公开(公告)号：US20070193907A1

公开(公告)日：2007-08-23

申请号：US11699749

申请日：2007-01-30

申请人： Sanjiv Bhatt ,  Shawn Eggum

发明人： Sanjiv Bhatt ,  Shawn Eggum

IPC分类号： B65D85/90 ,  B65D85/00 ,  B65D85/48

CPC分类号： B29C45/0003 ,  B29C45/16 ,  B29K2995/0087 ,  B29L2031/16 ,  G03F7/70691 ,  G03F7/708 ,  H01L21/67313 ,  H01L21/6732 ,  H01L21/67326 ,  H01L21/67366 ,  H01L21/67373 ,  H01L21/67383

摘要： A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

公开(公告)号：US20050167312A1

公开(公告)日：2005-08-04

申请号：US11092528

申请日：2005-03-29

申请人： Sanjiv Bhatt ,  Shawn Eggum

发明人： Sanjiv Bhatt ,  Shawn Eggum

IPC分类号： B29C45/14 ,  B29C45/16 ,  B29K69/00 ,  B29K73/00 ,  B29K79/00 ,  G03F7/20 ,  H01L21/673 ,  B65D85/30

CPC分类号： B29C45/0003 ,  B29C45/16 ,  B29K2995/0087 ,  B29L2031/16 ,  G03F7/70691 ,  G03F7/708 ,  H01L21/67313 ,  H01L21/6732 ,  H01L21/67326 ,  H01L21/67366 ,  H01L21/67373 ,  H01L21/67383

摘要： A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

公开(公告)号：US20050236110A1

公开(公告)日：2005-10-27

申请号：US10496754

申请日：2002-11-26

申请人： Sanjiv Bhatt ,  Shawn Eggum

发明人： Sanjiv Bhatt ,  Shawn Eggum

IPC分类号： B65D85/86 ,  B29C45/14 ,  B29K101/12 ,  B29L9/00 ,  B65H1/28 ,  H01L21/673 ,  C23F1/00

CPC分类号： H01L21/67323 ,  H01L21/6733 ,  H01L21/67346 ,  H01L21/67366

摘要： The present invention relates generally to a system and method for including a thin protective containment thermopolymer film (10), such as PEEK, in the molding process for handlers, transporters, carriers, trays and like devices utilized in the semiconductor processing industry. The thermoplastic film (10) of predetermined size and shape is selectively placed along a shaping surface (26) in a mold cavity (22) for alignment with a desired target surface of a moldable material. The film is permanently adhered to the moldable material. As a result, a compatible polymer film (10) can be selectively bonded only to those target surfaces where performance characteristics such as abrasion resistance, heat resistance, chemical resistance, outgassing containment, rigidity enhancement, hardness, creep reduction, fluid absorption containment, and the like is needed.

摘要翻译： 本发明一般涉及一种用于在半导体加工业中使用的处理机，运输商，载体，托盘等装置的成型工艺中包括薄保护性容纳热聚合物膜（例如PEEK）的系统和方法。 具有预定尺寸和形状的热塑性薄膜（10）选择性地沿着模腔（22）中的成形表面（26）放置，以与可模制材料的所需目标表面对准。 该膜永久地粘附在可模制材料上。 结果，可以将兼容的聚合物膜（10）仅选择性地结合到那些目标表面上，其中性能特征如耐磨性，耐热性，耐化学性，除气容纳性，刚度增强，硬度，蠕变减少，液体吸收抑制和 需要这样的。

公开(公告)号：US20050245693A1

公开(公告)日：2005-11-03

申请号：US10838125

申请日：2004-05-03

申请人： Sanjiv Bhatt

发明人： Sanjiv Bhatt

IPC分类号： C08C19/12 ,  C08C19/16 ,  C08C19/18 ,  C08F8/20 ,  C08F8/24 ,  C08F12/20 ,  C08L23/28 ,  C08L65/00

CPC分类号： C08G85/004 ,  C08F8/20 ,  C08F12/08

摘要： Fluorinated polymers of interest have aromatic groups in their repeat units and at least about 25% of available aromatic ring positions fluorinated. The aromatic rings can be along the polymer backbone and/or along the side chains of the polymer. In particular, for polymers with the aromatic groups along the polymer backbone generally at least about 55 percent of the aromatic ring positions are fluorinated. Approaches for the fluorination of aromatic polymers can involve a polymer melt that is contacted with an appropriate fluorination reagent. In other approaches, the fluorination is performed in a polymer solution. The fluorination reactions can be performed in a batch operation or a continuous operation.

摘要翻译： 感兴趣的氟化聚合物在其重复单元中具有芳族基团，并且氟化的至少约25％的可用芳环位置。 芳环可以沿着聚合物主链和/或沿着聚合物的侧链。 特别地，对于具有沿着聚合物骨架的芳族基团的聚合物，通常至少约55％的芳族环位置被氟化。 芳族聚合物的氟化方法可涉及与合适的氟化试剂接触的聚合物熔体。 在其它方法中，氟化在聚合物溶液中进行。 氟化反应可以在间歇操作或连续操作中进行。

公开(公告)号：US20050081917A1

公开(公告)日：2005-04-21

申请号：US10496699

申请日：2002-11-26

申请人： Sanjiv Bhatt ,  Shawn Eggum

发明人： Sanjiv Bhatt ,  Shawn Eggum

IPC分类号： B29C45/14 ,  H01L21/304 ,  H01L21/306 ,  F16K25/00

CPC分类号： B29C45/14778 ,  B29C2045/14901 ,  B29K2071/00 ,  B29K2715/006 ,  B29K2995/0087 ,  B29L2031/7506 ,  Y10T137/7036

摘要： The present invention relates generally to a system and method for including a thin protective containment polymer film (100), such as Peek in the molding process for fluid processing devices utilized in the semiconductor processing industry. The thermoplastic film of predetermined size and shape is selectively placed along a shaping surface (110) in a mold cavity (106) for alignment with a desired target surface of a molded material. The molding processes causes a surface of the film (100) to bond to a contact surface of the moldable material such that the film (100) is permanently adhered to the moldable material. As a result, a comparable polymer film can be selectively bonded only to those target surfaces where performance characteristics such as abrasion resistance, heat resistance, chemical resistance, outgassing prevention, rigidity enhancement, fluid absorption prevention, ultraviolet resistance, friction reduction and the like is needed.

摘要翻译： 本发明一般涉及一种用于在用于半导体加工业的流体处理装置的成型工艺中包括薄保护性容纳聚合物膜（100），例如Peek的系统和方法。 具有预定尺寸和形状的热塑性膜选择性地沿着模具腔（106）中的成形表面（110）放置，以与模制材料的期望目标表面对准。 成型工艺使得薄膜（100）的表面粘合到可模制材料的接触表面，使得薄膜（100）永久地粘附到可模制材料上。 结果，可以将可比较的聚合物膜选择性地结合到那些其耐磨性，耐热性，耐化学性，防除气，防止刚性，防止流体吸收，耐紫外线，摩擦减少等性能特性的目标表面 需要的

公开(公告)号：US20050056601A1

公开(公告)日：2005-03-17

申请号：US10496679

申请日：2002-11-26

申请人： Sanjiv Bhatt ,  Shawn Eggum

发明人： Sanjiv Bhatt ,  Shawn Eggum

IPC分类号： B65D21/02 ,  A47G19/08 ,  B65D1/00 ,  B65D1/24 ,  B65D25/04 ,  B65D25/10 ,  B65D85/57 ,  B65D85/86 ,  H01L21/673

CPC分类号： H01L21/67323 ,  H01L21/6733 ,  H01L21/67366 ,  H01L21/67396

摘要： The present invention relates generally to a system and method for including a thin conductive polymer film, such carbon-filled PEEK, in the molding process for handlers, transporters, carriers, trays and like devices utilized in the semiconductor processing industry. The conductive film of predetermined size and shape is selectively placed along a shaping surface in a mold cavity for alignment with a desired target surface of a moldable material. The molding process causes a surface of the film to bond to a contact surface of the moldable material such that the film is permanently adhered to the moldable material. As a result, a compatible conductive polymer can be selectively bonded only to those target surfaces where ESD is needed.

摘要翻译： 本发明一般涉及一种用于在半导体加工工业中使用的处理机，运输机，载体，托盘等器件的成型工艺中包含薄导电聚合物膜，这种填充碳的PEEK的系统和方法。 预定尺寸和形状的导电膜选择性地沿着模腔中的成形表面放置，以与可模制材料的期望目标表面对准。 成型工艺使得膜的表面粘合到可模制材料的接触表面，使得膜永久地粘附到可模制材料上。 结果，可以将兼容的导电聚合物选择性地结合到需要ESD的那些目标表面上。

公开(公告)号：US20050242471A1

公开(公告)日：2005-11-03

申请号：US10836634

申请日：2004-04-30

申请人： Sanjiv Bhatt ,  Charles Extrand

发明人： Sanjiv Bhatt ,  Charles Extrand

IPC分类号： B23K26/06 ,  B23K26/08 ,  B23K26/36 ,  H01S3/00

CPC分类号： B23K26/0846 ,  B23K26/066

摘要： Improved processes for forming shaped articles comprise extruding a composite comprising a polymer and at least one additive, and shaping the composite to form an article having a desired shape. Generally, the extruding and shaping steps are performed on a single process line, which allows the shaped articles to be produced in a continuous process. Due to the continuous process design, shaped articles made by the improved process can be produced in large quantities at a low cost per article. In some embodiments, a shaping station can be employed to shape the extruded composite. The shaping station can comprise a laser machining apparatus, a hot stamping apparatus, rollers having a predetermined pattern, or combinations thereof.

摘要翻译： 用于形成成型制品的改进方法包括挤出包含聚合物和至少一种添加剂的复合材料，并且使复合材料成形以形成具有所需形状的制品。 通常，挤出和成形步骤在单个工艺线上进行，这允许成形制品以连续工艺制造。 由于连续的工艺设计，通过改进的方法制成的成型制品可以以低成本制造大量生产。 在一些实施方案中，可以使用成形工位来成型挤出的复合材料。 成型台可以包括激光加工装置，热冲压装置，具有预定图案的辊或其组合。

公开(公告)号：US20050186378A1

公开(公告)日：2005-08-25

申请号：US10784322

申请日：2004-02-23

申请人： Sanjiv Bhatt

发明人： Sanjiv Bhatt

IPC分类号： B65D1/00 ,  C08K9/08 ,  H01L51/00 ,  H01M4/96 ,  H01M8/02

CPC分类号： B82Y30/00 ,  B82Y10/00 ,  C08K9/08 ,  C08K2201/011 ,  H01L51/0034 ,  H01L51/0035 ,  H01L51/0048 ,  H01L51/0052 ,  H01M4/96 ,  H01M8/0213 ,  H01M8/0221 ,  H01M8/0226 ,  Y10T428/139

摘要： Improved compositions comprise a polymer and carbon fibers, such as nanotubes. In some embodiments, the carbon fibers, e.g., nanotubes, can be mechanically blended or incorporated into the polymer, while in some embodiments carbon nanotubes also may be covalently bonded to the polymer to form corresponding covalent materials. In particular, the polymer can be covalently bonded to the side walls of the carbon nanotubes to form a composite with particularly desirable mechanical properties. Specifically, the bonding of the polymer to the nanotube sidewall can provide desirable mechanical properties of the composite due to the orientation relative to other types of association between the nanotubes and the polymer. The processing of the nanotubes can be facilitated by the dispersion of the nanotubes in an aqueous solution comprising a hydrophylic polymer, such as ethyl vinyl acetate. A dispersion of nanotubes can be combined with a polymer in an extrusion process to blend the materials under high shear, such as in an extruder. In general, various articles can be formed that take advantage of the properties of the composite materials incorporating a polymer and carbon fibers, such as carbon nanotubes.

摘要翻译： 改进的组合物包括聚合物和碳纤维，例如纳米管。 在一些实施方案中，碳纤维例如纳米管可以机械共混或掺入聚合物中，而在一些实施方案中，碳纳米管也可以共价键合到聚合物上以形成相应的共价材料。 特别地，聚合物可以共价键合到碳纳米管的侧壁以形成具有特别期望的机械性能的复合材料。 具体地说，由于相对于纳米管和聚合物之间的其它类型的缔合的取向，聚合物与纳米管侧壁的结合可以提供所希望的复合材料的机械性能。 通过纳米管在包含亲水性聚合物如乙酸乙烯酯的水溶液中的分散，可以促进纳米管的加工。 纳米管的分散体可以在挤出过程中与聚合物组合以在高剪切下混合材料，例如在挤出机中。 通常，可以形成利用包含聚合物和碳纤维（例如碳纳米管）的复合材料的性质的各种制品。