摘要:
A method for performing a convergence calculation using a projective transformation between images captured by two cameras to observe a flat part of an object in the images, wherein a computational load is reduced while securing a convergence property of the convergence calculation. Initial values (n0(i), d0(i)) are set to values satisfying a limiting condition that should be satisfied by the initial values (n0(i), d0(i)), where the limiting condition is that a plane πa(i) defined by the initial values (n0(i), d0(i)) of given types of parameters (n(i), d(i)) of a projective transformation matrix in the convergence calculation is inclined with respect to an actual plane including the flat part of the object to be observed.
摘要:
A robot capable of performing appropriate movement control while reducing arithmetic processing for recognizing the shape of a floor. The robot sets a predetermined landing position of steps of the legs on a present assumed floor, which is a floor represented by floor shape information used for a current motion control of the robot, during movement of the robot. An image projection area is set, and is projected on each image captured by cameras mounted on the robot for each predetermined landing position in the vicinity of each of the predetermined landing positions. Shape parameters representing the shape of an actual floor partial area are estimated, forming an actual floor whose image is captured in each partial image area, based on the image of the partial image area generated by projecting the set image projection area on the images captured by the cameras for each partial image area.
摘要:
A motion calculation device includes an image-capturing unit configured to capture an image of a range including a plane and outputs the captured image, an extraction unit configured to extract a region of the plane from the image, a detection unit configured to detect feature points and motion vectors of the feature points from a plurality of images captured by the image-capturing unit at a predetermined time interval; and a calculation unit configured to calculate the motion of the host device based on both of an epipolar constraint relating to the feature points and a homography relating to the region.
摘要:
A method for performing a convergence calculation using a projective transformation between images captured by two cameras to observe a flat part of an object in the images, wherein a computational load is reduced while securing a convergence property of the convergence calculation. Initial values (n0(i), d0(i)) are set to values satisfying a limiting condition that should be satisfied by the initial values (n0(i), d0(i)), where the limiting condition is that a plane πa(i) defined by the initial values (n0(i), d0(i)) of given types of parameters (n(i), d(i)) of a projective transformation matrix in the convergence calculation is inclined with respect to an actual plane including the flat part of the object to be observed.
摘要:
Disclosed is a semiconductor device comprising a semiconductor substrate including first and second element-formation regions partitioned by an isolation trench, first and second lower gate insulating films formed on the first and second element-formation regions, first and second floating gates formed on the first and second lower gate insulating films, an isolation insulating film formed at least in the isolation trench and has a depression formed in an upper surface thereof, an upper gate insulating film formed on the first and second floating gates, and a control gate line including an opposed portion opposed to the first and second floating gates, with the upper gate insulating film being interposed, and a portion located inside the depression, the first floating gate including a side surface opposed to the second floating gate and entirely aligns with a side surface included in the first element-formation region and defined by the isolation trench.
摘要:
A semiconductor design/fabrication system which combines a plurality of function blocks and arranges the combined function blocks on a chip, comprising: a function block selector which selects the function blocks to be arranged on the same chip from a plurality of function blocks for each of which a critical area indicating a range where defective products occur due to existence of defects is known; a chip information calculator which calculates a sum of the critical areas on each of the selected function blocks; an yield calculator which calculates an yield based on a calculation result of the chip information calculator and defect occurrence rate information of a chip fabrication line; a cost delivery time information calculator which calculates information relating to fabrication cost and delivery time of the chip based on a calculation result of the yield calculator and fabrication management information relating to cost and fabrication period of the chip fabrication line; and a combination selector which selects a combination of the function blocks constituting the chip based on the information relating to the fabrication cost and the delivery time of the chip calculated by the cost delivery time information calculator.
摘要:
Improved trench forming methods for semiconductor substrates using BSG avoid the problems associated with conventional TEOS hard mask techniques. The methods comprise: (a) providing a semiconductor substrate, (b) applying a conformal layer of borosilicate glass (BSG) on the substrate; (c) forming a patterned photoresist layer over the BSG layer whereby a portion of a layer underlying the photoresist layer is exposed, (d) anisotropically etching through the exposed portion of the underlying layer, through any other layers lying between the photoresist layer and the semiconductor substrate, and into the semiconductor substrate, thereby forming a trench in the semiconductor substrate. Preferably, one or more dielectric layers are present on the substrate surface prior to application of the BSG layer. One or more chemical barrier and/or organic antireflective coating layers may be applied over the BSG layer between the BSG layer and the photoresist layer. The methods are especially useful for forming deep trenches in silicon substrates with pad dielectric layers.
摘要:
Disclosed is a semiconductor device comprising a semiconductor substrate including first and second element-formation regions partitioned by an isolation trench, first and second lower gate insulating films formed on the first and second element-formation regions, first and second floating gates formed on the first and second lower gate insulating films, an isolation insulating film formed at least in the isolation trench and has a depression formed in an upper surface thereof, an upper gate insulating film formed on the first and second floating gates, and a control gate line including an opposed portion opposed to the first and second floating gates, with the upper gate insulating film being interposed, and a portion located inside the depression, the first floating gate including a side surface opposed to the second floating gate and entirely aligns with a side surface included in the first element-formation region and defined by the isolation trench.
摘要:
A manufacturing method of semiconductor devices according to this invention, comprises the step of forming pattern portions containing internal wiring layers on a semiconductor substrate, the step of forming interlayer insulating films on said semiconductor substrate, the step of forming an opening portion in said interlayer insulating films so as to allow the pattern portions and the substrate to appear, and the step of forming a sidewall insulating film on the sidewall of the pattern portions appearing in the opening portion.
摘要:
An apparatus for forming silicon oxide film is disclosed. The apparatus includes a spin coating unit, a carrying unit, and an oxidation unit. The spin coating unit forms a polymer film above a substrate by spin coating a solution including a polymer containing a silazane bond dissolved in an organic solvent. The carrying unit carries the substrate to the oxidation unit without contacting the polymer film. The oxidation unit, when receiving the substrate from the carrying unit, converts the polymer film into the silicon oxide film by either immersing the polymer film with a heated aqueous solution containing hydrogen peroxide, spraying the heated aqueous solution containing hydrogen peroxide over the polymer film, or exposing the polymer film to a reaction gas containing a hydrogen peroxide vapor. The apparatus, by itself, completes the polymer film formation and the polymer-to-silicon oxide film conversion within the apparatus itself.