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    Plants with reduced expression of phosphatase type 2C gene for enhanced pathogen resistance
    2.
    发明授权
    Plants with reduced expression of phosphatase type 2C gene for enhanced pathogen resistance 有权
    具有降低的磷酸酶2C型基因的表达以增强病原体抗性的植物

    公开(公告)号：US07910801B2

    公开(公告)日：2011-03-22

    申请号：US11762989

    申请日：2007-06-14

    申请人： Shunyuan Xiao ,  Wenming Wang

    发明人： Shunyuan Xiao ,  Wenming Wang

    IPC分类号： A01H1/00 ,  C12N15/82 ,  C12N15/87

    CPC分类号： C12N15/8279 ,  C12N15/8218

    摘要： The present invention relates to a method for down regulating an Arabidopsis protein phosphatase type 2C gene, referred to as “defense-associated protein phosphatase type 2C one” (DAPP1) that functions as a negative regulator of a plant defense pathway by contacting the gene or gene mRNA with an interfering nucleotide sequence that interacts with the gene and reducing expression thereof. Plants including such interfering nucleotide sequence exhibit increased disease resistance to pathogen even in the absence of R genes. Close homologs of DAPP1 exist in multiple crop species, and as such, the controlled down-regulation of homologous genes in a variety of crop species will enhance disease resistance of target crop species to pathogens.

    摘要翻译： 本发明涉及用于下调拟南芥属蛋白磷酸酶2C型基因的方法，称为“抗相关蛋白磷酸酶2C型”（DAPP1）（DAPP1），其作为植物防御途径的负调节剂，通过接触基因或 基因mRNA与具有与该基因相互作用并减少其表达的干扰核苷酸序列。 包括这种干扰核苷酸序列的植物即使在不存在R基因的情况下也表现出对病原体的抗病性。 DAPP1的密切同源物存在于多种作物物种中，因此，各种作物物种中同源基因的受控下调将提高目标作物对病原体的抗病性。

    ELECTROCHEMICAL METHOD AND APPARATUS FOR REMOVING COATING FROM A SUBSTRATE
    6.
    发明申请
    ELECTROCHEMICAL METHOD AND APPARATUS FOR REMOVING COATING FROM A SUBSTRATE 审中-公开
    电化学方法和装置从基板上去除涂层

    公开(公告)号：US20110083972A1

    公开(公告)日：2011-04-14

    申请号：US12901202

    申请日：2010-10-08

    申请人： Funsho K. Ojebuoboh ,  Wenming Wang

    发明人： Funsho K. Ojebuoboh ,  Wenming Wang

    IPC分类号： B23H3/00 ,  C25B9/00

    CPC分类号： C25F5/00 ,  C25F7/00

    摘要： A method of removing coating from a substrate may include contacting at least a portion of a surface of a substrate to an electrolytic substance, where at least a portion of the surface includes cadmium; connecting a power source to the substrate and to an anode material; applying a current and a voltage; and removing at least a portion of coating from the substrate.

    摘要翻译： 从基板去除涂层的方法可以包括将基材表面的至少一部分与电解质接触，其中表面的至少一部分包括镉; 将电源连接到所述基板和阳极材料; 施加电流和电压; 以及从所述基底去除至少一部分涂层。