公开(公告)号：US20080115352A1

公开(公告)日：2008-05-22

申请号：US11987621

申请日：2007-12-03

申请人： Takahiro Osawa ,  Yoichi Kawata ,  Atsushi Fujishima ,  Tamaki Wada ,  Kenichi Imura

发明人： Takahiro Osawa ,  Yoichi Kawata ,  Atsushi Fujishima ,  Tamaki Wada ,  Kenichi Imura

IPC分类号： H05K3/36 ,  H05K3/30

CPC分类号： G06K19/07732 ,  B29C45/14647 ,  G06K19/077 ,  G06K19/07745 ,  H01L23/04 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/5388 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/3511 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T29/49222 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A memory card wherein a substrate is affixed to a cap is formed without the projection of substrate edges from a back surface of the cap. The memory card includes a substrate having a sealing member bonded to a recess in the cap. By utilizing a difference in thermal expansion coefficient between the sealing member and the substrate, the substrate is warped so that its central portion projects away from the cap. The shallow recess is deeper than the sum of the thickness of the substrate and the thickness of an adhesive for bonding the substrate to the bottom of the shallow recess, whereby peripheral edges of the substrate retract into the shallow recess without projecting from the back surface of the cap. The cap is shaped as a card several millimeters thick. A memory chip and control chip are incorporated in the sealing member.

公开(公告)号：US07086600B2

公开(公告)日：2006-08-08

申请号：US10466428

申请日：2001-02-02

申请人： Takahiro Osawa ,  Yoichi Kawata ,  Atsushi Fujishima ,  Tamaki Wada ,  Kenichi Imura

发明人： Takahiro Osawa ,  Yoichi Kawata ,  Atsushi Fujishima ,  Tamaki Wada ,  Kenichi Imura

IPC分类号： G06K19/06 ,  G06K19/00

CPC分类号： G06K19/07732 ,  B29C45/14647 ,  G06K19/077 ,  G06K19/07745 ,  H01L23/04 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/5388 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/3511 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T29/49222 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A memory card wherein a substrate is affixed to a cap is formed without the projection of substrate edges from a back surface of the cap. The memory card includes a substrate having a sealing member bonded to a recess in the cap. By utilizing a difference in thermal expansion coefficient between the sealing member and the substrate, the substrate is warped so that its central portion projects away from the cap. The shallow recess is deeper than the sum of the thickness of the substrate and the thickness of an adhesive for bonding the substrate to the bottom of the shallow recess, whereby peripheral edges of the substrate retract into the shallow recess without projecting from the back surface of the cap. The cap is shaped as a card several millimeters thick. A memory chip and control chip are incorporated in the sealing member.

摘要翻译： 其中衬底固定在帽上的存储卡被形成，而没有衬底边缘从盖的后表面突出。 存储卡包括具有接合到盖中的凹部的密封构件的基板。 通过利用密封构件和基板之间的热膨胀系数的差异，基板翘曲，使得其中心部分远离盖突出。 浅凹部比基板的厚度和用于将基板粘结到浅凹部的底部的粘合剂的厚度的总和深，从而基板的周边边缘缩回到浅凹部中而不从背面突出 这顶帽子。 盖形成为几毫米厚的卡。 存储芯片和控制芯片被结合在密封构件中。

公开(公告)号：US20060108430A1

公开(公告)日：2006-05-25

申请号：US11326448

申请日：2006-01-06

申请人： Takahiro Osawa ,  Yoichi Kawata ,  Atsushi Fujishima ,  Tamaki Wada ,  Kenichi Imura

发明人： Takahiro Osawa ,  Yoichi Kawata ,  Atsushi Fujishima ,  Tamaki Wada ,  Kenichi Imura

IPC分类号： G06K19/06

CPC分类号： G06K19/07732 ,  B29C45/14647 ,  G06K19/077 ,  G06K19/07745 ,  H01L23/04 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/5388 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/3511 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T29/49222 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A memory card wherein a substrate is affixed to a cap is formed without the projection of substrate edges from a back surface of the cap. The memory card includes a substrate having a sealing member bonded to a recess in the cap. By utilizing a difference in thermal expansion coefficient between the sealing member and the substrate, the substrate is warped so that its central portion projects away from the cap. The shallow recess is deeper than the sum of the thickness of the substrate and the thickness of an adhesive for bonding the substrate to the bottom of the shallow recess, whereby peripheral edges of the substrate retract into the shallow recess without projecting from the back surface of the cap. The cap is shaped as a card several millimeters thick. A memory chip and control chip are incorporated in the sealing member.

公开(公告)号：US20100051857A1

公开(公告)日：2010-03-04

申请号：US12519629

申请日：2007-11-13

申请人： Hidehiro Takakusa ,  Minoru Okada ,  Haruki Wada ,  Masaji Haneda ,  Takahiro Osawa

发明人： Hidehiro Takakusa ,  Minoru Okada ,  Haruki Wada ,  Masaji Haneda ,  Takahiro Osawa

IPC分类号： H01M4/583

CPC分类号： H01M4/62 ,  H01M4/20 ,  H01M4/38 ,  H01M4/48 ,  H01M4/625

摘要： A storage battery or a secondary battery is capable of improving the utilization of an active material and obtaining a high energy density, using raw materials having costs substantially equal to those of a conventional lead storage battery especially as a negative-electrode plate of the secondary battery. The negative-electrode active material for the secondary battery is a kneaded mixture including: a raw active material having a metal and an oxide of the metal; and carbon in such an amount that the total absorption number thereof is at least 4.7 ml per mol of the raw active material, in which the kneaded mixture contains no sulfates or sulfates in an amount of 7×10−2 mol or smaller per mol of the raw active material. The negative-electrode active material has a specific volume of 2.2×10−1 to 5×10−1 ml/g with subjected to no formation. The carbon is acetylene black or furnace carbon.

摘要翻译： 蓄电池或二次电池能够使用与常规铅蓄电池的成本基本相同的原材料，特别是作为二次电池的负极板，能够提高活性材料的利用率并获得高能量密度 。 二次电池用负极活性物质是将具有金属和金属的氧化物的原料活性物质作为混合物， 和碳，其总吸收数为每摩尔原料活性物质至少4.7ml，其中捏合的混合物不含有每摩尔7×10 -2摩尔或更小的硫酸盐或硫酸盐 原料活性物质。 负极活性物质的比体积为2.2×10 -1〜5×10 -1 ml / g，不经形成。 碳是乙炔黑或炉碳。

公开(公告)号：US07467464B2

公开(公告)日：2008-12-23

申请号：US11987621

申请日：2007-12-03

申请人： Takahiro Osawa ,  Yoichi Kawata ,  Atsushi Fujishima ,  Tamaki Wada ,  Kenichi Imura

发明人： Takahiro Osawa ,  Yoichi Kawata ,  Atsushi Fujishima ,  Tamaki Wada ,  Kenichi Imura

IPC分类号： H05K3/30

CPC分类号： G06K19/07732 ,  B29C45/14647 ,  G06K19/077 ,  G06K19/07745 ,  H01L23/04 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/5388 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/3511 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T29/49222 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A method for manufacturing a multi media card comprises the steps of: providing a substrate, mounting a first flash memory chip and a controller chip for controlling the flash memory chip over a front surface of the substrate, molding the first flash memory chip and the controller chip by a resin, providing a case having a main surface and a back surface, wherein the back surface of the case has a first recess and a second recess, and, covering the resin and the front surface of the substrate by the case. The depth of the first recess is deeper than the depth of the second recess. The resin is fitted in the first recess. An edge portion of the substrate is fitted in the second recess. The substrate warps so that a central portion of the substrate projects in a direction away from the case.

摘要翻译： 制造多媒体卡的方法包括以下步骤：提供基板，安装第一闪存芯片和用于控制闪存芯片超过基板前表面的控制器芯片，模制第一闪存芯片和控制器 提供具有主表面和后表面的壳体，其中壳体的后表面具有第一凹部和第二凹部，并且通过壳体覆盖树脂和基板的前表面。 第一凹部的深度比第二凹部的深度更深。 树脂安装在第一凹槽中。 衬底的边缘部分装配在第二凹部中。 基板翘曲，使得基板的中心部分沿远离壳体的方向突出。

公开(公告)号：US07322531B2

公开(公告)日：2008-01-29

申请号：US11326448

申请日：2006-01-06

申请人： Takahiro Osawa ,  Yoichi Kawata ,  Atsushi Fujishima ,  Tamaki Wada ,  Kenichi Imura

发明人： Takahiro Osawa ,  Yoichi Kawata ,  Atsushi Fujishima ,  Tamaki Wada ,  Kenichi Imura

IPC分类号： G06K19/06 ,  G06K19/00

CPC分类号： G06K19/07732 ,  B29C45/14647 ,  G06K19/077 ,  G06K19/07745 ,  H01L23/04 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/5388 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/3511 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T29/49222 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A memory card wherein a substrate is affixed to a cap is formed without the projection of substrate edges from a back surface of the cap. The memory card includes a substrate having a sealing member bonded to a recess in the cap. By utilizing a difference in thermal expansion coefficient between the sealing member and the substrate, the substrate is warped so that its central portion projects away from the cap. The shallow recess is deeper than the sum of the thickness of the substrate and the thickness of an adhesive for bonding the substrate to the bottom of the shallow recess, whereby peripheral edges of the substrate retract into the shallow recess without projecting from the back surface of the cap. The cap is shaped as a card several millimeters thick. A memory chip and control chip are incorporated in the sealing member.

摘要翻译： 其中衬底固定在帽上的存储卡被形成，而没有衬底边缘从盖的后表面突出。 存储卡包括具有接合到盖中的凹部的密封构件的基板。 通过利用密封构件和基板之间的热膨胀系数的差异，基板翘曲，使得其中心部分远离盖突出。 浅凹部比基板的厚度和用于将基板粘结到浅凹部的底部的粘合剂的厚度的总和深，从而基板的周边边缘缩回到浅凹部中而不从背面突出 这顶帽子。 盖形成为几毫米厚的卡。 存储芯片和控制芯片被结合在密封构件中。

公开(公告)号：US5848067A

公开(公告)日：1998-12-08

申请号：US813357

申请日：1997-03-07

申请人： Takahiro Osawa ,  Katsuyoshi Tanaka ,  Masaru Murakami

发明人： Takahiro Osawa ,  Katsuyoshi Tanaka ,  Masaru Murakami

IPC分类号： H04J3/00 ,  H04L12/951 ,  H04Q3/00 ,  H04Q11/04 ,  H04L12/28 ,  H04L12/56

CPC分类号： H04Q11/0478 ,  H04L2012/5654

摘要： An AAL1 processing method in a cell disassembly apparatus for performing pointer comparison processing on the assumption that a pointer is inserted in each ATM cell, in parallel with sequence number processing, to determine the validity of the result of the pointer comparison processing to control an output data stream. In this case, data associated with each connection required for each processing is read from a memory table based on connection information added to a received ATM cell each time the ATM cell is received, and set in corresponding processing units.

摘要翻译： 在用于执行指针比较处理的AAL1处理方法中，假设指针与序列号处理并行地插入在每个ATM信元中，以确定指针比较处理的结果的有效性以控制输出 数据流。 在这种情况下，每当接收到ATM信元时，基于连接信息从存储器表中读取与每个处理所需的每个连接相关联的数据，并以对应的处理单元进行设置。