摘要:
A method and an apparatus are provided to measure a position of a mark with a less measurement error caused by a variation in a wafer process condition. The mark is illuminated with light and an image of the mark is formed, via an optical system, in a light receiving surface of a sensor. The image of the mark is sensed and image data thereof is acquired by the sensor. Correction data of a fundamental frequency and a high harmonic of the image data is set based on information associated with a shape of the mark, an imaging magnification of the optical system, and an imaging area of the sensor. The image data is corrected using the correction data, and the position of the mark is calculated using the corrected image data.
摘要:
An alignment method is provided in which a substrate including first and second layers is aligned in forming a second pattern in the second layer. The method includes storing first alignment measurement data to be used in alignment performed in forming a first pattern and a second alignment mark in the second layer, the first alignment measurement data obtained by measuring a first alignment mark provided in the first layer; obtaining second alignment measurement data by measuring the second alignment mark through a resist applied over the second layer; obtaining third alignment measurement data by measuring the first alignment mark through the resist; and performing alignment of the substrate in accordance with a first difference between the first and second alignment measurement data, or in accordance with the first difference and a second difference between the first and third alignment measurement data.
摘要:
The present invention provides a position detection apparatus including a first obtaining unit configured to obtain imaging characteristics of an imaging optical system for a plurality of light beams, having different wavelength with each other, of the light having the wavelength width, a second obtaining unit configured to obtain optical images of a target object for the plurality of light beams, a restoration unit configured to restore optical images of the target object for the plurality of light beams by correcting, deterioration in the obtained optical images of the target object attributed to the imaging optical system, based on the obtained imaging characteristics of the imaging optical system, and a generation unit configured to generate an optical image of the target object for light including the plurality of light beams by synthesizing the restored optical images of the target object for the plurality of light beams.
摘要:
A transfer characteristic calculation apparatus for calculating a transfer characteristic of an imaging optical system includes a light source, a generation unit which generates a second signal by converting a first signal obtained by stretching an impulse signal on a space axis into a positive value using a light from the light source, a sensor which obtains an image that is output from the imaging optical system as an output signal when a light intensity distribution is inputted as the second signal, and a calculation unit which calculates the transfer characteristic of the imaging optical system by convolution of a third signal with a fourth signal that is obtained by canceling a bias component of the output signal obtained by the sensor, the third signal being an impulse signal upon convolution with the first signal.
摘要:
An alignment apparatus for aligning a reflective reticle includes a light source for emitting alignment light, an optical alignment mark provided on the reticle, and a reference mark provided on a reticle stage that holds the reticle. A detecting unit detects the alignment light reflected from the alignment mark and the reference mark, and the reticle is aligned on the basis of the result of detection by the detection unit.
摘要:
A reticle stage reference mark 3 of material having high reflectivity to alignment illumination light is provided on a reticle 5, and a chuck mark 8 of material having high reflectivity to the alignment illumination light is provided on a wafer chuck 11. A relative position of the reticle stage reference mark 3 to the chuck mark 8 is detected by using a first position detection optical system 1 and a first illumination optical system 2, and relative alignment is performed between the reticle 5 and a wafer 10.
摘要:
A position detecting method includes the steps of forming an image of a mark on a sensor, performing a first process that processes a raw signal obtained from the sensor with plural parameters, performing a second process that determines an edge of a signal processed by the first process for each parameter, determining a parameter from a result of the second process obtained for each parameter, and calculating a position of the mark based on a determined parameter.
摘要:
An exposure apparatus performs AGA measurement by using a predetermined sample shot group formed on a wafer, and decides an alignment parameter. The exposure apparatus executes wafer alignment processing and exposure processing by using the alignment parameter. The exposure apparatus notifies a central processing unit of AGA measurement results and the alignment parameter. An overlay inspection apparatus measures an actual exposure position on the exposed wafer, and notifies the central processing unit of the measurement result. The central processing unit optimizes alignment processing on the basis of the AGA measurement results, alignment parameter, and actually measured exposure position.
摘要:
An exposure apparatus performs AGA measurement by using a predetermined sample shot group formed on a wafer, and decides an alignment parameter. The exposure apparatus executes wafer alignment processing and exposure processing by using the alignment parameter. The exposure apparatus notifies a central processing unit (4) of AGA measurement results and the alignment parameter. An overlay inspection apparatus measures an actual exposure position on the exposed wafer, and notifies the central processing unit of the measurement result. The central processing unit (4) optimizes alignment processing on the basis of the AGA measurement results, alignment parameter, and actually measured exposure position.
摘要:
An X-ray diagnostic apparatus includes an X-ray tube for irradiating a subject with X-rays, a rectangular planar type X-ray detector formed by arraying a plurality of solid-state detection elements, a supporting mechanism for supporting the X-ray tube and the planar type X-ray detector in arbitrary postures with respect to the subject, and a suspending mechanism for suspending the planar type X-ray detector from the supporting mechanism. The suspending mechanism has a rotating mechanism for rotating the planar type X-ray detector through an arbitrary angle about a central path of the X-rays. When necessary, the planar type X-ray detector is rotated about the central path of the X-rays so as to be very close to the subject. When necessary, the planar type X-ray detector is rotated, so that the longitudinal direction of the subject on the image and the vertical direction of the screen can coincide with each other.