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1.发明申请公开(公告)号：US20070242405A1
公开(公告)日：2007-10-18
申请号：US11783240
申请日：2007-04-06
申请人： Taisuke Ahiko , Sunao Masuda , Masaaki Togashi , Takashi Chiba
发明人： Taisuke Ahiko , Sunao Masuda , Masaaki Togashi , Takashi Chiba
IPC分类号： H02H9/06
CPC分类号： G01R31/028 , H01G4/232 , H01G4/30
摘要： A chip type electronic component for test is provided with an element body, and four or more terminal electrodes placed on the exterior of the element body. The element body has a plurality of laminated insulator layers, and a plurality of internal electrodes arranged to be opposed to each other with the insulator layer in between. Each of the internal electrodes is connected to at least one same terminal electrode out of the four or more terminal electrodes and connected to any one terminal electrode except for the at least one same terminal electrode.
摘要翻译： 用于测试的芯片型电子元件设置有元件主体，以及放置在元件主体外部的四个或更多个端子电极。 元件主体具有多个层压绝缘体层，并且多个内部电极被布置成彼此相对，其间具有绝缘体层。 每个内部电极连接到四个或更多个端子电极中的至少一个相同的端子电极，并且连接到除了至少一个相同的端子电极之外的任何一个端子电极。
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公开(公告)号：US07050288B2
公开(公告)日：2006-05-23
申请号：US11058243
申请日：2005-02-16
申请人： Taisuke Ahiko , Sunao Masuda , Masaaki Togashi
发明人： Taisuke Ahiko , Sunao Masuda , Masaaki Togashi
IPC分类号： H01G4/005
CPC分类号： H01G4/005
摘要： Internal electrodes A1 to D1 and A2 to D2 are laid in layers at spaces in the direction of thickness of a ceramic body 1. Lead electrodes a1 to d1 and a2 to d2 are led out to a side face to form lead portions. Dummy electrodes 51 to 58 have one-side ends led out to a side face to form lead portions in layers provided with the internal electrodes A1 to D1 and A2 to D2. The lead portion of a lead electrode a1 to d1 or a2 to d2 of each layer is superposed over the lead portion of a dummy electrode 51 to 58 belonging to another layer in the direction of thickness.
摘要翻译： 内部电极A 1〜D 1和A 2〜D 2沿着陶瓷体1的厚度方向的空间层叠。 引线电极a 1至d 1和2至d 2被引出到侧面以形成引线部分。 假电极51至58具有一侧端部引导到侧面以形成设置有内部电极A 1至D 1和A 2至D 2的层的引线部分。 每个层的引线电极a 1至d 1或2至d 2的引线部分叠加在属于另一层厚度的另一层的虚拟电极51至58的引线部分上。
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公开(公告)号：US20050201040A1
公开(公告)日：2005-09-15
申请号：US11058243
申请日：2005-02-16
申请人： Taisuke Ahiko , Sunao Masuda , Masaaki Togashi
发明人： Taisuke Ahiko , Sunao Masuda , Masaaki Togashi
CPC分类号： H01G4/005
摘要： Internal electrodes A1 to D1 and A2 to D2 are laid in layers at spaces in the direction of thickness of a ceramic body 1. Lead electrodes a1 to d1 and a2 to d2 are led out to a side face to form lead portions. Dummy electrodes 51 to 58 have one-side ends led out to a side face to form lead portions in layers provided with the internal electrodes A1 to D1 and A2 to D2. The lead portion of a lead electrode a1 to d1 or a2 to d2 of each layer is superposed over the lead portion of a dummy electrode 51 to 58 belonging to another layer in the direction of thickness.
摘要翻译： 内部电极A 1〜D 1和A 2〜D 2沿着陶瓷体1的厚度方向的空间层叠。 引线电极a 1至d 1和2至d 2被引出到侧面以形成引线部分。 假电极51至58具有一侧端部引导到侧面以形成设置有内部电极A 1至D 1和A 2至D 2的层的引线部分。 每个层的引线电极a 1至d 1或2至d 2的引线部分叠加在属于另一层厚度的另一层的虚拟电极51至58的引线部分上。
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公开(公告)号：US6124769A
公开(公告)日：2000-09-26
申请号：US327169
申请日：1999-06-07
CPC分类号： H01C1/142 , H01C17/006 , H01C7/18 , H01G4/40
摘要： The invention provides an electronic device comprising a first metal layer containing a first metal converted into an oxide upon firing in an oxidizing atmosphere and a second metal layer formed by firing of a second metal particle containing a metal that is not oxidized upon firing in an oxidizing atmosphere, with an intermediate oxide layer interleaved between these two metal layers. The intermediate oxide layer contains an oxide of the first metal contained in the first metal layer. Preferably, the second metal particle contained in the second metal layer is dispersed in the intermediate oxide layer. A uniform oxide layer is obtained at a simple step, and the resistance value provided by the oxide layer is easily controllable with high precision. It is thus possible to achieve an electronic device in which the bonding strength of the oxide layer with respect to the other metal-containing layer is improved with an improvement in the bonding strength with respect to lead wires.
摘要翻译： 本发明提供了一种电子器件，其包括第一金属层，该第一金属层含有在氧化气氛中烧制时转化为氧化物的第一金属，以及第二金属层，其通过在氧化性气体中烧成含有不被氧化的金属的第二金属颗粒 在这两个金属层之间交错的中间氧化物层。 中间氧化物层含有第一金属层中含有的第一金属的氧化物。 优选地，包含在第二金属层中的第二金属颗粒分散在中间氧化物层中。 在简单的步骤中获得均匀的氧化物层，并且由氧化物层提供的电阻值以高精度容易地控制。 因此，通过提高相对于引线的接合强度，可以实现氧化物层相对于其他含金属层的接合强度提高的电子器件。
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公开(公告)号：US08315035B2
公开(公告)日：2012-11-20
申请号：US12629646
申请日：2009-12-02
申请人： Masaaki Togashi , Sunao Masuda , Hiroshi Abe
发明人： Masaaki Togashi , Sunao Masuda , Hiroshi Abe
CPC分类号： H01G4/232 , H01G2/06 , H01G4/30 , H05K3/3426 , H05K2201/10636 , H05K2201/10856 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/41
摘要： A multilayer capacitor which can prevent chattering noises from occurring and improve the packaging density and packaging yield, and a method of manufacturing a multilayer capacitor are provided. Even when an electrostrictive vibration is generated in this multilayer capacitor upon voltage application, a joint surface of a metal terminal can flex, so as to mitigate the electrostrictive vibration, thereby preventing chattering noises from occurring. The joint surface is formed with a cutout and thus can fully secure its flexibility. In this multilayer capacitor, a step formed by a terminal connecting surface, a substrate connecting surface, and the joint surface is positioned within an area overlapping a capacitor element body as seen in the laminating direction of dielectric layers. Therefore, solder fillets do not protrude out of the capacitor element body, whereby the packaging density on a mounting substrate K can be improved. The state of solder fillets is easy to see from the outside, and a connection yield can also be secured.
摘要翻译： 提供一种能够防止发生振动噪声并提高封装密度和封装产率的层叠电容器，以及制造多层电容器的方法。 即使当在施加电压时在该多层电容器中产生电致伸缩振动，金属端子的接合表面也可以弯曲，以减轻电致伸缩振动，从而防止发生振动噪声。 接头表面形成有切口，从而可以完全确保其柔性。 在该层叠电容器中，由电极连接面，基板连接面和接合面形成的台阶位于与电介质层的层叠方向相反的与电容器元件本体重叠的区域内。 因此，焊料圆角不会从电容器元件主体突出，从而可以提高安装基板K上的封装密度。 焊接圆角的状态从外部容易看出，也可以确保连接良率。
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公开(公告)号：US20100188798A1
公开(公告)日：2010-07-29
申请号：US12629646
申请日：2009-12-02
申请人： Masaaki TOGASHI , Sunao MASUDA , Hiroshi ABE
发明人： Masaaki TOGASHI , Sunao MASUDA , Hiroshi ABE
CPC分类号： H01G4/232 , H01G2/06 , H01G4/30 , H05K3/3426 , H05K2201/10636 , H05K2201/10856 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/41
摘要： A multilayer capacitor which can prevent chattering noises from occurring and improve the packaging density and packaging yield, and a method of manufacturing a multilayer capacitor are provided.Even when an electrostrictive vibration is generated in this multilayer capacitor upon voltage application, a joint surface of a metal terminal can flex, so as to mitigate the electrostrictive vibration, thereby preventing chattering noises from occurring. The joint surface is formed with a cutout and thus can fully secure its flexibility. In this multilayer capacitor, a step formed by a terminal connecting surface, a substrate connecting surface, and the joint surface is positioned within an area overlapping a capacitor element body as seen in the laminating direction of dielectric layers. Therefore, solder fillets do not protrude out of the capacitor element body, whereby the packaging density on a mounting substrate K can be improved. The state of solder fillets is easy to see from the outside, and a connection yield can also be secured.
摘要翻译： 提供一种能够防止发生振动噪声并提高封装密度和封装产率的层叠电容器，以及制造多层电容器的方法。 即使当在施加电压时在该多层电容器中产生电致伸缩振动，金属端子的接合表面也可以弯曲，以减轻电致伸缩振动，从而防止发生振动噪声。 接头表面形成有切口，从而可以完全确保其柔性。 在该层叠电容器中，由电极连接面，基板连接面和接合面形成的台阶位于与电介质层的层叠方向相反的与电容器元件本体重叠的区域内。 因此，焊料圆角不会从电容器元件主体突出，从而可以提高安装基板K上的封装密度。 焊接圆角的状态从外部容易看出，也可以确保连接良率。
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公开(公告)号：US20090110461A1
公开(公告)日：2009-04-30
申请号：US12288975
申请日：2008-10-24
申请人： Takehiko Inaba , Keiji Seo , Shinji Kobayashi , Atsushi Kasugai , Akira Sago , Tomohiko Sugino , Sunao Masuda
发明人： Takehiko Inaba , Keiji Seo , Shinji Kobayashi , Atsushi Kasugai , Akira Sago , Tomohiko Sugino , Sunao Masuda
IPC分类号： B41J11/48
CPC分类号： B41J11/703 , B26D1/0006 , B26D1/085 , B26D7/08 , B26D2001/002 , B26D2001/0053 , Y10S83/922 , Y10T83/9447
摘要： A printing apparatus includes a transfer mechanism that transfers a print medium, a printing device that prints on the print medium, a stationary blade that is provided on a downstream side in a transfer direction of the print medium further than the printing device to cut the print medium, a movable blade that is provided on a downstream side in a transfer direction of the print medium further than the printing device and that cut the print medium, and a step portion that is provided on a reverse face of the downstream blade which is located on downstream side in transferring of the print medium, the reverse face being reverse of a slide face of the downstream blade sliding on the upstream blade which is located on upstream side in transferring of the print medium, and that projects along a thickness direction of the downstream blade.
摘要翻译： 打印装置包括传送打印介质的传送机构，在打印介质上打印的打印装置，设置在打印介质的传送方向下游侧的下游侧的固定刀片，以打印打印装置，以切割打印 介质，设置在比打印装置更远的打印介质的传送方向的下游侧并且切割打印介质的可动刀片;以及台阶部，其设置在位于下游叶片的背面上 在打印介质的转印的下游侧，下游刮板的滑动面的反面在位于打印介质的传送的上游侧的上游刮板上滑动，沿着厚度方向 下游叶片。
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8.发明授权公开(公告)号：US08562229B2
公开(公告)日：2013-10-22
申请号：US12288975
申请日：2008-10-24
申请人： Takehiko Inaba , Keiji Seo , Shinji Kobayashi , Atsushi Kasugai , Akira Sago , Tomohiko Sugino , Sunao Masuda
发明人： Takehiko Inaba , Keiji Seo , Shinji Kobayashi , Atsushi Kasugai , Akira Sago , Tomohiko Sugino , Sunao Masuda
CPC分类号： B41J11/703 , B26D1/0006 , B26D1/085 , B26D7/08 , B26D2001/002 , B26D2001/0053 , Y10S83/922 , Y10T83/9447
摘要： A printing apparatus includes a transfer mechanism that transfers a print medium, a printing device that prints on the print medium, a stationary blade that is provided on a downstream side in a transfer direction of the print medium further than the printing device to cut the print medium, a movable blade that is provided on a downstream side in a transfer direction of the print medium further than the printing device and that cut the print medium, and a step portion that is provided on a reverse face of the downstream blade which is located on downstream side in transferring of the print medium, the reverse face being reverse of a slide face of the downstream blade sliding on the upstream blade which is located on upstream side in transferring of the print medium, and that projects along a thickness direction of the downstream blade.
摘要翻译： 打印装置包括传送打印介质的传送机构，在打印介质上打印的打印装置，设置在打印介质的传送方向下游侧的下游侧的固定刀片，以打印打印装置，以切割打印 介质，设置在比打印装置更远的打印介质的传送方向的下游侧并且切割打印介质的可动刀片;以及台阶部，其设置在位于下游叶片的背面上 在打印介质的转印的下游侧，下游刮板的滑动面的反面在位于打印介质的传送的上游侧的上游刮板上滑动，沿着厚度方向 下游叶片。
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9.发明授权公开(公告)号：US07391219B2
公开(公告)日：2008-06-24
申请号：US11783240
申请日：2007-04-06
申请人： Taisuke Ahiko , Sunao Masuda , Masaaki Togashi , Takashi Chiba
发明人： Taisuke Ahiko , Sunao Masuda , Masaaki Togashi , Takashi Chiba
IPC分类号： G01R31/08
CPC分类号： G01R31/028 , H01G4/232 , H01G4/30
摘要： A chip type electronic component for test is provided with an element body, and four or more terminal electrodes placed on the exterior of the element body. The element body has a plurality of laminated insulator layers, and a plurality of internal electrodes arranged to be opposed to each other with the insulator layer in between. Each of the internal electrodes is connected to at least one same terminal electrode out of the four or more terminal electrodes and connected to any one terminal electrode except for the at least one same terminal electrode.
摘要翻译： 用于测试的芯片型电子元件设置有元件主体，以及放置在元件主体外部的四个或更多个端子电极。 元件主体具有多个层压绝缘体层，并且多个内部电极被布置成彼此相对，其间具有绝缘体层。 每个内部电极连接到四个或更多个端子电极中的至少一个相同的端子电极，并且连接到除了至少一个相同的端子电极之外的任何一个端子电极。
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公开(公告)号：US06452781B1
公开(公告)日：2002-09-17
申请号：US09969643
申请日：2001-10-04
申请人： Taisuke Ahiko , Masaaki Togashi , Sunao Masuda
发明人： Taisuke Ahiko , Masaaki Togashi , Sunao Masuda
IPC分类号： H01G406
摘要： The multilayer electronic device comprises a dielectric body formed by stacking dielectric layers. Flat first internal electrodes and flat second internal electrodes insulated via dielectric layers and arranged facing to the first internal electrodes are alternately stacked. First through-hole electrodes are connected to the first internal electrodes by penetrating, penetrate the second internal electrodes without connecting thereto and extend crossing the internal electrodes. The second through-hole electrodes are connected to the second internal electrodes by penetrating, penetrate the first internal electrodes without connecting thereto and extend crossing the internal electrodes. The first terminal electrodes are arranged on the outer surface of the dielectric body and connected to the first through-hole electrodes. The second terminal electrodes are arranged on the outer surface of the dielectric body, arranged alternately with the first terminal electrodes and connected to the second through-hole electrodes.
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