-
公开(公告)号：US08242380B2
公开(公告)日：2012-08-14
申请号：US12148017
申请日：2008-04-16
IPC分类号： H05K1/11
CPC分类号： H05K3/4688 , H05K1/024 , H05K2201/015 , H05K2201/0195 , H05K2201/0715 , H05K2201/09672 , H05K2201/09881 , Y10T29/49124
摘要： A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second dielectric material is associated with a second current return layer. A first signal path layer is embedded in the first dielectric material and a second signal path layer is embedded in the second dielectric material, wherein the first and second signal path layers are substantially parallel to each other in a stack-up arrangement. An adhesive layer is interposed between the first dielectric material and the second dielectric material.
摘要翻译： 印刷电路板（PCB）基板及其构造方法。 在一个实施例中，第一电介质材料与第一电流返回层相关联，并且第二电介质材料与第二电流返回层相关联。 第一信号通路层被嵌入在第一电介质材料中，第二信号路径层被嵌入在第二电介质材料中，其中第一和第二信号通路层以叠层布置基本上彼此平行。 在第一电介质材料和第二电介质材料之间插入粘合剂层。
-
公开(公告)号：US20080196933A1
公开(公告)日：2008-08-21
申请号：US12148017
申请日：2008-04-16
CPC分类号： H05K3/4688 , H05K1/024 , H05K2201/015 , H05K2201/0195 , H05K2201/0715 , H05K2201/09672 , H05K2201/09881 , Y10T29/49124
摘要： A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second dielectric material is associated with a second current return layer. A first signal path layer is embedded in the first dielectric material and a second signal path layer is embedded in the second dielectric material, wherein the first and second signal path layers are substantially parallel to each other in a stack-up arrangement. An adhesive layer is interposed between the first dielectric material and the second dielectric material.
摘要翻译： 印刷电路板（PCB）基板及其构造方法。 在一个实施例中，第一电介质材料与第一电流返回层相关联，并且第二电介质材料与第二电流返回层相关联。 第一信号通路层被嵌入在第一电介质材料中，第二信号路径层被嵌入在第二电介质材料中，其中第一和第二信号通路层以叠层布置基本上彼此平行。 在第一电介质材料和第二电介质材料之间插入粘合剂层。
-
公开(公告)号：US07378598B2
公开(公告)日：2008-05-27
申请号：US10782640
申请日：2004-02-19
CPC分类号： H05K3/4688 , H05K1/024 , H05K2201/015 , H05K2201/0195 , H05K2201/0715 , H05K2201/09672 , H05K2201/09881 , Y10T29/49124
摘要： A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second dielectric material is associated with a second current return layer. A signal path layer is interposed between the first dielectric material and the second dielectric material. An adhesive layer is interposed between the first dielectric material and the second dielectric material such that the adhesive layer is substantially coplanar relative to the signal path layer.
摘要翻译： 印刷电路板（PCB）基板及其构造方法。 在一个实施例中，第一电介质材料与第一电流返回层相关联，并且第二电介质材料与第二电流返回层相关联。 信号通路层介于第一电介质材料和第二电介质材料之间。 粘合剂层介于第一电介质材料和第二电介质材料之间，使得粘合剂层相对于信号路径层基本上是共面的。
-
4.发明授权Method and apparatus for coupling light between an optoelectronic device and a waveguide 失效用于在光电子器件和波导之间耦合光的方法和装置
公开(公告)号：US5168537A
公开(公告)日：1992-12-01
申请号：US723319
申请日：1991-06-28
CPC分类号： G02B6/4214 , G02B6/32 , G02B6/4249 , G02B6/4292
摘要： A system is disclosed for optically coupling one or more electrical signals to one or more optical waveguide members. A terminating block has embedded therein a first plurality of collimating cylindrical lenses protruding from a first end of the block. A plurality of fibers, arranged longitudinally with respect to the lenses, are additionally embedded in the block and exit the block through a second end. Outside of the block, the fibers are surrounded by a protector. A redirecting assembly defines a port, sized to receive the terminating block. Also defined within the assembly is a transverse aperture having a plurality of circularly enlarged regions. The assembly has a prism secured therein. The prism is positioned so that it is aligned with the first plurality of lenses when the block is fully inserted into the port. An integrated circuit package contains a plurality of light-emitting or light-detecting devices having one or more leads. The light-emitting or light-detecting devices are positioned within substantially cylindrical holes defined in a base of the integrated circuit package. Connected to each device is a collimating cylindrical lens that protrudes into the assembly and is aligned with the prism when the assembly is affixed to the base of the integrated circuit package.
摘要翻译： 公开了一种用于将一个或多个电信号光耦合到一个或多个光波导元件的系统。 终端块已经嵌入有从块的第一端突出的第一多个准直柱面透镜。 相对于透镜纵向布置的多个纤维另外嵌入块中并通过第二端离开块。 在块之外，纤维被保护器包围。 重定向组件定义了一个端口，其大小用于接收终止块。 还在组件内限定具有多个圆形扩大区域的横向孔。 组件具有固定在其中的棱镜。 棱镜被定位成使得当块完全插入到端口中时，其与第一多个透镜对准。 集成电路封装包含多个具有一个或多个引线的发光或光检测装置。 发光或光检测装置定位在集成电路封装的基底中限定的基本上圆柱形的孔内。 连接到每个设备的是准直柱面透镜，当组件固定到集成电路封装的基座时，其突出到组件中并与棱镜对准。
-
公开(公告)号：US06744332B2
公开(公告)日：2004-06-01
申请号：US10176833
申请日：2002-06-21
IPC分类号： H01P512
CPC分类号： H01P5/12
摘要： A four-drop bus has each driver or receiver terminated at the characteristic impedance of Z0. Each driver or receiver is connected to a segment of transmission line with a characteristic impedance of Z0. Two of these segments are connected at a first point. The other two of these segments are connected at a second point. The first and second points are connected by a central transmission line with a characteristic impedance of Z0/2.
摘要翻译： 四路总线的每个驱动器或接收器终止于Z0的特性阻抗。 每个驱动器或接收器连接到具有Z0特性阻抗的传输线段。 这些段中的两个在第一点连接。 这些段中的另外两个在第二点连接。 第一点和第二点通过中心传输线连接，特性阻抗为Z0 / 2。
-
公开(公告)号：US6161215A
公开(公告)日：2000-12-12
申请号：US144299
申请日：1998-08-31
IPC分类号： H01L21/822 , G06F1/10 , G06F17/50 , H01L23/498 , H01L23/64 , H01L27/04
CPC分类号： G06F1/10 , G06F17/5077 , H01L23/49838 , H01L23/64 , H01L2224/17181 , H01L2924/00014 , H01L2924/15173 , H01L2924/3011 , H01L2224/0401
摘要： Signal delay and skew within an integrated circuit are minimized when 1) signals are distributed to distant points of an integrated circuit via a layer of its package, and 2) traces in the package layer are etched and treated as transmission lines. As disclosed herein, a signal is driven through a first connection between an integrated circuit and an integrated circuit package layer. The signal is then distributed to one or more additional connections between the integrated circuit and the integrated circuit package layer, by means of point-to-point transmission lines formed in the integrated circuit package layer, each of the transmission lines being terminated at one or both ends by impedances which are substantially matched to the characteristic impedance of the transmission line to which they are attached. The signal is then received into the integrated circuit through the one or more additional connections between the integrated circuit and the integrated circuit package layer.
摘要翻译： 当1）信号通过其封装层分布到集成电路的远端时，集成电路内的信号延迟和偏移被最小化，2）封装层中的迹线被蚀刻并被处理为传输线。 如本文所公开的，信号通过集成电路和集成电路封装层之间的第一连接被驱动。 然后，通过形成在集成电路封装层中的点对点传输线，将信号分配到集成电路和集成电路封装层之间的一个或多个附加连接，每条传输线以一个或多个 两端的阻抗基本上与其所连接的传输线的特性阻抗相匹配。 然后，该信号通过集成电路和集成电路封装层之间的一个或多个附加连接被接收到集成电路中。
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.012 秒)