摘要:
A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost.
摘要:
There is provided a filter element which maintains the flow rate of a fluid passing through a filter medium, restrains a pressure loss as far as possible, and is compact in size. In the filter element including a filter medium 30 pleated so that peaks 30a and valleys 30b are arranged alternately and a frame 21 for holding the filter medium 30, the frame 21 includes a frame body 22 forming the peripheral edge portion thereof and a plurality of ribs 23 extending in parallel on the inside of the frame body 22. The interval H between the ribs 23 is set at 5 to 35 mm, and the filter medium 30 is folded at an angle θ of at least four degrees at the peaks 30a and the valleys 30b.
摘要:
A room temperature bonding machine is provided with an evacuation apparatus, a gas supply apparatus, a pressure gauge, a cleaner apparatus, a pressure controller and a pressing mechanism. The evacuation apparatus evacuates gas from the chamber. The gas supply apparatus supplies introduction gas into the chamber. The pressure gauge measures the pressure in the chamber. The cleaner apparatus cleans first and second substrates in the chamber when said pressure is at a predetermined degree of vacuum. The pressure controller controls both of the evacuation apparatus and the gas supply apparatus so that the pressure is regulated to a target pressure. The pressing mechanism presses and bonds the first and second substrates when the pressure is set to said target pressure.
摘要:
A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost.
摘要:
A canister includes a casing, a fuel reserve well defined at the bottom of the casing, an adsorbent layer provided in the casing for adsorbing fuel vapor, the adsorbent layer communicating with the fuel reserve well at a region of its lower portion and communicating with an atmosphere at its upper portion, a first communication passage defined so that the fuel reserve well communicates with a fuel system of an engine, and a second communication passage defined so that the fuel reserve well communicates with an intake system o f the engine. The second communication passage includes a purge chamber communicating with a region of the adsorbent layer other than the region of the adsorbent layer with which the fuel reserve well communicates, a first fuel outflow passage having a liquid fuel suction port open to the bottom of the fuel reserve well at its lower portion and a nozzle opening positioned in the purge chamber at its upper portion, and a second fuel outflow passage defined over the nozzle opening of the first fuel outflow passage for providing a fuel flow passage extending from the purge chamber to the suction system of the engine.
摘要:
A room-temperature bonding apparatus of the present invention includes: a plurality of first beam sources configured to emit a plurality of first activation beams which are irradiated to a first activation surface of a first substrate; a plurality of second beam sources configured to emit a plurality of second activation beams which are irradiated to a second activation surface of a second substrate; and a pressure welding mechanism configured to bond the first substrate and the second substrate by bring the first activation surface and the second activation surface contact, after the first activation surface and the second activation surface are irradiated. The room-temperature bonding apparatus can more uniformly irradiate to the first activation surface and the second activation surface, so that the first substrate and the second substrate can be more appropriately bonded with each other, compared with another room-temperature bonding apparatus which irradiates the first activation surface and the second activation surface by using one beam source.
摘要:
A room temperature bonding apparatus according to the present invention is provided with a load lock chamber having an internal space which is pressure-reduced; and a cartridge arranged in the load lock chamber. The cartridge includes an island portion formed to contact a substrate when the substrate is put on the cartridge. A flow passage is formed for the island portion to connect a space between the cartridge and the substrate to outside when the substrate is put on the cartridge. Therefore, in the room temperature bonding apparatus can prevent making the substrate is moved to the cartridge due to gas when the internal space is pressure-reduced.
摘要:
The present invention includes an activating step S2 of activating, by irradiating a first substrate surface of a first substrate and a second substrate surface of a second substrate with particles, the second substrate surface and the first substrate surface, and a bonding step S4 of bonding the second substrate and the first substrate together by bringing the second substrate surface and the first substrate surface into contact with each other after a temperature difference between a temperature of the first substrate and a temperature of the second substrate becomes equal to or lower than a predetermined value. According to this bonding method, warpage occurring in a bonded substrate obtained can be further reduced compared with other bonding methods of bonding both substrates before the temperature difference between the temperature of the first substrate and the temperature of the second substrate becomes equal to or lower than a predetermined value.
摘要:
A canister module includes a canister housing in which a plurality of cylindrical adsorbent chambers filled with adsorbent are provided side by side with a gap therebetween. Canister-peripheral parts are connected to the adsorbent chambers through communicating openings provided on the canister housing and are in the gap.
摘要:
A fuel vapor capturing canister includes a cylindrical casing having a communicating hole which is formed at one end so as to communicate with the atmosphere and another communicating hole which is formed at the other end so as to communicate with a fuel tank and an intake system of an engine. An adsorbent is accommodated in the casing so as to form at least one layer. A pair of partitioning plates partition the adsorbent layer longitudinally of the casing. A deflecting plate is disposed between the partitioning plates so as to protrude from an inner wall face of the casing inwardly of the same. The partitioning plates are open in the vicinity of sides of the deflecting plate respectively.