公开(公告)号：US07264340B2

公开(公告)日：2007-09-04

申请号：US10497348

申请日：2003-01-14

申请人： Takanori Nakano ,  Shogo Matsubara ,  Shintaro Hara ,  Kazuo Nishimura ,  Masaichiro Tatekawa ,  Masakazu Tanahashi ,  Hiroyuki Matsuo

发明人： Takanori Nakano ,  Shogo Matsubara ,  Shintaro Hara ,  Kazuo Nishimura ,  Masaichiro Tatekawa ,  Masakazu Tanahashi ,  Hiroyuki Matsuo

IPC分类号： B41J2/045

CPC分类号： B41J2/14233 ,  B41J2202/03 ,  H01L41/0973

摘要： A piezoelectric actuator is constructed by forming a common electrode 27 of Cr, a piezoelectric layer 29 of Pb(Zr,Ti)O3, a cover layer 31 of BaTiO3, and an individual electrode 33 of Pt in this order into a laminate. The thickness of the piezoelectric layer 29 in the lamination direction (T1) and the thickness of the cover layer 31 in the lamination direction (T2) satisfy the relationship of 0.08≦T2/T1≦1. The relative dielectric constant of the piezoelectric layer 29 (εr1) and the relative dielectric constant of the cover layer 31 (εr2) satisfy the relationship of εr2/εr1≧0.2.

摘要翻译： 压电致动器通过形成Cr的公共电极27，Pb（Zr，Ti）O 3 3的压电层29，BaTiO 3 3的覆盖层31， 和Pt的单个电极33。 压电层29在层叠方向（T 1）上的厚度和覆盖层31的层叠方向（T 2）的厚度满足0.08 <= T 2 / T 1 <= 1的关系。 压电层29的相对介电常数（ε1）和覆盖层31的相对介电常数（ε2）满足ε2 /ε1> 0.2的关系。

公开(公告)号：US07023036B2

公开(公告)日：2006-04-04

申请号：US10261984

申请日：2002-10-01

申请人： Osamu Watanabe ,  Takanori Nakano ,  Kazunari Chikanawa ,  Shogo Matsubara ,  Shintaro Hara ,  Kazuo Nishimura

发明人： Osamu Watanabe ,  Takanori Nakano ,  Kazunari Chikanawa ,  Shogo Matsubara ,  Shintaro Hara ,  Kazuo Nishimura

IPC分类号： H01L29/76

CPC分类号： B41J2/14233 ,  B41J2002/14491 ,  B41J2202/03 ,  H01L41/04 ,  H01L41/0973

摘要： A ferroelectric element is described which has a structure including a common electrode 11, a ferroelectric film 10 formed on the common electrode 11, an individual electrode 3 formed on the ferroelectric film 10, a lead wire 15 for feeding electric power to the individual electrode 3, which is formed on the same plane as of the individual electrode 3, and a protection film 16 entirely covering the exposed parts of the ferroelectric film 10 and the individual electrode 3, and covering the lead wire 15. The protection film 16 is preferably made of a material whose Young's modulus is smaller than that of the ferroelectric film 10, exactly 1/20 or smaller of the Young's modulus of the ferroelectric film 10. Further, the ferroelectric film is formed with the insulation reinforcing film containing at least one of the elements constituting the ferroelectric film.

公开(公告)号：US07048360B2

公开(公告)日：2006-05-23

申请号：US10478567

申请日：2003-02-19

申请人： Isaku Kanno ,  Toshiyuki Matsunaga ,  Takeshi Kamada ,  Shintaro Hara

发明人： Isaku Kanno ,  Toshiyuki Matsunaga ,  Takeshi Kamada ,  Shintaro Hara

IPC分类号： B41J2/45 ,  H01L41/08 ,  C04B35/00

CPC分类号： C23C14/088 ,  B41J2/161 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1645 ,  B41J2/1646 ,  C01G21/00 ,  C01G25/006 ,  C01P2002/34 ,  C01P2006/40 ,  C04B35/491 ,  C04B2235/3213 ,  C04B2235/3227 ,  C04B2235/3296 ,  C04B2235/768 ,  C04B2235/787 ,  C04B2235/79 ,  H01L41/0973 ,  H01L41/187

摘要： In a piezoelectric element comprising a first electrode 2 provided on a substrate 1, a piezoelectric material 3 provided on the first electrode 2 and a second electrode 4 provided on the piezoelectric material 3, the piezoelectric material 3 is configured so as to have a perovskite type crystal structure which is represented by a formula ABO3 and in which the main component for the A site is Pb and the main components for the B site are Zr, Ti and Pb, and configured so that a ratio of Pb atoms to all atoms in the B site is more than 3% and not more than 30%. Namely, the piezoelectric material 3 is formed so as to contain Pb excessively and the excess Pb atoms are activated to be Pb4+ during formation of the piezoelectric material 3 and then introduced into the B site.

摘要翻译： 在包括设置在基板1上的第一电极2，设置在第一电极2上的压电材料3和设置在压电材料3上的第二电极4的压电元件中，压电材料3被构造成具有钙钛矿型 由式ABO 3 3表示的晶体结构，其中A位的主成分为Pb，B位的主要成分为Zr，Ti，Pb，构成为 的Pb原子对B位点中的所有原子大于3％且不超过30％。 即，压电材料3形成为在形成压电材料3期间过量地含有Pb并且过量的Pb原子被激活为Pb 4+，然后引入B位点。

公开(公告)号：US06660409B1

公开(公告)日：2003-12-09

申请号：US09660335

申请日：2000-09-12

申请人： Takahiro Komatsu ,  Akira Gyoutoku ,  Shintaro Hara ,  Takafumi Hamano ,  Hiroshi Nakashima ,  Dawei Gao ,  Katsunori Muraoka ,  Katsuhiko Furukawa

发明人： Takahiro Komatsu ,  Akira Gyoutoku ,  Shintaro Hara ,  Takafumi Hamano ,  Hiroshi Nakashima ,  Dawei Gao ,  Katsunori Muraoka ,  Katsuhiko Furukawa

IPC分类号： H05B3304

CPC分类号： H01L51/5256 ,  H01L51/5253 ,  Y10S428/917

摘要： Electrically functional electronic device including an organic electroluminescence device is protected with a dense protective film, e.g. a silicon oxynitride film, formed on at least one part of the outer surface of the device at a low temperature by ECR plasma sputtering can prevent permeation of moisture, oxygen etc. into the device from the outside.

摘要翻译： 包括有机电致发光器件在内的电子功能电子器件用密集保护膜例如保护。 通过ECR等离子体溅射在低温下在器件的外表面的至少一部分上形成的氮氧化硅膜可以防止水分，氧等从外部渗透到器件中。

公开(公告)号：USD361074S

公开(公告)日：1995-08-08

申请号：US26368

申请日：1994-07-26

申请人： Nobuyuki Takahashi ,  Shintaro Hara

设计人： Nobuyuki Takahashi ,  Shintaro Hara

公开(公告)号：US20120127668A1

公开(公告)日：2012-05-24

申请号：US13376282

申请日：2010-06-22

申请人： Shingo Yamamoto ,  Akio Sumiya ,  Yasuo Matsuda ,  Naoto Inoue ,  Makoto Tami ,  Ryo Sugihara ,  Fumiaki Tanaka ,  Shintaro Hara ,  Shota Akinaga

发明人： Shingo Yamamoto ,  Akio Sumiya ,  Yasuo Matsuda ,  Naoto Inoue ,  Makoto Tami ,  Ryo Sugihara ,  Fumiaki Tanaka ,  Shintaro Hara ,  Shota Akinaga

IPC分类号： H05K7/20

CPC分类号： H05K7/20509 ,  H01L21/565 ,  H01L23/3121 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K7/20 ,  H05K7/20154 ,  H05K7/20254 ,  H05K7/20854 ,  H05K7/20863 ,  H05K7/209

摘要： A power module can prevent damages due to cracking or breakage of an insulating substrate when molding even if a heat plate constituting a power module pre-product is made areally smaller than the insulating substrate, and can also sufficiently satisfy demand for minimization. Specifically, the power module pre-product is sealed by a molding resin layer in a state where externally exposed end portion on one end side in both external connecting terminals and the other surface side of a heat plate are each exposed to the outside. The power module substrate constituting a multilayer substrate body includes an aligning hole, into which an aligning pin is inserted, the pin being included in a lower molding die constituting a molding die with an upper molding die that molds a molding resin layer, so as to position the power module pre-product inside a cavity.

摘要翻译： 即使构成电源模块预制品的加热板小于绝缘基板，功率模块也可以防止由于绝缘基板的开裂或断裂而造成的损坏，并且还可以充分满足最小化的要求。 具体地说，在两个外部连接端子中的一端侧的外露端部和加热板的另一表面侧的外露端部各自露出的状态下，通过模制树脂层密封功率模块预制品。 构成多层基板主体的功率模块基板包括：对准销插入其中的定位孔，该引脚包括在构成模具的下模具中，上模塑模具成型树脂层，以便 将电源模块预产品定位在腔内。

公开(公告)号：US20080024563A1

公开(公告)日：2008-01-31

申请号：US11781530

申请日：2007-07-23

申请人： Kiyoaki MATSUI ,  Eiji FUJII ,  Shintaro HARA ,  Osamu WATANABE ,  Hisahiro TANAKA

发明人： Kiyoaki MATSUI ,  Eiji FUJII ,  Shintaro HARA ,  Osamu WATANABE ,  Hisahiro TANAKA

IPC分类号： B41J2/045 ,  H02N2/00

CPC分类号： B41J2/14233 ,  B41J2202/03 ,  H01L41/0805 ,  H01L41/0973 ,  H01L41/316

摘要： A piezoelectric body (piezoelectric layer 14) is configured to include a first piezoelectric layer 14a, a second piezoelectric layer 14b, and a third piezoelectric layer 14c. A piezoelectric constant of each of the first and third piezoelectric layer 14a and 14c is set to be smaller than that of the second piezoelectric layer 14b. Thus, it is possible to reduce an internal stress generated at an interface between first and second electrode layers 13 and 15 corresponding to the first and third piezoelectric layer 14a and 14c, and generation of a crack caused by high voltage application or driving performed for a long time is expected to be greatly reduced.

摘要翻译： 压电体（压电层14）被构造成包括第一压电层14a，第二压电层14b和第三压电层14c。 第一和第三压电层14a和14c中的每一个的压电常数被设定为小于第二压电层14b的压电常数。 因此，可以减少在与第一和第三压电层14a和14c相对应的第一和第二电极层13和15之间的界面处产生的内应力，并且产生由高压施加或驱动引起的裂纹 预计很长一段时间会大大减少。

公开(公告)号：US06195142B1

公开(公告)日：2001-02-27

申请号：US08773732

申请日：1996-12-24

申请人： Akira Gyotoku ,  Hideaki Iwanaga ,  Shintaro Hara ,  Takahiro Komatsu ,  Kei Sakanoue

发明人： Akira Gyotoku ,  Hideaki Iwanaga ,  Shintaro Hara ,  Takahiro Komatsu ,  Kei Sakanoue

IPC分类号： G02F11335

CPC分类号： H01L51/5253 ,  H01L51/0059 ,  H01L51/0081 ,  H01L51/5243 ,  H01L51/5246

摘要： The invention presents an organic electroluminescence element excellent in long-term durability and reliability, a manufacturing method excellent in mass producibility, and a display device using the organic electroluminescence element. Accordingly, to prevent growth of dark spots in the luminous layer by completely shutting off invasion of moisture or oxygen into an anode or an organic thin film layer, a shield material is adhered to an element by using low melting glass or low melting solder. To fuse the low melting glass or low melting solder used for this purposes, laser or ultrasonic wave is used. The surface of the element is sealed with a protective film in a film thickness of 3 microns to 30 microns, or a protective film composed of two-layer laminate film of insulating compound layer andmetal film. According to these inventions, a highly reliable organic electroluminescence element small in changes in the time course suchas growth of dark sports and lowering of luminance is obtained.

摘要翻译： 本发明提出了长期耐久性和可靠性优异的有机电致发光元件，大规模生产性优异的制造方法以及使用有机电致发光元件的显示装置。 因此，为了通过完全切断水分或氧气侵入阳极或有机薄膜层来防止发光层中的黑斑生长，通过使用低熔点玻璃或低熔点焊料将屏蔽材料附着在元件上。 为了熔化用于此目的的低熔点玻璃或低熔点焊料，使用激光或超声波。 元件的表面用3微米至30微米的膜厚度的保护膜或由绝缘化合物层和金属膜的两层层压膜构成的保护膜密封。 根据这些发明，可以获得在黑暗运动的生长和亮度的降低等时间过程变化小的高可靠性的有机电致发光元件。

公开(公告)号：USD310936S

公开(公告)日：1990-10-02

申请号：US165677

申请日：1988-03-08

申请人： Toshiaki Saito ,  Shintaro Hara

设计人： Toshiaki Saito ,  Shintaro Hara

公开(公告)号：US08854820B2

公开(公告)日：2014-10-07

申请号：US13376282

申请日：2010-06-22

申请人： Shingo Yamamoto ,  Akio Sumiya ,  Yasuo Matsuda ,  Naoto Inoue ,  Makoto Tami ,  Ryo Sugihara ,  Fumiaki Tanaka ,  Shintaro Hara ,  Shota Akinaga

发明人： Shingo Yamamoto ,  Akio Sumiya ,  Yasuo Matsuda ,  Naoto Inoue ,  Makoto Tami ,  Ryo Sugihara ,  Fumiaki Tanaka ,  Shintaro Hara ,  Shota Akinaga

IPC分类号： H05K7/20 ,  H01L23/31

CPC分类号： H05K7/20509 ,  H01L21/565 ,  H01L23/3121 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K7/20 ,  H05K7/20154 ,  H05K7/20254 ,  H05K7/20854 ,  H05K7/20863 ,  H05K7/209

摘要： A power module can prevent damages due to cracking or breakage of an insulating substrate when molding even if a heat plate constituting a power module pre-product is made areally smaller than the insulating substrate, and can also sufficiently satisfy demand for minimization. Specifically, the power module pre-product is sealed by a molding resin layer in a state where externally exposed end portion on one end side in both external connecting terminals and the other surface side of a heat plate are each exposed to the outside. The power module substrate constituting a multilayer substrate body includes an aligning hole, into which an aligning pin is inserted, the pin being included in a lower molding die constituting a molding die with an upper molding die that molds a molding resin layer, so as to position the power module pre-product inside a cavity.

摘要翻译： 即使构成电源模块预制品的加热板小于绝缘基板，功率模块也可以防止由于绝缘基板的开裂或断裂而造成的损坏，并且还可以充分满足最小化的要求。 具体地说，在两个外部连接端子中的一端侧的外露端部和加热板的另一表面侧的外露端部各自露出的状态下，通过模制树脂层密封功率模块预制品。 构成多层基板主体的功率模块基板包括：对准销插入其中的定位孔，该引脚包括在构成模具的下模具中，上模塑模具成型树脂层，以便 将电源模块预产品定位在腔内。