-
公开(公告)号：US20160186352A1
公开(公告)日：2016-06-30
申请号：US13984096
申请日：2012-02-07
CPC分类号： C25D5/18 , C25D11/00 , C25D11/005 , C25D11/02 , C25D11/024 , C25D11/026 , C25D11/04 , C25D11/06 , C25D11/26 , C25D11/30 , C25D11/32 , C25D13/02 , C25D15/00 , C25D21/12 , H01L23/142 , H01L23/3677 , H01L23/3735 , H01L2224/48227 , H01L2224/49109 , H01L2924/01327 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H05K1/021 , H05K1/053 , H05K1/115 , H05K1/18 , H05K2201/0116 , H05K2203/0315 , H05K2203/1147 , Y10T428/1317 , Y10T428/24917 , Y10T428/249969 , H01L2924/00
摘要： A method of forming a non-metallic coating on a metallic substrate involves the steps of positioning the metallic substrate in an electrolysis chamber and applying a sequence of voltage pulses of alternating polarity to electrically bias the substrate with respect to an electrode. Positive voltage pulses anodically bias the substrate with respect to the electrode and negative voltage pulses cathodically bias the substrate with respect to the electrode. The amplitude of the positive voltage pulses is potentiostatically controlled, wheras the amplitude of the negative voltage pulses is galvanostatically controlled.
摘要翻译： 在金属基材上形成非金属涂层的方法包括以下步骤：将金属基材定位在电解室中，并且施加一系列交替极性的电压脉冲以相对于电极使基板电偏置。 正电压脉冲相对于电极阳极偏置衬底，负电压脉冲相对于电极阴极偏置衬底。 正电压脉冲的幅度被电位控制，从而恒定地控制负电压脉冲的幅度。
-
公开(公告)号：US09551082B2
公开(公告)日：2017-01-24
申请号：US13984126
申请日：2012-02-07
IPC分类号： H05K1/18 , C25D5/18 , C25D11/02 , H05K1/11 , H05K1/02 , C25D11/00 , C25D11/04 , C25D11/26 , C25D11/30 , C25D11/32 , C25D13/02 , C25D21/12 , H01L23/14 , H05K1/05 , C25D11/06 , C25D15/00 , H01L23/373 , H01L23/367
CPC分类号： C25D5/18 , C25D11/00 , C25D11/005 , C25D11/02 , C25D11/024 , C25D11/026 , C25D11/04 , C25D11/06 , C25D11/26 , C25D11/30 , C25D11/32 , C25D13/02 , C25D15/00 , C25D21/12 , H01L23/142 , H01L23/3677 , H01L23/3735 , H01L2224/48227 , H01L2224/49109 , H01L2924/01327 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H05K1/021 , H05K1/053 , H05K1/115 , H05K1/18 , H05K2201/0116 , H05K2203/0315 , H05K2203/1147 , Y10T428/1317 , Y10T428/24917 , Y10T428/249969 , H01L2924/00
摘要： An insulated metal substrate (IMS) for supporting a device comprises a metallic substrate having a ceramic coating formed at least in part by oxidation of a portion of the surface of the metallic substrate. The ceramic coating has a dielectric strength of greater than 50 KV mm−1 and a thermal conductivity of greater than 5 Wm−1K−1.
摘要翻译： 用于支撑器件的绝缘金属衬底（IMS）包括具有至少部分地通过金属衬底的表面的一部分的氧化而形成的陶瓷涂层的金属衬底。 陶瓷涂层的介电强度大于50KV-1mm，导热率大于5Wm-1K-1。
-
公开(公告)号：US20140293554A1
公开(公告)日：2014-10-02
申请号：US13984126
申请日：2012-02-07
CPC分类号： C25D5/18 , C25D11/00 , C25D11/005 , C25D11/02 , C25D11/024 , C25D11/026 , C25D11/04 , C25D11/06 , C25D11/26 , C25D11/30 , C25D11/32 , C25D13/02 , C25D15/00 , C25D21/12 , H01L23/142 , H01L23/3677 , H01L23/3735 , H01L2224/48227 , H01L2224/49109 , H01L2924/01327 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H05K1/021 , H05K1/053 , H05K1/115 , H05K1/18 , H05K2201/0116 , H05K2203/0315 , H05K2203/1147 , Y10T428/1317 , Y10T428/24917 , Y10T428/249969 , H01L2924/00
摘要： An insulated metal substrate (IMS) for supporting a device comprises a metallic substrate having a ceramic coating formed at least in part by oxidation of a portion of the surface of the metallic substrate. The ceramic coating has a dielectric strength of greater than 50 KV mm−1 and a thermal conductivity of greater than 5 Wm−1K−1.
摘要翻译： 用于支撑器件的绝缘金属衬底（IMS）包括具有至少部分地通过金属衬底的表面的一部分的氧化而形成的陶瓷涂层的金属衬底。 陶瓷涂层的介电强度大于50KV-1mm，导热率大于5Wm-1K-1。
-
公开(公告)号：US09677187B2
公开(公告)日：2017-06-13
申请号：US13984096
申请日：2012-02-07
IPC分类号： C25D11/02 , C25D5/18 , C25D11/00 , C25D11/04 , C25D11/26 , C25D11/30 , C25D11/32 , C25D13/02 , C25D21/12 , H01L23/14 , H05K1/05 , C25D11/06 , C25D15/00 , H05K1/02 , H05K1/11 , H05K1/18 , H01L23/373 , H01L23/367
CPC分类号： C25D5/18 , C25D11/00 , C25D11/005 , C25D11/02 , C25D11/024 , C25D11/026 , C25D11/04 , C25D11/06 , C25D11/26 , C25D11/30 , C25D11/32 , C25D13/02 , C25D15/00 , C25D21/12 , H01L23/142 , H01L23/3677 , H01L23/3735 , H01L2224/48227 , H01L2224/49109 , H01L2924/01327 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H05K1/021 , H05K1/053 , H05K1/115 , H05K1/18 , H05K2201/0116 , H05K2203/0315 , H05K2203/1147 , Y10T428/1317 , Y10T428/24917 , Y10T428/249969 , H01L2924/00
摘要： A method of forming a non-metallic coating on a metallic substrate involves the steps of positioning the metallic substrate in an electrolysis chamber and applying a sequence of voltage pulses of alternating polarity to electrically bias the substrate with respect to an electrode. Positive voltage pulses anodically bias the substrate with respect to the electrode and negative voltage pulses cathodically bias the substrate with respect to the electrode. The amplitude of the positive voltage pulses is potentiostatically controlled, whereas the amplitude of the negative voltage pulses is galvanostatically controlled.
-
-
-
搜索结果
4 条记录 (耗时 0.011 秒)
