Diffractive light modulator
    2.
    发明授权
    Diffractive light modulator 失效
    衍射光调制器

    公开(公告)号:US07271958B2

    公开(公告)日:2007-09-18

    申请号:US11347636

    申请日:2006-02-02

    IPC分类号: G02B5/18

    CPC分类号: G02B26/0808

    摘要: The present invention relates to diffractive light modulators and, more particularly, to a diffractive light modulator in which the lower support for mirrors is configured in consideration of the internal intrinsic stress of a mirror, thus improving the flatness of a mirror surface and enhancing the optical efficiency of the light modulator.

    摘要翻译: 本发明涉及衍射光调制器,更具体地说,涉及一种衍射光调制器,其中考虑到反射镜的内部固有应力来构造反射镜的下支撑件,从而提高了镜面的平坦度并增强了光学 光调制器的效率。

    Microelectromechanical system (MEMS) variable optical attenuator
    4.
    发明授权
    Microelectromechanical system (MEMS) variable optical attenuator 失效
    微机电系统(MEMS)可变光衰减器

    公开(公告)号:US06901204B2

    公开(公告)日:2005-05-31

    申请号:US10610756

    申请日:2003-07-02

    摘要: Disclosed is an MEMS variable optical attenuator comprising a substrate having a planar surface, optical fibers having an optical signal transmitting end and an optical signal receiving end, respectively, coaxially arranged on the substrate, a micro-electric actuator arranged on the substrate for providing a driving stroke along a direction perpendicular to an optical axis of the optical beam, at least one lever structure arranged on the substrate for receiving the driving stroke of the micro-electric actuator at a first end thereof and transferring an amplified displacement distance to an optical shutter through a second end thereof, an optical shutter arranged on the substrate and connected to the second end of the lever structure so as to be moved by the amplified displacement distance, thereby being displaced to an attenuation position of the optical beam.

    摘要翻译: 公开了一种MEMS可变光衰减器,其包括具有平坦表面的基板,具有光信号发射端的光纤和分别同轴地布置在基板上的光信号接收端,布置在基板上的微电致动器,用于提供 沿着与所述光束的光轴垂直的方向驱动行程;至少一个杠杆结构,布置在所述基板上,用于在其第一端处接收所述微型致动器的驱动行程,并将放大的位移距离传送到光学快门 通过其第二端,设置在基板上并连接到杠杆结构的第二端的光闸,以便被放大的位移距离移动,从而被移位到光束的衰减位置。

    Optical switch
    5.
    发明授权
    Optical switch 失效
    光开关

    公开(公告)号:US06552839B1

    公开(公告)日:2003-04-22

    申请号:US10104692

    申请日:2002-03-21

    IPC分类号: G02B2600

    摘要: Disclosed herein is an optical switch. The optical switch includes an electrostatic actuator and a substrate. The electrostatic actuator includes an electrostatic actuator, the electrostatic actuator comprising, a reciprocating mass located in the center of the electrostatic actuator, first rotating axes located symmetrically at the left and right sides of the reciprocating mass, first rotating masses rotatably connected to the first rotating axes, first rotating springs for supporting the first rotating masses, linear springs connected to the first rotating masses, second rotating masses connected to the linear springs, second rotating springs for supporting the second rotating masses, second rotating axes connected to the second rotating masses, structural anchors at the side ends of the actuator, drive electrodes, and a micro mirror movable by the same displacement as the reciprocating mass.

    摘要翻译: 这里公开了一种光开关。 光开关包括静电致动器和基板。 所述静电致动器包括静电致动器,所述静电致动器包括位于所述静电致动器的中心的往复运动物质,位于所述往复运动质量块的左右两侧的第一旋转轴,所述第一旋转体可旋转地连接到所述第一旋转 轴,用于支撑第一旋转块的第一旋转弹簧,连接到第一旋转块的线性弹簧,连接到线性弹簧的第二旋转块,用于支撑第二旋转块的第二旋转弹簧,连接到第二旋转块的第二旋转轴, 在致动器的侧端处的结构锚固件,驱动电极和可与往复运动块相同位移的微反射镜。

    Dicing method for micro electro mechnical system chip
    6.
    发明授权
    Dicing method for micro electro mechnical system chip 失效
    微机电系统芯片的切割方法

    公开(公告)号:US06833288B2

    公开(公告)日:2004-12-21

    申请号:US10412465

    申请日:2003-04-11

    IPC分类号: H01L2144

    摘要: A dicing method for a micro electro mechanical system chip, in which a high yield and productivity of chips can be accomplished, resulting from preventing damage to microstructures during a dicing process by using a protective mask. The dicing method for a micro electro mechanical system chip, comprising the steps of designing a grid line and wafer pattern on a chip-scale on the non-adhesive surface of a transparent tape as a protective mask (first step); sticking microstructure-protecting membranes on the adhesive surface of the transparent tape (second step); putting the transparent tape on the whole surface of a wafer in a state wherein the grid line designed on the non-adhesive surface of the transparent tape is matched to the dicing line of the wafer (third step); cutting the transparent tape to a size larger than the wafer, mounting the wafer on a guide ring and dicing the wafer (fourth step); and separating the transparent tape from diced chips (fifth step).

    摘要翻译: 一种用于微机电系统芯片的切割方法,其中可以通过使用保护掩模在切割过程中防止对微结构的损害而实现高产量和高生产率的芯片。 一种微机电系统芯片的切割方法,其特征在于,包括如下步骤:在作为保护罩的透明胶带的非粘合表面上以芯片尺度设计网格线和晶片图案(第一步骤)。 在透明胶带的粘合剂表面上粘附微结构保护膜(第二步); 将透明带放置在晶片的整个表面上,其中设计在透明带的非粘合表面上的栅格线与晶片的切割线相匹配(第三步)。 将透明胶带切割成比晶片大的尺寸,将晶片安装在引导环上并切割晶片(第四步骤); 并将透明胶带分离成切片(第五步)。