公开(公告)号：US10177056B2

公开(公告)日：2019-01-08

申请号：US15661060

申请日：2017-07-27

申请人： Erick Merle Spory ,  Timothy Mark Barry

发明人： Erick Merle Spory ,  Timothy Mark Barry

IPC分类号： H01L23/10 ,  H01L23/00 ,  H01L21/66 ,  H01L23/26

摘要： A method is provided. The method includes one or more of extracting a die from an original packaged integrated circuit, modifying the extracted die, reconditioning the modified extracted die, placing the reconditioned die into a cavity of a hermetic package base, bonding a plurality of bond wires between reconditioned die pads of the reconditioned die to leads of the hermetic package base or downbonds to create an assembled hermetic package base, and sealing a hermetic package lid to the assembled hermetic package base to create a new packaged integrated circuit. Modifying the extracted die includes removing the one or more ball bonds on the one or more die pads. Reconditioning the modified extracted die includes adding a sequence of metallic layers to bare die pads of the modified extracted die. The extracted die is a fully functional semiconductor die with one or more ball bonds on one or more die pads of the extracted die.

公开(公告)号：US09870968B2

公开(公告)日：2018-01-16

申请号：US15088822

申请日：2016-04-01

申请人： Erick Merle Spory ,  Timothy Mark Barry

发明人： Erick Merle Spory ,  Timothy Mark Barry

IPC分类号： H01L23/20 ,  H01L23/10 ,  H01L21/66 ,  H01L23/00 ,  H01L23/26

CPC分类号： H01L23/10 ,  H01L22/14 ,  H01L23/26 ,  H01L24/03 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/98 ,  H01L2224/03424 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2224/8501 ,  H01L2224/85345 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/2075 ,  H01L2924/00 ,  H01L2224/32245

摘要： A packaged integrated circuit for operating reliably at elevated temperatures is provided. The packaged integrated circuit includes a reconditioned die, which includes a fully functional semiconductor die that has been previously extracted from a different packaged integrated circuit. The packaged integrated circuit also includes a hermetic package comprising a base and a lid and a plurality of bond wires. The reconditioned die is placed into a cavity in the base. After the reconditioned die is placed into the cavity, the plurality of bond wires are bonded between pads of the reconditioned die and package leads of the hermetic package base or downbonds. After bonding the plurality of bond wires, the lid is sealed to the base.