of excursion within a process chamber. An elevator tube protrudes through an orifice in the chamber surface and is connected at a first distal end to the wafer support. A compliant, dynamic seal within the orifice engages the elevator tube to form a gas curtain within a gap between the seal and the elevator tube to seal the process chamber. A moveable carriage is connected to the elevator tube at a second distal end for moving the wafer support along the axis of excursion. Rigid mechanical structure couples the second distal end of the elevator tube to the moveable carriage.

摘要翻译： 晶片支撑位置控制机构选择性地将半导体晶片沿着处理室内的偏移轴定位。 电梯管通过腔室表面中的孔突出，并且在第一远端处连接到晶片支撑件。 孔内的柔性动态密封件接合电梯管，以在密封件和电梯管之间的间隙内形成气帘，以密封处理室。 可移动的托架在第二远端处连接到电梯管，用于沿着偏移轴线移动晶片支撑件。 刚性机械结构将电梯管的第二远端连接到可移动的托架上。