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公开(公告)号：US07467464B2
公开(公告)日：2008-12-23
申请号：US11987621
申请日：2007-12-03
申请人： Takahiro Osawa , Yoichi Kawata , Atsushi Fujishima , Tamaki Wada , Kenichi Imura
发明人： Takahiro Osawa , Yoichi Kawata , Atsushi Fujishima , Tamaki Wada , Kenichi Imura
IPC分类号： H05K3/30
CPC分类号： G06K19/07732 , B29C45/14647 , G06K19/077 , G06K19/07745 , H01L23/04 , H01L23/13 , H01L23/3107 , H01L23/5388 , H01L24/48 , H01L25/0652 , H01L25/50 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/3511 , Y10T29/4913 , Y10T29/49133 , Y10T29/49146 , Y10T29/49158 , Y10T29/49222 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A method for manufacturing a multi media card comprises the steps of: providing a substrate, mounting a first flash memory chip and a controller chip for controlling the flash memory chip over a front surface of the substrate, molding the first flash memory chip and the controller chip by a resin, providing a case having a main surface and a back surface, wherein the back surface of the case has a first recess and a second recess, and, covering the resin and the front surface of the substrate by the case. The depth of the first recess is deeper than the depth of the second recess. The resin is fitted in the first recess. An edge portion of the substrate is fitted in the second recess. The substrate warps so that a central portion of the substrate projects in a direction away from the case.
摘要翻译： 制造多媒体卡的方法包括以下步骤：提供基板，安装第一闪存芯片和用于控制闪存芯片超过基板前表面的控制器芯片，模制第一闪存芯片和控制器 提供具有主表面和后表面的壳体，其中壳体的后表面具有第一凹部和第二凹部，并且通过壳体覆盖树脂和基板的前表面。 第一凹部的深度比第二凹部的深度更深。 树脂安装在第一凹槽中。 衬底的边缘部分装配在第二凹部中。 基板翘曲，使得基板的中心部分沿远离壳体的方向突出。
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公开(公告)号：US07322531B2
公开(公告)日：2008-01-29
申请号：US11326448
申请日：2006-01-06
申请人： Takahiro Osawa , Yoichi Kawata , Atsushi Fujishima , Tamaki Wada , Kenichi Imura
发明人： Takahiro Osawa , Yoichi Kawata , Atsushi Fujishima , Tamaki Wada , Kenichi Imura
CPC分类号： G06K19/07732 , B29C45/14647 , G06K19/077 , G06K19/07745 , H01L23/04 , H01L23/13 , H01L23/3107 , H01L23/5388 , H01L24/48 , H01L25/0652 , H01L25/50 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/3511 , Y10T29/4913 , Y10T29/49133 , Y10T29/49146 , Y10T29/49158 , Y10T29/49222 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A memory card wherein a substrate is affixed to a cap is formed without the projection of substrate edges from a back surface of the cap. The memory card includes a substrate having a sealing member bonded to a recess in the cap. By utilizing a difference in thermal expansion coefficient between the sealing member and the substrate, the substrate is warped so that its central portion projects away from the cap. The shallow recess is deeper than the sum of the thickness of the substrate and the thickness of an adhesive for bonding the substrate to the bottom of the shallow recess, whereby peripheral edges of the substrate retract into the shallow recess without projecting from the back surface of the cap. The cap is shaped as a card several millimeters thick. A memory chip and control chip are incorporated in the sealing member.
摘要翻译： 其中衬底固定在帽上的存储卡被形成，而没有衬底边缘从盖的后表面突出。 存储卡包括具有接合到盖中的凹部的密封构件的基板。 通过利用密封构件和基板之间的热膨胀系数的差异，基板翘曲，使得其中心部分远离盖突出。 浅凹部比基板的厚度和用于将基板粘结到浅凹部的底部的粘合剂的厚度的总和深，从而基板的周边边缘缩回到浅凹部中而不从背面突出 这顶帽子。 盖形成为几毫米厚的卡。 存储芯片和控制芯片被结合在密封构件中。
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公开(公告)号：US20080115352A1
公开(公告)日：2008-05-22
申请号：US11987621
申请日：2007-12-03
申请人： Takahiro Osawa , Yoichi Kawata , Atsushi Fujishima , Tamaki Wada , Kenichi Imura
发明人： Takahiro Osawa , Yoichi Kawata , Atsushi Fujishima , Tamaki Wada , Kenichi Imura
CPC分类号： G06K19/07732 , B29C45/14647 , G06K19/077 , G06K19/07745 , H01L23/04 , H01L23/13 , H01L23/3107 , H01L23/5388 , H01L24/48 , H01L25/0652 , H01L25/50 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/3511 , Y10T29/4913 , Y10T29/49133 , Y10T29/49146 , Y10T29/49158 , Y10T29/49222 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A memory card wherein a substrate is affixed to a cap is formed without the projection of substrate edges from a back surface of the cap. The memory card includes a substrate having a sealing member bonded to a recess in the cap. By utilizing a difference in thermal expansion coefficient between the sealing member and the substrate, the substrate is warped so that its central portion projects away from the cap. The shallow recess is deeper than the sum of the thickness of the substrate and the thickness of an adhesive for bonding the substrate to the bottom of the shallow recess, whereby peripheral edges of the substrate retract into the shallow recess without projecting from the back surface of the cap. The cap is shaped as a card several millimeters thick. A memory chip and control chip are incorporated in the sealing member.
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公开(公告)号：US07086600B2
公开(公告)日：2006-08-08
申请号：US10466428
申请日：2001-02-02
申请人： Takahiro Osawa , Yoichi Kawata , Atsushi Fujishima , Tamaki Wada , Kenichi Imura
发明人： Takahiro Osawa , Yoichi Kawata , Atsushi Fujishima , Tamaki Wada , Kenichi Imura
CPC分类号： G06K19/07732 , B29C45/14647 , G06K19/077 , G06K19/07745 , H01L23/04 , H01L23/13 , H01L23/3107 , H01L23/5388 , H01L24/48 , H01L25/0652 , H01L25/50 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/3511 , Y10T29/4913 , Y10T29/49133 , Y10T29/49146 , Y10T29/49158 , Y10T29/49222 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A memory card wherein a substrate is affixed to a cap is formed without the projection of substrate edges from a back surface of the cap. The memory card includes a substrate having a sealing member bonded to a recess in the cap. By utilizing a difference in thermal expansion coefficient between the sealing member and the substrate, the substrate is warped so that its central portion projects away from the cap. The shallow recess is deeper than the sum of the thickness of the substrate and the thickness of an adhesive for bonding the substrate to the bottom of the shallow recess, whereby peripheral edges of the substrate retract into the shallow recess without projecting from the back surface of the cap. The cap is shaped as a card several millimeters thick. A memory chip and control chip are incorporated in the sealing member.
摘要翻译： 其中衬底固定在帽上的存储卡被形成，而没有衬底边缘从盖的后表面突出。 存储卡包括具有接合到盖中的凹部的密封构件的基板。 通过利用密封构件和基板之间的热膨胀系数的差异，基板翘曲，使得其中心部分远离盖突出。 浅凹部比基板的厚度和用于将基板粘结到浅凹部的底部的粘合剂的厚度的总和深，从而基板的周边边缘缩回到浅凹部中而不从背面突出 这顶帽子。 盖形成为几毫米厚的卡。 存储芯片和控制芯片被结合在密封构件中。
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公开(公告)号：US20060108430A1
公开(公告)日：2006-05-25
申请号：US11326448
申请日：2006-01-06
申请人： Takahiro Osawa , Yoichi Kawata , Atsushi Fujishima , Tamaki Wada , Kenichi Imura
发明人： Takahiro Osawa , Yoichi Kawata , Atsushi Fujishima , Tamaki Wada , Kenichi Imura
IPC分类号： G06K19/06
CPC分类号： G06K19/07732 , B29C45/14647 , G06K19/077 , G06K19/07745 , H01L23/04 , H01L23/13 , H01L23/3107 , H01L23/5388 , H01L24/48 , H01L25/0652 , H01L25/50 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2225/06562 , H01L2924/00014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/3511 , Y10T29/4913 , Y10T29/49133 , Y10T29/49146 , Y10T29/49158 , Y10T29/49222 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A memory card wherein a substrate is affixed to a cap is formed without the projection of substrate edges from a back surface of the cap. The memory card includes a substrate having a sealing member bonded to a recess in the cap. By utilizing a difference in thermal expansion coefficient between the sealing member and the substrate, the substrate is warped so that its central portion projects away from the cap. The shallow recess is deeper than the sum of the thickness of the substrate and the thickness of an adhesive for bonding the substrate to the bottom of the shallow recess, whereby peripheral edges of the substrate retract into the shallow recess without projecting from the back surface of the cap. The cap is shaped as a card several millimeters thick. A memory chip and control chip are incorporated in the sealing member.
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公开(公告)号：US20050104614A1
公开(公告)日：2005-05-19
申请号：US10970555
申请日：2004-10-21
IPC分类号： G01R31/00 , G01R31/26 , G01R31/28 , G09F9/00 , H01L27/12 , H01L29/786 , H01L51/50 , H01L29/04
CPC分类号： G01R31/2621 , G01R31/2831 , H01L27/12
摘要： Provided is an inspection device which inspects a thin film transistor (TFT) for supplying a current to a light emitting element. The inspection device includes: a first current supply circuit which supplies a drain current between a drain and a source of the TFT; a gate voltage adjustment circuit which adjust a gate voltage to be applied to a gate of the TFT so as to allow a predetermined specified current to flow between the drain and source of the TFT; and a measurement unit which measures the gate voltage adjusted by the gate voltage adjustment circuit.
摘要翻译： 提供了检查用于向发光元件供给电流的薄膜晶体管（TFT）的检查装置。 检查装置包括：第一电流供给电路，其在TFT的漏极和源极之间提供漏极电流; 栅极电压调整电路，其调整施加到TFT的栅极的栅极电压，以允许预定的规定电流在TFT的漏极和源极之间流动; 以及测量单元，其测量由栅极电压调节电路调节的栅极电压。
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公开(公告)号：US20050019979A1
公开(公告)日：2005-01-27
申请号：US10921156
申请日：2004-08-19
CPC分类号： H01L21/565 , H01L24/97 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： At the time of performing resin molding for a matrix frame in the fabrication of semiconductor integrated circuit devices, a predetermined amount of air is fed into each of first cavities in a first row and second cavities in a second row, the first and second cavities being formed in a matrix arrangement in a lower mold of a molding die, so as to pressurize the interiors of the cavities, and a sealing resin is charged into the cavities, while the pressure therein is regulated in such a manner that the charging speeds of the sealing resin become equal in all of the cavities, whereby it is possible to stabilize the quality of the product being obtained.
摘要翻译： 在制造半导体集成电路器件时对矩阵框架进行树脂模制时，将预定量的空气馈送到第一排中的第一空腔和第二排中的第二空腔中的每一个中，第一和第二空腔为 在成型模具的下模具中以矩阵形式形成，以便对空腔的内部进行加压，并且将密封树脂装入空腔中，同时其中的压力以这样的方式被调节： 密封树脂在所有空腔中变得相等，由此可以稳定所获得的产品的质量。
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公开(公告)号：US5371044A
公开(公告)日：1994-12-06
申请号：US876349
申请日：1992-04-30
申请人： Isamu Yoshida , Junichi Saeki , Shigeharu Tsunoda , Kunihiko Nishi , Ichiro Anjoh , Kenichi Imura , Toshihiro Yasuhara , Junichi Arita , Kazuhiro Sugino
发明人： Isamu Yoshida , Junichi Saeki , Shigeharu Tsunoda , Kunihiko Nishi , Ichiro Anjoh , Kenichi Imura , Toshihiro Yasuhara , Junichi Arita , Kazuhiro Sugino
CPC分类号： H01L21/565 , B29C45/14655 , H01L23/4951 , H01L23/49541 , B29C45/02 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/4826 , H01L2224/73215 , H01L24/45 , H01L24/48 , H01L2924/01025 , H01L2924/01079
摘要： A molding method in which a control plate having a size which is equal to or larger than the width of the outlet port of a supply passage are disposed in a cavity adjacent to the resin supply passage of a mold and thereby, the resin molding can be effected substantially equally at upper and lower sides of the insert comprising a semiconductor device and a lead.
摘要翻译： 一种模制方法，其中具有等于或大于供应通道的出口宽度的尺寸的控制板设置在与模具的树脂供应通道相邻的空腔中，从而树脂模制件可以 在包括半导体器件和引线的插入件的上侧和下侧基本相等地实现。
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公开(公告)号：US07465609B2
公开(公告)日：2008-12-16
申请号：US11213771
申请日：2005-08-30
申请人： Fumio Murakami , Kenichi Imura , Makoto Araki
发明人： Fumio Murakami , Kenichi Imura , Makoto Araki
CPC分类号： H01L24/97 , H01L21/565 , H01L23/3128 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2223/54486 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In the method of manufacturing a semiconductor device that semiconductor chips are mounted facing-up on the printed wiring board on which a protective insulation film is formed by means of a film-like resist and a plurality of the semiconductor chips are collectively molded by a transfer mold technology, when transfer molding is performed, among the adsorption face of the printed wiring board and the lower die to make adsorb the printed wiring board, the through holes reaching the exterior space of the lower die from the vicinity of the end portion opposing the gate to pour mold resin of a mold cavity are formed as many as possible in order to prevent a short circuit and an open circuit by big deformation of a bonding wire connecting an electrode of the semiconductor chip and an conductor pattern of the printed wiring board.
摘要翻译： 在制造半导体器件的方法中，半导体芯片通过薄膜状抗蚀剂面向上安装在其上形成保护绝缘膜的印刷线路板上，并且多个半导体芯片通过转印共同模制 模具技术，当进行传递成型时，在印刷线路板的吸附面和下模之间，使得吸附印刷电路板，通孔从相对的端部附近到达下模的外部空间 为了防止连接半导体芯片的电极和印刷电路板的导体图案的接合线的大变形，防止短路和开路，模具腔的浇注模塑树脂形成为尽可能多的浇口。
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公开(公告)号：US06723583B2
公开(公告)日：2004-04-20
申请号：US10453606
申请日：2003-06-04
申请人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
发明人： Noriyuki Takahashi , Masayuki Suzuki , Kouji Tsuchiya , Takao Matsuura , Takanori Hashizume , Masahiro Ichitani , Kazunari Suzuki , Takafumi Nishita , Kenichi Imura , Takashi Miwa
IPC分类号： H01L2144
CPC分类号： H01L23/564 , H01L21/561 , H01L21/565 , H01L23/3128 , H01L23/49816 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/92 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/30105 , H01L2924/351 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2224/92247 , H01L2924/00 , H01L2924/00012
摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.
摘要翻译： 将其上安装有多个半导体芯片的带状基板的背面真空吸附到模具的下半模，并且在该状态下，多个半导体芯片同时用树脂密封以形成密封构件。 此后，带状基板和密封构件从模具中释放并切割成多个半导体器件。 由此获得的半导体器件的安装可靠性得到改善。
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