Method for Analysing and Treating Human Milk and System Therefore
    2.
    发明申请
    Method for Analysing and Treating Human Milk and System Therefore 审中-公开
    因此,分析和处理人体乳汁和系统的方法

    公开(公告)号:US20080118615A1

    公开(公告)日:2008-05-22

    申请号:US11662349

    申请日:2005-09-02

    IPC分类号: G01N33/04 G01N33/14 G06F19/00

    CPC分类号: A23C9/206 A23L33/40

    摘要: The present invention relates to a method for analysing and treating human milk to be fed to an infant comprising the steps of collecting own mother's milk, taking a sample of the collected own mother's milk, conducting nutritional analysis on said sample, using the collected own mother's milk as nutrition for the infant and using the collected own mother's milk in the form of at least one of the group of: unchanged own mother's milk, fortified own mother's milk, unchanged components of own mother's milk and fortified components of own mother's milk, wherein said form is chosen depending on at least some of said results of the analysis and said infant's condition, the infants condition being chosen from at least one of the following parameters: infant's age, infant's weight, infant's health, infant's shortcomings, infant's deficiencies, time of day when the milk is fed to the infant.

    摘要翻译: 本发明涉及一种用于分析和处理要喂给婴儿的人乳的方法,包括以下步骤:收集自己的母乳,从所收集的母乳中抽取样品,对所述样品进行营养分析,使用收集的母亲的 牛奶作为婴儿的营养,并以至少一种以下形式使用自己母乳的形式:不变自己的母乳,强化自己的母乳,自己母乳的不变成分和自己母乳的强化成分,其中 所述形式根据所述分析的所述结果和所述婴儿的状况中的至少一些来选择,所述婴儿状况从以下参数中的至少一个中选择:婴儿的年龄,婴儿的体重,婴儿的健康,婴儿的缺点,婴儿的缺陷,时间 当牛奶喂给婴儿时。

    Loop-Back Memory-Module Extender Card for Self-Testing Fully-Buffered Memory Modules
    4.
    发明申请
    Loop-Back Memory-Module Extender Card for Self-Testing Fully-Buffered Memory Modules 有权
    环回内存模块扩展卡,用于自检全缓冲内存模块

    公开(公告)号:US20060282722A1

    公开(公告)日:2006-12-14

    申请号:US10908716

    申请日:2005-05-24

    申请人: Ramon Co Tat Lai

    发明人: Ramon Co Tat Lai

    IPC分类号: G01R31/28

    摘要: A loop-back extender card is plugged into a memory module socket on a personal computer (PC) motherboard. The extender card has a test socket that receives a memory module under test. An Advanced Memory Buffer (AMB) on the memory module fully buffers DRAM chips on the memory module. The AMB inputs from and outputs to the test socket differential northbound lanes (toward a processor) and southbound lanes (away from the processor). The extender card has northbound loopback traces that connect northbound lane outputs from the memory module back to northbound-lane inputs to the memory module. Southbound loopback traces connect southbound lane outputs from the memory module back to southbound-lane inputs to the memory module. The loop-back extender card allows the AMB to perform loopback testing without modifying the PC motherboard. Series/shunt resistors can be placed on the loopback traces, or serpentine traces can be used to increase loopback delays.

    摘要翻译: 环回延长卡插入个人计算机(PC)主板上的内存模块插槽。 扩展卡具有接收被测内存模块的测试插槽。 存储器模块上的高级存储器缓冲器(AMB)完全缓冲存储器模块上的DRAM芯片。 AMB从测试插座差分北行车道(朝向处理器)和南行车道(远离处理器)输入和输出。 扩展卡具有北向环回路线,将来自存储模块的北行车道输出连接回北行车道输入至存储模块。 南向环回路线将内存模块的南行通道输出连接回内行模块的南行通道输入。 环回延长卡允许AMB在不修改PC主板的情况下进行环回测试。 串联/并联电阻可以放置在回送轨迹上,也可以使用蛇形轨迹来增加环回延迟。

    Efficient Air-Flow Loop through Dual Burn-in Chambers with Removable Pattern-Generator Boards for Memory-Module Environmental Testing
    5.
    发明申请
    Efficient Air-Flow Loop through Dual Burn-in Chambers with Removable Pattern-Generator Boards for Memory-Module Environmental Testing 有权
    高效的气流回路通过双重烧录室与可拆卸图案发生器板进行内存模块环境测试

    公开(公告)号:US20060197546A1

    公开(公告)日:2006-09-07

    申请号:US11306753

    申请日:2006-01-10

    IPC分类号: G01R31/02

    摘要: Two heat chambers are placed side-by-side. Heated air is blown upward through a first chamber and downward through a second heat chamber. An upper heating unit has a blower and heater that heat air exiting the first chamber and blows the heated air into the top of the second chamber. A lower heating unit has a blower and heater that heat air exiting the second chamber and blows the heated air into the top of the first chamber. Air is circulated in a loop through the two heat chambers by the two heating units. Inefficiencies from return pipes are eliminated by using the second chamber. The heated air is blown past memory modules under test in a heat chamber that has an insulated backplane. Pattern-generator cards outside the heat chamber exercise the memory modules and are cooled while memory modules in the heat chamber are heated.

    摘要翻译: 两个热室并排放置。 加热空气向上穿过第一室并向下通过第二加热室。 上加热单元具有鼓风机和加热器,其加热从第一室排出的空气并将加热的空气吹入第二室的顶部。 下加热单元具有鼓风机和加热器,其加热从第二室排出的空气并将加热的空气吹入第一室的顶部。 空气通过两个加热单元通过两个加热室循环循环。 通过使用第二室来消除回流管的低效率。 被加热的空气在具有绝缘背板的加热室中被吹过被测试的存储器模块。 加热室外的图案发生器卡锻炼存储器模块,并在加热室中的存储器模块被加热时被冷却。

    Extender Card for Testing Error-Correction-Code (ECC) Storage Area on Memory Modules
    6.
    发明申请
    Extender Card for Testing Error-Correction-Code (ECC) Storage Area on Memory Modules 有权
    扩展卡用于测试内存模块上的错误纠正代码(ECC)存储区域

    公开(公告)号:US20050246594A1

    公开(公告)日:2005-11-03

    申请号:US10709156

    申请日:2004-04-16

    摘要: Memory modules with an extra dynamic-random-access memory (DRAM) chip for storing error-correction code (ECC) are tested on a personal computer (PC) motherboard tester using a cross-over extender card inserted into a memory module socket on the motherboard. ECC code generated on the motherboard is normally stored in the extra ECC DRAM chip, preventing test patterns such as checkerboards and walking-ones to be written directly to the ECC DRAM chip. During testing, the cross-over extender card routes signals from the motherboard for one of the data DRAM chips to the ECC DRAM chip, while the ECC code is routed to one of the data DRAM chips. The checkerboard or other test pattern is thus written and read from the ECC DRAM chip that normally stores the ECC code. The cross-over extender card can be hardwired, or can have a switch to allow normal operation or testing of the ECC DRAM chip.

    摘要翻译: 具有用于存储纠错码(ECC)的额外动态随机存取存储器(DRAM)芯片的存储器模块在个人计算机(PC)主板测试器上使用插入到内存模块插槽中的跨越延长卡进行测试 母板。 在主板上产生的ECC代码通常存储在额外的ECC DRAM芯片中,防止诸如棋盘和步行的测试图案直接写入ECC DRAM芯片。 在测试期间,交叉扩展卡将来自主板的信号从数据DRAM芯片中的一个传送到ECC DRAM芯片,而ECC代码被路由到数据DRAM芯片之一。 因此,棋盘或其他测试图案由通常存储ECC代码的ECC DRAM芯片写入和读出。 交叉扩展卡可以是硬连线的,或者可以有开关来允许ECC DRAM芯片的正常操作或测试。

    Manifold-Distributed Air Flow Over Removable Test Boards in a Memory-Module Burn-In System With Heat Chamber Isolated by Backplane
    7.
    发明申请
    Manifold-Distributed Air Flow Over Removable Test Boards in a Memory-Module Burn-In System With Heat Chamber Isolated by Backplane 有权
    通过背板隔离的热室的内存模块烧录系统中的可拆卸测试板上的歧管分布式气流

    公开(公告)号:US20050125712A1

    公开(公告)日:2005-06-09

    申请号:US10906318

    申请日:2005-02-14

    摘要: Hot air blown past memory modules under test in a heat chamber is improved. Hot air entering the chamber from an inlet pipe is split by a manifold and deflectors. Holes in the manifold allow for a relatively even air distribution within the chamber, minimizing temperature variations. Return air is collected by a heat-chamber bottom cover into a return pipe. A heating unit re-heats the return air and blows it into the inlet pipe. One side of the heat chamber is an insulated backplane. Memory modules are inserted into sockets on module motherboards, which are inserted into motherboard sockets on the backplane. On the other side of the backplane, card sockets receive pattern-generator cards outside the heat chamber but electrically connected to the module motherboards through the backplane. The pattern-generator cards exercise the memory modules. The pattern-generator cards are cooled while memory modules in the heat chamber are heated.

    摘要翻译: 改进了在热室中被测试的存储器模块的热空气。 从入口管进入腔室的热空气被歧管和导流器分开。 歧管中的孔允许室内相对均匀的空气分布,使温度变化最小化。 返回空气由热室底盖收集回流管。 加热单元重新加热回流空气并将其吹入入口管。 加热室的一侧是绝缘背板。 内存模块插入模块主板上的插座,插入背板主板插槽。 在背板的另一侧,卡插座在加热室外部接收图案发生器卡,但通过背板电连接到模块主板。 图案发生器卡练习内存模块。 图案发生器卡被冷却,而加热室中的存储器模块被加热。