公开(公告)号：US20220315413A1

公开(公告)日：2022-10-06

申请号：US17656446

申请日：2022-03-25

申请人： Etsuji HAYAKAWA ,  Taketomo NAKANE

发明人： Etsuji HAYAKAWA ,  Taketomo NAKANE

IPC分类号： B81B7/00 ,  B81C1/00

摘要： A sensing device includes a lead frame, a first insulating film, a semiconductor integrated circuit chip provided over the lead frame via the first insulating film, and a first bonding wire via which an external derivation lead and the semiconductor integrated circuit chip are electrically coupled to each other. The sensing device includes a sensor chip disposed over the semiconductor integrated circuit chip such that a first surface of the sensor chip faces the semiconductor integrated circuit chip. The sensing device includes a sensor provided on a second surface of the sensor chip. The sensing device includes a molding resin with which the lead frame, the semiconductor integrated circuit chip, the sensor chip, and the first bonding wire are sealed. The sensor chip is electrically coupled to the semiconductor integrated circuit chip, and the molding resin has an opening in which the sensor is exposed.

公开(公告)号：US07833042B2

公开(公告)日：2010-11-16

申请号：US12309833

申请日：2007-06-29

申请人： Atsushi Nishio ,  Shinichi Asano ,  Yoshihiro Ishikawa ,  Taketomo Nakane

发明人： Atsushi Nishio ,  Shinichi Asano ,  Yoshihiro Ishikawa ,  Taketomo Nakane

IPC分类号： H01R13/62

CPC分类号： G02B6/4201 ,  G02B6/4284 ,  H01R12/7011 ,  H01R12/716 ,  H01R13/658

摘要： Provided is a connector for connecting an electronic component, which reduces noise radiation when the electronic component is connected to a substrate through the connector and driven. In a connector (100), a connector main body (130) stores a module (210) inside an opening section (110), and the connector main body is mounted on the substrate by being electrically connected to the stored module (210). The connector main body (130) is provided with a contact lead section (120b) which is lead out to the side of the connector main body (130) to be bonded to a conductor on the substrate. A cover member (160) which opens and closes by turning with a shaft section (161) at the center is pivotally supported on the connector main body (130), and the opening section (110) is covered with the cover member (160) from above. The cover member (160) is provided with a conductive skirt section (170) for covering the contact lead section (120b) from above in a closed state.

摘要翻译： 提供了一种用于连接电子部件的连接器，当电子部件通过连接器连接到基板并被驱动时，其减少了噪声辐射。 在连接器（100）中，连接器主体（130）将模块（210）存储在开口部分（110）的内部，并且连接器主体通过与存储的模块（210）电连接而安装在基板上。 连接器主体（130）设置有引出到连接器主体（130）侧以与基板上的导体接合的接触引线部（120b）。 通过在中心处的轴部（161）转动而开闭的盖构件（160）被枢转地支撑在连接器主体（130）上，并且开口部（110）被盖构件（160）覆盖， 从上面。 盖构件（160）设置有用于在关闭状态下从上方覆盖接触引线部分（120b）的导电裙部（170）。

公开(公告)号：US20080199136A1

公开(公告)日：2008-08-21

申请号：US12076976

申请日：2008-03-26

申请人： Taketomo Nakane

发明人： Taketomo Nakane

IPC分类号： G02B6/036 ,  G02B6/02

CPC分类号： G02B6/125

摘要： An optical waveguide device includes a lower cladding layer, a high refractive index region provided on the lower cladding layer, a pair of cores provided on the lower cladding layer on both sides of the high refractive index region, and an upper cladding layer provided on the high refractive index region and the pair of cores. One of the upper and lower cladding layers has a pair of band-shaped parts disposed between the high refractive index region and the pair of cores.

摘要翻译： 光波导器件包括下包层，设置在下包层上的高折射率区域，设置在高折射率区域两侧的下包层上的一对芯体和设置在该高折射率区域上的上包层 高折射率区域和一对核心。 上下包层中的一个具有设置在高折射率区域和一对芯之间的一对带状部分。

公开(公告)号：US20220310399A1

公开(公告)日：2022-09-29

申请号：US17655828

申请日：2022-03-22

申请人： Taketomo NAKANE ,  Etsuji HAYAKAWA

发明人： Taketomo NAKANE ,  Etsuji HAYAKAWA

IPC分类号： H01L21/304 ,  H01L21/78 ,  H01L21/56 ,  H01L21/027

摘要： A method for manufacturing a semiconductor device includes providing a wafer that includes a device region and a peripheral region of the device region, the device region including multiple chip regions. The method includes removing a portion of the peripheral region such that the removed portion has an annular shape. The method includes forming a protective layer on a first surface of the wafer. The method includes grinding a second surface of the wafer in which the protective layer is formed on the first surface.

公开(公告)号：US20140319628A1

公开(公告)日：2014-10-30

申请号：US14247349

申请日：2014-04-08

申请人： Taketomo Nakane ,  Yoshihiro Haseko ,  Yuki Shimazu

发明人： Taketomo Nakane ,  Yoshihiro Haseko ,  Yuki Shimazu

IPC分类号： H01L23/10 ,  H01L29/82

CPC分类号： H01L23/10 ,  B81B7/0025 ,  B81B2201/0264 ,  G01L9/0042 ,  G01L9/0052 ,  H01L23/3121 ,  H01L23/564 ,  H01L29/84 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A physical quantity detection device includes a glass substrate, a substrate including a physical quantity detection part and bonded to a first surface of the glass substrate with a hermetically sealed space being formed inside the substrate, and a function membrane formed on a second surface of the glass substrate opposite to the first surface. The function membrane prevents the second surface of the glass substrate from coming into contact with moisture in the atmosphere.

摘要翻译： 物理量检测装置包括玻璃基板，包括物理量检测部分的基板，并且在基板内形成有密封空间的玻璃基板的第一表面，并且形成在第二表面上的功能膜 玻璃基板与第一表面相对。 功能膜防止玻璃基板的第二表面与大气中的水分接触。

公开(公告)号：US20200033285A1

公开(公告)日：2020-01-30

申请号：US16491247

申请日：2018-02-26

申请人： Taketomo NAKANE

发明人： Taketomo NAKANE

IPC分类号： G01N27/22 ,  H01L21/311 ,  H01L49/02 ,  G01N27/04

摘要： A humidity sensor includes a lower electrode formed above a substrate, a first humidity sensing film covering the lower electrode, an upper electrode formed above the first humidity sensing film, and a second humidity sensing film covering the upper electrode and making contact with the first humidity sensing film through openings of the upper electrode. The upper electrode has a predetermined opening pattern. The area of the upper electrode is larger than the area of the lower electrode, and is smaller than the area of the first humidity sensing film.

公开(公告)号：US07558456B2

公开(公告)日：2009-07-07

申请号：US12076976

申请日：2008-03-26

申请人： Taketomo Nakane

发明人： Taketomo Nakane

IPC分类号： G02F1/035 ,  G02B6/12 ,  G02B6/26 ,  G02B6/28 ,  G02B6/34 ,  G02B6/42 ,  G02B6/02 ,  G02B6/10 ,  G02B6/00

CPC分类号： G02B6/125

摘要： An optical waveguide device includes a lower cladding layer, a high refractive index region provided on the lower cladding layer, a pair of cores provided on the lower cladding layer on both sides of the high refractive index region, and an upper cladding layer provided on the high refractive index region and the pair of cores. One of the upper and lower cladding layers has a pair of band-shaped parts disposed between the high refractive index region and the pair of cores.

摘要翻译： 光波导器件包括下包层，设置在下包层上的高折射率区域，设置在高折射率区域两侧的下包层上的一对芯体和设置在该高折射率区域上的上包层 高折射率区域和一对核心。 上下包层中的一个具有设置在高折射率区域和一对芯之间的一对带状部分。

公开(公告)号：US20090067799A1

公开(公告)日：2009-03-12

申请号：US12225629

申请日：2006-04-26

申请人： Taketomo Nakane

发明人： Taketomo Nakane

IPC分类号： G02B6/10 ,  B05D5/06

CPC分类号： G02B6/4214 ,  G02B6/4212 ,  G02B6/43

摘要： Scattering loss at a reflecting or transmitting end face of an optical unit is reduced, and the end face is easily manufactured at low cost. An optical waveguide cable (2) as an optical device is provided, as an optical unit, with a core layer (231, 232) serving as an optical waveguide and cladding layers (21, 22) with which the core layer (231, 232) is covered. The core layer (231, 232) and the cladding layers (21, 22) are provided with a diced facet (241) as a processed surface for reflecting light, and a smoothing film (242) is provided on the diced facet (24).

摘要翻译： 在光学单元的反射或透射端面处的散射损失减小，并且端面容易以低成本制造。 提供作为光学装置的光波导电缆（2）作为光学单元，其具有用作光波导的芯层（231,232）和包层（21,22），芯层（231,232） ）被覆盖。 芯层（231,232）和包覆层（21,22）设置有作为反射光的处理面的切割小面（241），并且在切割面（24）上设置平滑膜（242） 。

公开(公告)号：US10948448B2

公开(公告)日：2021-03-16

申请号：US16332911

申请日：2017-09-28

申请人： Taketomo Nakane

发明人： Taketomo Nakane

IPC分类号： G01N27/22 ,  G01N27/04

摘要： A humidity sensor includes a lower electrode formed on a substrate, a first moisture sensitive layer covering the lower electrode, an upper electrode formed on the first moisture sensitive layer, and having a predetermined opening pattern including a plurality of openings, and a second moisture sensitive layer covering the upper electrode, and the second moisture sensitive layer contacts the first moisture sensitive layer at the openings of the upper electrode.

公开(公告)号：US11435310B2

公开(公告)日：2022-09-06

申请号：US16491247

申请日：2018-02-26

申请人： Taketomo Nakane

发明人： Taketomo Nakane

IPC分类号： G01N27/22 ,  G01N27/04 ,  H01L21/311 ,  H01L49/02

摘要： A humidity sensor includes a lower electrode formed above a substrate, a first humidity sensing film covering the lower electrode, an upper electrode formed above the first humidity sensing film, and a second humidity sensing film covering the upper electrode and making contact with the first humidity sensing film through openings of the upper electrode. The upper electrode has a predetermined opening pattern. The area of the upper electrode is larger than the area of the lower electrode, and is smaller than the area of the first humidity sensing film.