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公开(公告)号：US09005390B2
公开(公告)日：2015-04-14
申请号：US13530714
申请日：2012-06-22
申请人： Takeshi Tsuno , Takayuki Goto , Masato Kinouchi , Satoshi Tawara , Jun Utsumi , Yoichiro Tsumura , Kensuke Ide , Takenori Suzuki
发明人： Takeshi Tsuno , Takayuki Goto , Masato Kinouchi , Satoshi Tawara , Jun Utsumi , Yoichiro Tsumura , Kensuke Ide , Takenori Suzuki
IPC分类号： B29C65/00 , B32B37/00 , H01L21/677 , H01L21/67 , H01L21/673 , H01L21/68 , H01L21/683
CPC分类号： H01L21/67778 , H01L21/67092 , H01L21/6732 , H01L21/67748 , H01L21/68 , H01L21/683 , Y10T156/1744
摘要： A room temperature bonding apparatus includes angle adjustment means supporting a first sample stage holding a first substrate so as to be able to change a direction of the first sample stage; a first driving device driving the first stage in a first direction; a second driving device driving a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table supporting the second sample stage in the first direction when the second substrate and the first substrate are brought into contact. The apparatus can impose a load exceeding a withstand load of the second driving device on the first and second substrates. Further, the apparatus uses angle adjustment means to change direction of the first substrate to be parallel with the second substrate and uniformly impose the larger load on a bonding surface.
摘要翻译： 室温接合装置包括角度调节装置，支撑保持第一基板的第一样品台，以便能够改变第一样品台的方向; 第一驱动装置，其沿第一方向驱动第一级; 第二驱动装置，驱动在不与第一方向平行的第二方向上保持第二基板的第二样品台; 以及当所述第二基板和所述第一基板接触时，在所述第一方向上支撑所述第二样品台的托架支撑台。 该装置可以施加超过第二驱动装置的耐受负载的负载在第一和第二基板上。 此外，该装置使用角度调节装置来改变与第二基板平行的第一基板的方向，并将较大的负载均匀地施加在接合表面上。
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公开(公告)号：US08985175B2
公开(公告)日：2015-03-24
申请号：US12811177
申请日：2008-09-29
申请人： Masato Kinouchi , Takayuki Goto , Satoshi Tawara , Takeshi Tsuno , Jun Utsumi , Kensuke Ide , Takenori Suzuki
发明人： Masato Kinouchi , Takayuki Goto , Satoshi Tawara , Takeshi Tsuno , Jun Utsumi , Kensuke Ide , Takenori Suzuki
CPC分类号： B32B37/1009 , B23K20/02 , B32B37/10 , B32B2309/68 , H01L21/187 , H01L21/2007 , H01L21/67092 , H01L21/67253
摘要： A room temperature bonding machine is provided with an evacuation apparatus, a gas supply apparatus, a pressure gauge, a cleaner apparatus, a pressure controller and a pressing mechanism. The evacuation apparatus evacuates gas from the chamber. The gas supply apparatus supplies introduction gas into the chamber. The pressure gauge measures the pressure in the chamber. The cleaner apparatus cleans first and second substrates in the chamber when said pressure is at a predetermined degree of vacuum. The pressure controller controls both of the evacuation apparatus and the gas supply apparatus so that the pressure is regulated to a target pressure. The pressing mechanism presses and bonds the first and second substrates when the pressure is set to said target pressure.
摘要翻译： 室温粘合机设置有排气装置，气体供给装置，压力计，清洁装置，压力控制器和按压机构。 抽空装置从室抽出气体。 气体供给装置将引入气体供给到室内。 压力表测量室内的压力。 当所述压力处于预定的真空度时，清洁器装置清洗腔室中的第一和第二基板。 压力控制器控制排气装置和气体供给装置，使得压力被调节到目标压力。 当压力设定为所述目标压力时，按压机构按压并结合第一和第二基板。
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公开(公告)号：US08906175B2
公开(公告)日：2014-12-09
申请号：US13139085
申请日：2009-09-29
申请人： Masato Kinouchi , Takayuki Goto , Satoshi Tawara , Takeshi Tsuno , Jun Utsumi , Kensuke Ide , Takenori Suzuki
发明人： Masato Kinouchi , Takayuki Goto , Satoshi Tawara , Takeshi Tsuno , Jun Utsumi , Kensuke Ide , Takenori Suzuki
CPC分类号： H01L21/6838 , B23K20/02 , B23K2101/40 , H01L21/67201 , Y10T156/10 , Y10T156/17
摘要： A room temperature bonding apparatus according to the present invention is provided with a load lock chamber having an internal space which is pressure-reduced; and a cartridge arranged in the load lock chamber. The cartridge includes an island portion formed to contact a substrate when the substrate is put on the cartridge. A flow passage is formed for the island portion to connect a space between the cartridge and the substrate to outside when the substrate is put on the cartridge. Therefore, in the room temperature bonding apparatus can prevent making the substrate is moved to the cartridge due to gas when the internal space is pressure-reduced.
摘要翻译： 根据本发明的室温接合装置设置有具有减压的内部空间的负载锁定室; 以及设置在负载锁定室中的盒。 所述盒包括当所述基板被放置在所述盒上时形成为接触基板的岛部。 当基板被放置在盒上时，形成用于岛部分的流动通道，以将盒和基板之间的空间连接到外部。 因此，室温接合装置可以防止当内部空间减压时由于气体使基板移动到墨盒。
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公开(公告)号：US08857487B2
公开(公告)日：2014-10-14
申请号：US12919997
申请日：2008-03-11
申请人： Takeshi Tsuno , Takayuki Goto , Masato Kinouchi , Satoshi Tawara , Jun Utsumi , Yoichiro Tsumura , Kensuke Ide , Takenori Suzuki
发明人： Takeshi Tsuno , Takayuki Goto , Masato Kinouchi , Satoshi Tawara , Jun Utsumi , Yoichiro Tsumura , Kensuke Ide , Takenori Suzuki
IPC分类号： B29C65/00 , B32B37/00 , H01L21/673 , H01L21/677 , H01L21/68 , H01L21/683 , H01L21/67
CPC分类号： H01L21/67778 , H01L21/67092 , H01L21/6732 , H01L21/67748 , H01L21/68 , H01L21/683 , Y10T156/1744
摘要： A room temperature bonding apparatus includes: an angle adjustment mechanism that supports a first sample stage holding a first substrate to a first stage so as to be able to change a direction of the first sample stage; a first driving device that drives the first stage in a first direction; a second driving device that drives a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table that supports the second sample stage in the first direction when the second substrate and the first substrate are brought into press contact with each other. In this case, the room temperature bonding apparatus can impose a larger load exceeding a withstand load of the second driving device on the first substrate and the second substrate. Further, the room temperature bonding apparatus can use the angle adjustment mechanism to change a direction of the first substrate such that the first substrate and the second substrate come into parallel contact with each other, and uniformly impose the larger load on a bonding surface.
摘要翻译： 室温接合装置包括：角度调节机构，其将保持第一基板的第一样品台支撑到第一阶段，以便能够改变第一样品台的方向; 第一驱动装置，其以第一方向驱动第一级; 第二驱动装置，其驱动在不与第一方向平行的第二方向上保持第二基板的第二样品台; 以及当第二基板和第一基板彼此压接时支撑第一方向上的第二样品台的托架支撑台。 在这种情况下，室温接合装置可以在第一基板和第二基板上施加超过第二驱动装置的承受负荷的较大载荷。 此外，室温接合装置可以使用角度调节机构来改变第一基板的方向，使得第一基板和第二基板彼此平行接触，并且在接合表面上均匀地施加较大的负载。
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公开(公告)号：US20110277904A1
公开(公告)日：2011-11-17
申请号：US13139085
申请日：2009-09-29
申请人： Masato Kinouchi , Takayuki Goto , Satoshi Tawara , Takeshi Tsuno , Jun Utsumi , Kensuke Ide , Takenori Suzuki
发明人： Masato Kinouchi , Takayuki Goto , Satoshi Tawara , Takeshi Tsuno , Jun Utsumi , Kensuke Ide , Takenori Suzuki
CPC分类号： H01L21/6838 , B23K20/02 , B23K2101/40 , H01L21/67201 , Y10T156/10 , Y10T156/17
摘要： A room temperature bonding apparatus according to the present invention is provided with a load lock chamber having an internal space which is pressure-reduced; and a cartridge arranged in the load lock chamber. The cartridge includes an island portion formed to contact a substrate when the substrate is put on the cartridge. A flow passage is formed for the island portion to connect a space between the cartridge and the substrate to outside when the substrate is put on the cartridge. Therefore, in the room temperature bonding apparatus can prevent making the substrate is moved to the cartridge due to gas when the internal space is pressure-reduced.
摘要翻译： 根据本发明的室温接合装置设置有具有减压的内部空间的负载锁定室; 以及设置在负载锁定室中的盒。 所述盒包括当所述基板被放置在所述盒上时形成为接触基板的岛部。 当基板被放置在盒上时，形成用于岛部分的流动通道，以将盒和基板之间的空间连接到外部。 因此，室温接合装置可以防止当内部空间减压时由于气体使基板移动到墨盒。
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公开(公告)号：US20110083801A1
公开(公告)日：2011-04-14
申请号：US12811177
申请日：2008-09-29
申请人： Masato Kinouchi , Takayuki Goto , Satoshi Tawara , Takeshi Tsuno , Jun Utsumi , Kensuke Ide , Takenori Suzuki
发明人： Masato Kinouchi , Takayuki Goto , Satoshi Tawara , Takeshi Tsuno , Jun Utsumi , Kensuke Ide , Takenori Suzuki
IPC分类号： B32B37/10
CPC分类号： B32B37/1009 , B23K20/02 , B32B37/10 , B32B2309/68 , H01L21/187 , H01L21/2007 , H01L21/67092 , H01L21/67253
摘要： Provided is a cold jointing apparatus, which comprises a discharge device, a gas feeding device, a pressure gauge, a clarifying device, a pressure controller and a pressing mechanism. The discharge device discharges a gas from the inside of a chamber. The gas feeding device feeds an introduction gas to the inside of the chamber. The pressure gauge measures the pressure in the chamber. The clarifying device clarifies a first board and a second board in the chamber when the measured pressure is at a predetermined degree of vacuum. The pressure controller controls both the discharge device and the gas feeding device so that the measured pressure may be equal to a target pressure. The pressing mechanism presses the first board and the second board in the chamber when the measured pressure is that target pressure.
摘要翻译： 提供一种冷接头装置，其包括排出装置，气体供给装置，压力计，澄清装置，压力控制器和按压机构。 排出装置从室内排出气体。 气体供给装置将引入气体供给到室的内部。 压力表测量室内的压力。 当测量的压力处于预定的真空度时，澄清装置澄清室中的第一板和第二板。 压力控制器控制排出装置和气体供给装置，使得测量的压力可以等于目标压力。 当所测量的压力为目标压力时，按压机构将腔室中的第一板和第二板按压。
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公开(公告)号：US20110011536A1
公开(公告)日：2011-01-20
申请号：US12919997
申请日：2008-03-11
申请人： Takeshi Tsuno , Takayuki Goto , Masato Kinouchi , Satoshi Tawara , Jun Utsumi , Yoichiro Tsumura , Kensuke Ide , Takenori Suzuki
发明人： Takeshi Tsuno , Takayuki Goto , Masato Kinouchi , Satoshi Tawara , Jun Utsumi , Yoichiro Tsumura , Kensuke Ide , Takenori Suzuki
CPC分类号： H01L21/67778 , H01L21/67092 , H01L21/6732 , H01L21/67748 , H01L21/68 , H01L21/683 , Y10T156/1744
摘要： A room temperature bonding apparatus includes: an angle adjustment mechanism that supports a first sample stage holding a first substrate to a first stage so as to be able to change a direction of the first sample stage; a first driving device that drives the first stage in a first direction; a second driving device that drives a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table that supports the second sample stage in the first direction when the second substrate and the first substrate are brought into press contact with each other. In this case, the room temperature bonding apparatus can impose a larger load exceeding a withstand load of the second driving device on the first substrate and the second substrate. Further, the room temperature bonding apparatus can use the angle adjustment mechanism to change a direction of the first substrate such that the first substrate and the second substrate come into parallel contact with each other, and uniformly impose the larger load on a bonding surface.
摘要翻译： 室温接合装置包括：角度调节机构，其将保持第一基板的第一样品台支撑到第一阶段，以便能够改变第一样品台的方向; 第一驱动装置，其以第一方向驱动第一级; 第二驱动装置，其驱动在不与第一方向平行的第二方向上保持第二基板的第二样品台; 以及当第二基板和第一基板彼此压接时支撑第一方向上的第二样品台的托架支撑台。 在这种情况下，室温接合装置可以在第一基板和第二基板上施加超过第二驱动装置的承受负荷的较大载荷。 此外，室温接合装置可以使用角度调节机构来改变第一基板的方向，使得第一基板和第二基板彼此平行接触，并且在接合表面上均匀地施加较大的负载。
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公开(公告)号：US20050229737A1
公开(公告)日：2005-10-20
申请号：US11060767
申请日：2005-02-18
申请人： Takeshi Tsuno , Takayuki Goto , Satoshi Tawara , Masato Kinouchi , Shin Asano , Osamu Hasegawa , Takayuki Yamada , Mutsuya Takahashi
发明人： Takeshi Tsuno , Takayuki Goto , Satoshi Tawara , Masato Kinouchi , Shin Asano , Osamu Hasegawa , Takayuki Yamada , Mutsuya Takahashi
CPC分类号： B29C65/002 , B29C64/35 , B29C65/006 , B29C65/7817 , B29C66/0222 , B29C66/028 , B29C66/73161 , B29C66/7352 , B29C66/9672 , B29K2995/0072 , Y10T74/20354
摘要： A manufacturing system for a microstructure includes a rough motion stage having predetermined positioning accuracy and a large stroke length, a fine motion stage disposed on the rough motion stage and having higher positioning accuracy than the rough motion stage and a small stroke length, and the like collectively as a stage device disposed in a vacuum container, laser length measuring machines for measuring a distance to a mirror disposed on the fine motion stage, a stage control device for driving the fine motion stage by a result of measurement by the laser length measuring machines, and the like collectively as a stage control unit, and a pressing rod 44 for holding a pressure-contacting target member disposed opposite to a pressure-contacted member held by the stage device and pressure-contacting and separating the members, a pressure-contacting drive mechanism for applying a pressure-contacting force to the pressing rod 44, and the like collectively as a pressure-contacting mechanism unit.
摘要翻译： 用于微结构的制造系统包括具有预定定位精度和大行程长度的粗动作台，设置在粗动台上的精细动作台，具有比粗动作台高的定位精度和较小的行程长度等 统称为设置在真空容器中的舞台装置，用于测量与配置在微动平台上的镜子的距离的激光长度测量机，用于通过激光长度测量机测量结果驱动微动台的舞台控制装置 等等作为台架控制单元，以及按压杆44，用于保持与由台架装置保持的压接构件相对设置的受压接触目标构件，并且对构件进行压力接触和分离，压力接触 驱动机构，用于将压力接触力一体地作为压力接触mec施加到按压杆44等 汉族单位。
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9.发明申请公开(公告)号：US20070256774A1
公开(公告)日：2007-11-08
申请号：US11779805
申请日：2007-07-18
申请人： Takeshi Tsuno , Takayuki Goto , Satoshi Tawara , Masato Kinouchi , Shin Asano , Osamu Hasegawa , Takayuki Yamada , Mutsuya Takahashi
发明人： Takeshi Tsuno , Takayuki Goto , Satoshi Tawara , Masato Kinouchi , Shin Asano , Osamu Hasegawa , Takayuki Yamada , Mutsuya Takahashi
IPC分类号： B32B38/00
CPC分类号： B81C3/008
摘要： A method of and system for manufacturing a microstructure having high form accuracy and a manufacturing system is disclosed. On a rough motion stage having a predetermined positioning accuracy and a large stroke length, a fine motion stage having a small stroke length and a higher positioning accuracy is placed. First, the rough motion stage is moved to a desired position. By use of a mirror placed on a laser length measuring machine and the fine motion stage, the current position of a thin film member on the fine motion stage is precisely measured. This measurement value is feed-backed to a stage control device, and a difference between the current position and a target position is calculated by an error correcting unit. Thus, an error correcting instruction value is generated to move the fine motion stage to the target position. Thus, an error of the rough motion stage is corrected.
摘要翻译： 公开了一种用于制造具有高成形精度的微结构和制造系统的方法和系统。 在具有预定定位精度和大行程长度的粗略运动台上，放置行程长度小且定位精度较高的微动平台。 首先，粗动作阶段移动到期望的位置。 通过使用放置在激光长度测量机和精细运动台上的反射镜，精细测量薄膜部件在微动台上的当前位置。 该测量值被馈送到载物台控制装置，并且通过误差校正单元计算当前位置与目标位置之间的差。 因此，产生误差校正指令值以将微动台移动到目标位置。 因此，校正粗略运动阶段的误差。
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10.发明申请公开(公告)号：US20050233064A1
公开(公告)日：2005-10-20
申请号：US11060788
申请日：2005-02-18
申请人： Takeshi Tsuno , Takayuki Goto , Satoshi Tawara , Masato Kinouchi , Shin Asano , Osamu Hasegawa , Takayuki Yamada , Mutsuya Takahashi
发明人： Takeshi Tsuno , Takayuki Goto , Satoshi Tawara , Masato Kinouchi , Shin Asano , Osamu Hasegawa , Takayuki Yamada , Mutsuya Takahashi
CPC分类号： B81C3/008
摘要： A method of and system for manufacturing a microstructure having high form accuracy and a manufacturing system is disclosed. On a rough motion stage having a predetermined positioning accuracy and a large stroke length, a fine motion stage having a small stroke length and a higher positioning accuracy is placed. First, the rough motion stage is moved to a desired position. By use of a mirror placed on a laser length measuring machine and the fine motion stage, the current position of a thin film member on the fine motion stage is precisely measured. This measurement value is feed-backed to a stage control device, and a difference between the current position and a target position is calculated by an error correcting unit. Thus, an error correcting instruction value is generated to move the fine motion stage to the target position. Thus, an error of the rough motion stage is corrected.
摘要翻译： 公开了一种用于制造具有高成形精度的微结构和制造系统的方法和系统。 在具有预定定位精度和大行程长度的粗略运动台上，放置行程长度小且定位精度较高的微动平台。 首先，粗动作阶段移动到期望的位置。 通过使用放置在激光长度测量机和精细运动台上的反射镜，精细测量薄膜部件在微动台上的当前位置。 该测量值被馈送到载物台控制装置，并且通过误差校正单元计算当前位置与目标位置之间的差。 因此，产生误差校正指令值以将微动台移动到目标位置。 因此，校正粗略运动阶段的误差。
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