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公开(公告)号：US20120138330A1
公开(公告)日：2012-06-07
申请号：US13312546
申请日：2011-12-06
CPC分类号： H01R12/55 , C25D5/10 , H01R13/03 , Y10T29/49224
摘要： The invention forms a Sn coating layer and a Cu—Sn alloy coating layer having a suitably controllable planar shape in a PCB terminal. A group of Sn coating layers being as a plurality of essentially parallel lines is formed as the surface coating layer, and a Cu—Sn alloy coating layer 2 is exposed on the outermost surface on both sides of Sn coating layers each constituting the group of Sn coating layers. The Sn coating layers have a width of 1 to 500 μm, an interval between adjacent Sn coating layers is 1 to 20000 μm, and an outermost maximum height roughness in a terminal insertion direction is at most 10 μm.
摘要翻译： 本发明在PCB端子中形成具有适当可控平面形状的Sn涂层和Cu-Sn合金涂层。 形成作为多个基本上平行的多个Sn层的一组Sn涂层作为表面被覆层，并且Cu-Sn合金涂层2暴露在构成Sn组的Sn涂层两侧的最外表面上 涂层。 Sn被覆层的宽度为1〜500μm，相邻的Sn被覆层的间隔为1〜20000μm，端子插入方向的最外侧的最高高度粗糙度为10μm以下。
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2.发明授权Material deposition techniques for control of solid state aperture surface properties 有权用于控制固态孔径表面性质的材料沉积技术公开(公告)号：US08206568B2
公开(公告)日：2012-06-26
申请号：US11015349
申请日：2004-12-17
申请人： Daniel Branton , Roy G. Gordon , Peng Chen , Toshiyuki Mitsui , Damon B. Farmer , Jene A. Golovchenko
发明人： Daniel Branton , Roy G. Gordon , Peng Chen , Toshiyuki Mitsui , Damon B. Farmer , Jene A. Golovchenko
IPC分类号： C07K1/26
CPC分类号： G01N33/48721 , B82Y15/00
摘要： The invention provides a method for molecular analysis. In the method, sidewalls are formed extending through a structure between two structure surfaces, to define an aperture. A layer of material is deposited on the aperture sidewalls and the two structure surfaces. The aperture with the deposited material layer is then configured in a liquid solution with a gradient in a chemical potential, between the two structure surfaces defining the aperture, that is sufficient to cause molecular translocation through the aperture.
摘要翻译： 本发明提供了一种分子分析方法。 在该方法中，形成延伸穿过两个结构表面之间的结构的侧壁，以限定孔。 一层材料沉积在孔侧壁和两个结构表面上。 然后将具有沉积材料层的孔配置在具有化学势的梯度的液体溶液中，限定孔的两个结构表面之间，足以使分子易位穿过孔。
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公开(公告)号：US6098846A
公开(公告)日：2000-08-08
申请号：US216729
申请日：1998-12-21
申请人： Iwao Yazawa , Toshiyuki Mitsui , Kazunori Hoshino
发明人： Iwao Yazawa , Toshiyuki Mitsui , Kazunori Hoshino
CPC分类号： B65D83/62
摘要： A double chamber aerosol container has a soft elastic inner sack, mounted within a metal container body, and a housing mounted to a top end of an inner periphery of the inner sack. The inner sack is in contact with special sized temporarily fitting portion as well as insertion contact portion of the housing to prevent the propellant from leaking out. Where an inner diameter of the top end of the inner periphery of the inner sack is 1, the outer diameter of an insertion contact portion of the housing is set to 1.02 to 0.98, the maximum outer diameter of the temporarily fitting portion is set to 0.97 to 0.95, the minimum outer diameter of the temporarily fitting portion is set to 0.94 to 0.88, and the minimum portion is formed below the maximum portion as well as the width in the up and down directions of the temporarily fitting portion is set to 0.19 to 0.10.
摘要翻译： 双室气溶胶容器具有安装在金属容器主体内的软弹性内袋，以及安装在内袋的内周的顶端的壳体。 内袋与特殊尺寸的临时装配部分以及壳体的插入接触部分接触以防止推进剂泄漏。 在内袋的内周的顶端的内径为1的情况下，外壳的插入接触部的外径设定为1.02〜0.98，临时嵌合部的最大外径设定为0.97 至0.95，临时装配部分的最小外径设定为0.94至0.88，并且最小部分形成在最大部分下方，并且临时装配部分的上下方向上的宽度设定为0.19至 0.10。
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4.发明申请COPPER ALLOY AND ELECTRICALLY CONDUCTIVE MATERIAL FOR CONNECTING PARTS, AND MATING-TYPE CONNECTING PART AND METHOD FOR PRODUCING THE SAME 有权用于连接部件的铜合金和导电材料以及制造类型的连接部件及其制造方法公开(公告)号：US20110236712A1
公开(公告)日：2011-09-29
申请号：US13069016
申请日：2011-03-22
CPC分类号： H01R43/16 , B32B15/00 , C23C28/021 , C25D5/10 , C25D5/12 , C25D5/34 , C25D5/50 , C25D5/505 , H01R13/03 , Y10T29/49204 , Y10T29/49206 , Y10T29/49224 , Y10T428/12389 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , Y10T428/12861 , Y10T428/12903
摘要： The surface roughness of a copper sheet is adjusted to have an arithmetic mean roughness Ra of 0.5 μm or more and 4.0 μm or less in a direction parallel to a sliding direction upon connection, a mean projection-depression interval RSm of 0.01 mm or more and 0.3 mm or less in the direction, a skewness Rsk of less than 0, and a protrusion peak portion height Rpk of 1 μm or less. Further, as a surface coating layer, a Sn coating layer group X observed as a plurality of parallel lines is included, and a Cu—Sn alloy coating layer is present adjacent to each side of each of Sn coating layers constituting the Sn coating layer group X. The maximum height roughness Rz is 10 μm or less in a direction of part insertion. At the time of stamping the copper sheet, the copper sheet is surface-roughened by pressing, thereby forming depressions observed as a plurality of parallel lines in the surface of the copper sheet. The copper sheet is then plated with Cu and Sn, followed by reflowing to complete the production.
摘要翻译： 将铜片的表面粗糙度调节为在连接时平行于滑动方向的方向上的算术平均粗糙度Ra为0.5μm以上且4.0μm以下，平均投影 - 凹陷间隔RSm为0.01mm以上， 方向为0.3mm以下，斜度Rsk小于0，突出峰部高度Rpk为1μm以下。 此外，作为表面被覆层，包含作为多条平行线观察到的Sn被覆层群X，并且在构成Sn被覆层组的Sn被覆层各附近存在Cu-Sn合金被覆层 最大高度粗糙度Rz在部分插入方向上为10μm以下。 在冲压铜片时，通过压制对铜箔进行表面粗糙化，从而在铜板的表面上形成作为多条平行线观察到的凹陷。 然后将铜片镀上Cu和Sn，然后回流以完成生产。
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公开(公告)号：US06286766B1
公开(公告)日：2001-09-11
申请号：US09422232
申请日：1999-10-21
申请人： Toshiyuki Mitsui , Hideaki Saito , Takeshi Kato
发明人： Toshiyuki Mitsui , Hideaki Saito , Takeshi Kato
IPC分类号： B05B724
CPC分类号： B65D83/20
摘要： A push button for powder aerosol has a push button body, a nozzle and a guide passage. The nozzle is formed in the push button body with a diameter in a range of 0.4 mm to 1.0 mm and a length in a range of 0.3 mm to 2.0 mm in communication with a stem of an aerosol container. The guide passage is formed in the push button body in continuation with an outer end of the nozzle in extending in a spraying direction of the nozzle and formed with a diameter of a range of 1.0 mm to 3.0 mm that is larger than the diameter of the nozzle and a length of a range of 3.0 mm to 20.0 mm for guiding the contents of the powder aerosol. The nozzle flows out the contents with diffusion suppressed, so that accurate application can be made to the limited range on aimed areas such as skins.
摘要翻译： 用于粉末气溶胶的按钮具有按钮体，喷嘴和引导通道。 喷嘴形成在按钮主体中，直径在0.4mm至1.0mm的范围内，并且与气溶胶容器的杆连通的长度在0.3mm至2.0mm的范围内。 引导通道形成在按钮主体中，与喷嘴的外端连续地沿着喷嘴的喷射方向延伸，并且形成为直径大于直径为1.0mm至3.0mm的直径 喷嘴，长度为3.0mm至20.0mm的范围，用于引导粉末气溶胶的内容物。 喷嘴以扩散抑制的方式流出内容物，从而可以将精确应用于目标区域（例如皮肤）的有限范围。
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6.发明授权Copper alloy and electrically conductive material for connecting parts, and mating-type connecting part and method for producing the same 有权用于连接部件的铜合金和导电材料，以及配合型连接部件及其制造方法公开(公告)号：US08956735B2
公开(公告)日：2015-02-17
申请号：US13069016
申请日：2011-03-22
IPC分类号： B32B3/30 , B32B15/01 , H01R43/16 , H01R43/00 , B32B15/00 , C23C28/02 , C25D5/10 , C25D5/12 , C25D5/34 , C25D5/50 , H01R13/03
CPC分类号： H01R43/16 , B32B15/00 , C23C28/021 , C25D5/10 , C25D5/12 , C25D5/34 , C25D5/50 , C25D5/505 , H01R13/03 , Y10T29/49204 , Y10T29/49206 , Y10T29/49224 , Y10T428/12389 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , Y10T428/12861 , Y10T428/12903
摘要： A mating-type connecting part can be obtained by stamping and surface-roughening a copper sheet into a predetermined shape with depressions as a plurality of parallel lines. The copper sheet then has a roughness of from 0.5 μm to 4.0 μm parallel to a sliding direction upon connection, a mean projection-depression interval of from 0.01 mm to 0.3 mm in that direction, a skewness less than 0, and a protrusion peak portion height of 1 μm or less. The copper sheet is then plated with Cu and Sn, followed by reflowing. The result is a connecting part having a Sn surface coating layer group as a plurality of parallel lines, and a Cu-Sn alloy coating layer adjacent to each side of each Sn surface coating layer.
摘要翻译： 可以通过将铜板冲压成表面粗糙化为具有凹陷的预定形状作为多条平行线来获得配合型连接部。 然后，铜箔的连接时的滑动方向平行于凹凸0.5μm〜4.0μm，该方向的平均投影凹陷间隔为0.01mm〜0.3mm，偏斜小于0，突起峰部分 高度为1μm以下。 然后用铜和锡镀铜片，然后回流。 结果是具有作为多条平行线的Sn表面被覆层群的连接部以及与各Sn面涂层的各侧相邻的Cu-Sn合金被覆层。
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公开(公告)号：US08835771B2
公开(公告)日：2014-09-16
申请号：US13312546
申请日：2011-12-06
CPC分类号： H01R12/55 , C25D5/10 , H01R13/03 , Y10T29/49224
摘要： The invention forms a Sn coating layer and a Cu—Sn alloy coating layer having a suitably controllable planar shape in a PCB terminal. A group of Sn coating layers being as a plurality of essentially parallel lines is formed as the surface coating layer, and a Cu—Sn alloy coating layer 2 is exposed on the outermost surface on both sides of Sn coating layers each constituting the group of Sn coating layers. The Sn coating layers have a width of 1 to 500 μm, an interval between adjacent Sn coating layers is 1 to 20000 μm, and an outermost maximum height roughness in a terminal insertion direction is at most 10 μm.
摘要翻译： 本发明在PCB端子中形成具有适当可控平面形状的Sn涂层和Cu-Sn合金涂层。 形成作为多个基本上平行的多个Sn层的一组Sn涂层作为表面被覆层，并且Cu-Sn合金涂层2暴露在构成Sn组的Sn涂层两侧的最外表面上 涂层。 Sn被覆层的宽度为1〜500μm，相邻的Sn被覆层的间隔为1〜20000μm，端子插入方向的最外侧的最高高度粗糙度为10μm以下。
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公开(公告)号：US06196275B1
公开(公告)日：2001-03-06
申请号：US09216724
申请日：1998-12-21
申请人： Iwao Yazawa , Toshiyuki Mitsui , Yukio Hachinohe , Kazuhide Maeda
发明人： Iwao Yazawa , Toshiyuki Mitsui , Yukio Hachinohe , Kazuhide Maeda
IPC分类号： B65B104
CPC分类号： B65B31/003 , B65D83/62
摘要： A double chamber aerosol container capable of filling contents in the container has a container cap that constitutes a liquid container with an inner sack to be temporarily fitted to a bead portion of an outer container while the inner sack is placed within the outer container. When the inner sack is placed with the outer container, the lower end of the inner sack is not in contact with the bottom of the interior of the outer container. The propellant is filled in the outer container upon forming a filling gap between the container cap and the bead portion, and then the container cap is surely clinched to the bead portion of the outer container.
摘要翻译： 能够填充容器内的容器的双室气溶胶容器具有容器盖，该容器盖构成具有内袋的液体容器，其将内袋临时装配到外容器的胎圈部分，同时将内袋放置在外容器内。 当内袋与外容器一起放置时，内袋的下端不与外容器内部的底部接触。 在容器盖和胎圈部之间形成填充间隙时，将推进剂填充到外容器中，然后将容器盖确定地固定在外容器的胎圈部分上。
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公开(公告)号：US6092566A
公开(公告)日：2000-07-25
申请号：US216876
申请日：1998-12-21
申请人： Iwao Yazawa , Toshiyuki Mitsui , Yukio Hachinohe , Kazunori Hoshino , Kazuhide Maeda , Koh Naito
发明人： Iwao Yazawa , Toshiyuki Mitsui , Yukio Hachinohe , Kazunori Hoshino , Kazuhide Maeda , Koh Naito
CPC分类号： B65D83/625
摘要： A double chamber aerosol container capable of filling contents in the container upon cutting off open air has an inner sack, whose volume is reducible according to reduction of contents, formed with temporarily engaging portions. A housing to which a valve assembly is arranged is inserted in the inner sack where the temporarily engaging portions are temporarily engaged with a ring-shaped neck portion of an outer container. After propellant is filled in a space between the inner sack 1 and the outer container during this temporarily engagement, the inner sack is inserted in the outer container to form the double chamber aerosol container.
摘要翻译： 能够在切断露天空气的情况下能够填充容器内的物料的双室气溶胶容器具有内袋，该内袋根据内容物的减少而减少，形成有临时接合部。 将配置有阀组件的壳体插入到内袋中，临时接合部暂时与外容器的环形颈部接合。 在该暂时接合期间，将推进剂填充在内袋1和外容器之间的空间内时，将内袋插入外容器中以形成双室气溶胶容器。
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10.发明申请Material deposition techniques for control of solid state aperture surface properties 有权用于控制固态孔径表面性质的材料沉积技术公开(公告)号：US20050241933A1
公开(公告)日：2005-11-03
申请号：US11015349
申请日：2004-12-17
申请人： Daniel Branton , Roy Gordon , Peng Chen , Toshiyuki Mitsui , Damon Farmer , Jene Golovchenko
发明人： Daniel Branton , Roy Gordon , Peng Chen , Toshiyuki Mitsui , Damon Farmer , Jene Golovchenko
IPC分类号： C23C14/32
CPC分类号： G01N33/48721 , B82Y15/00
摘要： The invention provides a method for molecular analysis. In the method, sidewalls are formed extending through a structure between two structure surfaces, to define an aperture. A layer of material is deposited on the aperture sidewalls and the two structure surfaces. The aperture with the deposited material layer is then configured in a liquid solution with a gradient in a chemical potential, between the two structure surfaces defining the aperture, that is sufficient to cause molecular translocation through the aperture.
摘要翻译： 本发明提供了一种分子分析方法。 在该方法中，形成延伸穿过两个结构表面之间的结构的侧壁，以限定孔。 一层材料沉积在孔侧壁和两个结构表面上。 然后将具有沉积材料层的孔配置在具有化学势的梯度的液体溶液中，限定孔的两个结构表面之间，足以使分子易位穿过孔。
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