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    Heat dissipation device
    3.
    发明授权
    Heat dissipation device 有权
    散热装置

    公开(公告)号：US08579019B2

    公开(公告)日：2013-11-12

    申请号：US12641340

    申请日：2009-12-18

    申请人： Shou-Biao Xu ,  Shi-Wen Zhou ,  Chun-Chi Chen

    发明人： Shou-Biao Xu ,  Shi-Wen Zhou ,  Chun-Chi Chen

    IPC分类号： H05K7/20

    CPC分类号： F28D15/0233 ,  F28D15/0275 ,  H01L23/3672 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An exemplary heat dissipation device includes a base plate, two fin groups, a core, a fan holder coupled to a top of the core, a fan located over the fin groups and secured by the fan holder, and two heat pipes. The two fin groups cooperate to define a central hole in a center thereof and have a plurality of fins extending radially and outwardly from the central hole. The core is placed on the base plate and received in the central hole. Each heat pipe comprises an evaporation section sandwiched between the core and the base plate, an arc-shaped condensation section sandwiched between the two fin groups and an adiabatic section connecting the evaporation section and the condensation section.

    摘要翻译： 示例性的散热装置包括基板，两个翅片组，芯，连接到芯的顶部的风扇支架，位于翅片组上方并由风扇支架固定的风扇和两个热管。 两个翅片组协作以在其中心形成中心孔并具有从中心孔径向向外延伸的多个翅片。 芯放置在基板上并接收在中心孔中。 每个热管包括夹在核心和基板之间的蒸发部分，夹在两个翅片组之间的弧形冷凝部分和连接蒸发部分和冷凝部分的绝热部分。

    Reference signal sounding for uplink pilot time slot in wireless communication system
    4.
    发明授权
    Reference signal sounding for uplink pilot time slot in wireless communication system 有权
    无线通信系统中上行导频时隙的参考信号探测

    公开(公告)号：US08320267B2

    公开(公告)日：2012-11-27

    申请号：US12489798

    申请日：2009-06-23

    申请人： Na Wei ,  Vijay Nangia ,  Wen Zhou ,  Brian K Classon

    发明人： Na Wei ,  Vijay Nangia ,  Wen Zhou ,  Brian K Classon

    IPC分类号： H04B7/216

    CPC分类号： H04L25/0224 ,  H04L5/0044

    摘要： A wireless terminal operating in TDD mode transmits a plurality of sounding reference signals using an assigned maximum sounding reference signal (SRS) bandwidth (BW) size. At least one of the sounding reference signals is transmitted in a corresponding uplink pilot time slot (UpPTS) region of a special sub-frame of a radio frame wherein, in the frequency dimension, an uplink BW center is misaligned with a BW center of the SRS in the UpPTS region, a maximum SRS BW size in the UpPTS region is an even number of resource blocks with prime factors from a set of {2, 3, 5}, and the maximum SRS BW having a size in number of resource blocks less than or equal to (NRBUL−6·NRA) where NRA is a number of Random Access Channel (RACH) opportunities in the UpPTS region.

    摘要翻译： 以TDD模式工作的无线终端使用分配的最大探测参考信号（SRS）带宽（BW）大小来发送多个探测参考信号。 在无线电帧的特殊子帧的相应的上行链路导频时隙（UpPTS）区域中发送至少一个探测参考信号，其中，在频率维度上，上行链路BW中心与所述无线帧的BW中心不对齐 在UpPTS区域的SRS中，UpPTS区域中的最大SRS BW大小是具有来自{2,3,5}的集合的素数的资源块的偶数，并且具有资源块数量的最大SRS BW 小于或等于（NRBUL-6·NRA），其中NRA是UpPTS区域中的随机接入信道（RACH）的机会数量。

    CONNECTOR
    5.
    发明申请
    CONNECTOR 审中-公开
    连接器

    公开(公告)号：US20120275848A1

    公开(公告)日：2012-11-01

    申请号：US13197767

    申请日：2011-08-03

    申请人： GUO CHEN ,  SHI-WEN ZHOU ,  CHUN-CHI CHEN

    发明人： GUO CHEN ,  SHI-WEN ZHOU ,  CHUN-CHI CHEN

    IPC分类号： F16B19/04

    CPC分类号： F16B5/045 ,  Y10T403/4949

    摘要： An exemplary connector includes a main body and a block engaged with the main body. The main body includes a central plate, a first extension plate extending downwardly from a lateral side of the central plate, and a second extension plate extending upwardly from an opposite lateral side of the central plate. Two riveting holes are defined through the central plate. The block includes a first securing plate and a second securing plate extending from the first securing plate and attached to the central plate of the main body. Two pins extend from the second securing plate and are punched to be engagingly received in the rivet holes of the central plate to engage with the main body.

    摘要翻译： 示例性连接器包括主体和与主体接合的块。 主体包括中心板，从中心板的侧面向下延伸的第一延伸板和从中心板的相对侧向上延伸的第二延伸板。 两个铆接孔通过中心板定义。 该块包括从第一固定板延伸并附接到主体的中心板的第一固定板和第二固定板。 两个销从第二固定板延伸并且被冲压成啮合地容纳在中心板的铆钉孔中以与主体接合。

    Heat dissipation device
    6.
    发明授权
    Heat dissipation device 失效
    散热装置

    公开(公告)号：US08245765B2

    公开(公告)日：2012-08-21

    申请号：US12200874

    申请日：2008-08-28

    申请人： Shi-Wen Zhou ,  Chun-Chi Chen

    发明人： Shi-Wen Zhou ,  Chun-Chi Chen

    IPC分类号： F28D15/00 ,  H05K7/20 ,  F25D23/12

    CPC分类号： H01L23/467 ,  F28D15/0233 ,  F28D15/0275 ,  F28F1/20 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation device dissipating heat from a heat-generating electronic element, includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing, an impeller comprising a driving member received in the housing and an axle which extends through a center of the driving member. The axle has a lower end extending downwardly through a bottom of the housing to a center of the top of the canister and an upper end extending upwardly through a top of the housing to engage the fan. The working fluid is heated by the heat-generating electronic element and vaporized into the housing to engage the driving member to rotate and drive the fan to rotate synchronously.

    摘要翻译： 从发热电子元件散热的散热装置包括：填充有相变工作流体的罐;密封地固定在罐顶部并与罐连通的外壳;位于罐顶部上方的风扇; 壳体，包括容纳在壳体中的驱动构件和延伸穿过驱动构件的中心的轴的叶轮。 轴具有向下延伸穿过壳体的底部的下端到罐的顶部的中心，并且上端向上延伸穿过壳体的顶部以接合风扇。 工作流体被发热电子元件加热并蒸发到壳体中以与驱动构件接合以旋转并驱动风扇同步旋转。

    Electronic system with heat dissipation structure
    7.
    发明授权
    Electronic system with heat dissipation structure 有权
    具有散热结构的电子系统

    公开(公告)号：US07990720B2

    公开(公告)日：2011-08-02

    申请号：US12614452

    申请日：2009-11-09

    申请人： Shou-Biao Xu ,  Shi-Wen Zhou ,  Chun-Chi Chen

    发明人： Shou-Biao Xu ,  Shi-Wen Zhou ,  Chun-Chi Chen

    IPC分类号： H05K7/20

    CPC分类号： G06F1/181 ,  G06F1/20

    摘要： An electronic system such as a computer system includes a casing defining an opening at a side thereof, a motherboard arranged in the casing, a hard disk located at a side of the motherboard and a heat dissipation structure covering the opening of the casing. The motherboard includes a printed circuit board facing toward the opening of the casing, first electronic components and second electronic components mounted on the printed circuit board and facing toward the opening. The heat dissipation structure includes a base engaging with the casing and fins extending from the base and outside of the casing. The base includes a first engaging portion contacting the first and second electronic components and a second engaging portion contacting the hard disk. The first engaging portion and the second engaging portion are in different levels from each other.

    摘要翻译： 诸如计算机系统的电子系统包括限定其侧面的开口的壳体，布置在壳体中的母板，位于母板侧的硬盘和覆盖壳体的开口的散热结构。 主板包括面向壳体的开口的印刷电路板，安装在印刷电路板上并朝向开口的第一电子部件和第二电子部件。 散热结构包括与壳体接合的基部和从基部延伸到壳体外部的翅片。 底座包括接触第一和第二电子部件的第一接合部分和接触硬盘的第二接合部分。 第一接合部分和第二接合部分彼此处于不同的高度。

    Heat dissipation device
    8.
    发明授权
    Heat dissipation device 失效
    散热装置

    公开(公告)号：US07967059B2

    公开(公告)日：2011-06-28

    申请号：US12241063

    申请日：2008-09-30

    申请人： Yi-Jiun Li ,  Shi-Wen Zhou ,  Chun-Chi Chen

    发明人： Yi-Jiun Li ,  Shi-Wen Zhou ,  Chun-Chi Chen

    IPC分类号： H05K7/20

    CPC分类号： F28D15/0275 ,  H01L23/3672 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation device includes a base, a fin group, a plurality of heat pipes connecting the base and the fin group, a fan cover covering the fin group and a fan located at a side of the fan cover. The heat pipes are received in the base and extend through the fin group. The heat pipes are received in two opposite sides of the fin group and sandwiched between the fan cover and the fin group. The fan cover includes a body and a pair of side walls extending from the body. The side walls each include a plurality of heat-dissipating fins formed on an outer surface thereof for increasing heat dissipating surface of the heat dissipating device.

    摘要翻译： 散热装置包括底座，翅片组，连接基座和翅片组的多个热管，覆盖翅片组的风扇盖和位于风扇盖侧面的风扇。 热管接收在基座中并延伸穿过翅片组。 热管被容纳在翅片组的两个相对侧并且夹在风扇盖和翅片组之间。 风扇盖包括主体和从主体延伸的一对侧壁。 侧壁各自包括形成在其外表面上的多个散热片，用于增加散热装置的散热面。

    Programmable interconnect network for logic array
    9.
    发明授权
    Programmable interconnect network for logic array 有权
    用于逻辑阵列的可编程互连网络

    公开(公告)号：US07928764B2

    公开(公告)日：2011-04-19

    申请号：US12375560

    申请日：2006-08-31

    申请人： John Jun Yu ,  Fungfung Lee ,  Wen Zhou

    发明人： John Jun Yu ,  Fungfung Lee ,  Wen Zhou

    IPC分类号： H01L25/00 ,  H03K19/173 ,  G11C5/00

    CPC分类号： H03K19/17736

    摘要： A programmable interconnect network for an array of logic cells. Said interconnect network has a plurality of switch boxes being connected in a tree structure and providing connections to its logic cells, switch boxes located at the lowest level of the tree structure are connected to logic cells; said interconnect network also has peripheral switch boxes, of which at least one is connected to an external logic. Also, an integrated circuit comprising an FP array of logic cells connected by the said programmable interconnect network and a mask programmable (MP) logic array.

    摘要翻译： 用于逻辑单元阵列的可编程互连网络。 所述互连网络具有以树结构连接的多个开关盒，并提供与其逻辑单元的连接，位于树结构的最底层的开关盒连接到逻辑单元; 所述互连网络还具有外围交换机盒，其中至少一个连接到外部逻辑。 此外，集成电路包括由所述可编程互连网络连接的逻辑单元的FP阵列和掩模可编程（MP）逻辑阵列。