公开(公告)号：US5705230A

公开(公告)日：1998-01-06

申请号：US324460

申请日：1994-10-17

申请人： Toru Matanabe ,  Hirokazu Ezawa ,  Masahiro Miyata ,  Yukio Ikeda ,  Manabu Tsujimura ,  Hiroaki Inoue ,  Takeyuki Odaira ,  Naoaki Ogure

发明人： Toru Matanabe ,  Hirokazu Ezawa ,  Masahiro Miyata ,  Yukio Ikeda ,  Manabu Tsujimura ,  Hiroaki Inoue ,  Takeyuki Odaira ,  Naoaki Ogure

IPC分类号： C23C18/34 ,  C23C18/16 ,  C23C26/00 ,  C25D5/18 ,  C25D5/20 ,  H01L21/48 ,  H01L21/768 ,  H05K3/42 ,  B05D1/18

CPC分类号： C23C18/1608 ,  C23C18/1612 ,  C23C18/1651 ,  C23C18/1666 ,  C23C18/1831 ,  H01L21/486 ,  H01L21/76877 ,  H05K3/422

摘要： The improved method comprises contacting a substrate 5 at least once by a liquid containing the elements that compose a pure metal or an alloy with which the small holes or recesses 3a in the substrate 5 are to be filled or covered, whereby the liquid wets the inner surfaces of said small holes or recesses 3a while, at the same time, said pure metal or said alloy is deposited on the surface of said substrate 5. The method is capable of filling small holes or covering small recesses in the surface of the substrate 5 with improved efficiency while, at the same time, it improves the heat resistance and materials stability of the part that contains the formed filling or covering layer.

摘要翻译： 改进的方法包括使基底5至少一次由含有构成纯金属的元素的液体或与基底5中的小孔或凹槽3a填充或覆盖的合金相接触，由此液体润湿内部 所述小孔或凹部3a的表面，同时所述纯金属或所述合金沉积在所述基板5的表面上。该方法能够填充小孔或覆盖基板5的表面中的小凹槽 同时提高了包含形成的填充或覆盖层的部件的耐热性和材料稳定性。