公开(公告)号：US07911061B2

公开(公告)日：2011-03-22

申请号：US11767769

申请日：2007-06-25

申请人： Manfred Schneegans ,  Markus Leicht ,  Stefan Wohlert ,  Edmund Riedl

发明人： Manfred Schneegans ,  Markus Leicht ,  Stefan Wohlert ,  Edmund Riedl

IPC分类号： H01L23/48 ,  B23K31/00

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05611 ,  H01L2224/37147 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45611 ,  H01L2224/45647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4847 ,  H01L2224/48475 ,  H01L2224/48611 ,  H01L2224/48711 ,  H01L2224/48799 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85411 ,  H01L2224/85815 ,  H01L2224/85825 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/19042 ,  H01L2924/20751 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48811 ,  H01L2924/013 ,  H01L2924/01006

摘要： A semiconductor device includes a carrier, a chip including a first face having a contact area, where the chip is attached to the carrier such that the contact area faces away from the carrier, a copper connector configured for attachment to the contact area, and a solder material configured to couple the copper connector to the contact area.

摘要翻译： 半导体器件包括载体，芯片，其包括具有接触区域的第一面，其中所述芯片附接到所述载体，使得所述接触区域背离所述载体，所述铜连接器被配置为附接到所述接触区域，以及 焊料材料被配置为将铜连接器耦合到接触区域。