公开(公告)号：US07907390B2

公开(公告)日：2011-03-15

申请号：US11693316

申请日：2007-03-29

申请人： Shin-ya Nakano ,  Yoh Takano ,  Tetsuro Sawai ,  Ryosuke Usui

发明人： Shin-ya Nakano ,  Yoh Takano ,  Tetsuro Sawai ,  Ryosuke Usui

IPC分类号： H01L23/34 ,  H05K5/00 ,  H05K7/00

CPC分类号： H01L23/142 ,  H01L23/3737 ,  H01L23/467 ,  H01L23/498 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0203 ,  H05K1/0265 ,  H05K3/06 ,  H05K3/202 ,  H05K3/4602 ,  H05K2201/0352 ,  H05K2201/10969 ,  H05K2203/0369 ,  H05K2203/049 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A circuit device includes a metal substrate; and a plurality of circuit elements, mounted on the metal substrate, which electrically connects to the metal substrate. The metal substrate is made of a copper plate of high thermal conductivity. The metal substrate is demarcated into a plurality of sections by insulating films added with a filler for enhancing the thermal conductivity in resin. The circuit elements, which have respective independent operating potentials on a side of the metal substrate of the circuit elements, are respectively provided on separated copper plates.

摘要翻译： 电路装置包括金属基板; 以及多个电路元件，安装在与金属基板电连接的金属基板上。 金属基板由具有高导热性的铜板制成。 通过添加有填充剂的绝缘膜将金属基板划分为多个部分，以提高树脂中的导热性。 在电路元件的金属基板的一侧具有各自的独立工作电位的电路元件分别设置在分离的铜板上。

公开(公告)号：US20070230078A1

公开(公告)日：2007-10-04

申请号：US11693316

申请日：2007-03-29

申请人： Shin-ya Nakano ,  Yoh Takano ,  Tetsuro Sawai ,  Ryosuke Usui

发明人： Shin-ya Nakano ,  Yoh Takano ,  Tetsuro Sawai ,  Ryosuke Usui

IPC分类号： H02H5/04

CPC分类号： H01L23/142 ,  H01L23/3737 ,  H01L23/467 ,  H01L23/498 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0203 ,  H05K1/0265 ,  H05K3/06 ,  H05K3/202 ,  H05K3/4602 ,  H05K2201/0352 ,  H05K2201/10969 ,  H05K2203/0369 ,  H05K2203/049 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A circuit device includes a metal substrate; and a plurality of circuit elements, mounted on the metal substrate, which electrically connects to the metal substrate. The metal substrate is made of a copper plate of high thermal conductivity. The metal substrate is demarcated into a plurality of sections by insulating films added with a filler for enhancing the thermal conductivity in resin. The circuit elements, which have respective independent operating potentials on a side of the metal substrate of the circuit elements, are respectively provided on separated copper plates.

摘要翻译： 电路装置包括金属基板; 以及多个电路元件，安装在与金属基板电连接的金属基板上。 金属基板由具有高导热性的铜板制成。 通过添加有填充剂的绝缘膜将金属基板划分为多个部分，以提高树脂中的导热性。 在电路元件的金属基板的一侧具有各自的独立工作电位的电路元件分别设置在分离的铜板上。