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    Optical package fiber pass-through to reduce curvature of optical fiber during threading
    1.
    发明授权
    Optical package fiber pass-through to reduce curvature of optical fiber during threading 有权
    光纤封装光纤通过，以减少穿线期间光纤的弯曲度

    公开(公告)号：US07350987B2

    公开(公告)日：2008-04-01

    申请号：US10262356

    申请日：2002-09-30

    申请人： Marc A. Finot ,  Xiaowei Yao

    发明人： Marc A. Finot ,  Xiaowei Yao

    IPC分类号： G02B6/36

    CPC分类号： G02B6/4248 ,  G02B6/4201 ,  G02B6/4237 ,  G02B6/4251 ,  G02B6/4255

    摘要： Optoelectronic packages with one or more feed-throughs having a cutout allow optical fibers that have been coupled to a component (e.g., an optical component, an electrical component, a structural component) to be fed through more easily than a package having feed-throughs without a cutout. In one embodiment, the cut in the feed-through is on the opposite side of the initial direction of the threading. That is, if the fiber is to come from above the feed-through, the cut is placed on the bottom of the feed-through. The placement of the cut on the feed-through allows a fiber previously attached to a component to be fed through without excessive curvature of the fiber.

    摘要翻译： 具有一个或多个具有切口的馈通的光电子封装允许已经耦合到组件（例如，光学部件，电气部件，结构部件）的光纤比具有馈通的封装更容易地馈送 没有切口。 在一个实施例中，馈通中的切割与螺纹的初始方向相反。 也就是说，如果纤维从上方穿过，则将切口放置在馈通的底部。 在馈通上放置切口允许先前连接到部件的光纤被馈送而不会使光纤过度弯曲。

    Circuit package and method of plating the same
    4.
    发明授权
    Circuit package and method of plating the same 失效
    电路封装及其电镀方法

    公开(公告)号：US07019394B2

    公开(公告)日：2006-03-28

    申请号：US10674370

    申请日：2003-09-30

    申请人： Xiaowei Yao ,  Tam Nguyen ,  Marc Finot ,  Rickie C. Lake ,  Jeffrey A. Bennett ,  Robert Kohler

    发明人： Xiaowei Yao ,  Tam Nguyen ,  Marc Finot ,  Rickie C. Lake ,  Jeffrey A. Bennett ,  Robert Kohler

    IPC分类号： H01L23/053

    CPC分类号： H01L23/498 ,  C25D5/02 ,  H01L21/4846 ,  H01L23/10 ,  H01L23/15 ,  H01L23/36 ,  H01L23/3731 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/241 ,  H05K3/243 ,  H05K2201/09354 ,  H01L2924/00

    摘要： A circuit package includes a base portion and a first metal pattern disposed on a substrate surface. Second and third metal patterns are disposed on another substrate surface, and electrically coupled to first and second vias. The third metal pattern forms a gap to electrically isolate it from the second metal pattern. A circuit package includes a substrate having an opening and a single heat sink positioned in the opening to expose top and bottom surfaces through top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.

    摘要翻译： 电路封装包括基部和设置在基板表面上的第一金属图案。 第二和第三金属图案设置在另一基板表面上，并且电耦合到第一和第二通孔。 第三金属图案形成间隙以将其与第二金属图案电隔离。 电路封装包括具有开口的基板和位于开口中的单个散热器，以通过基板的顶表面和底表面露出顶表面和底表面。 选择性电镀包括将第一和第二金属图案施加到基板表面，产生第一金属图案和金属源之间的电位差，并且通过将第一金属类型吸引到第一金属图案的电压电位来镀覆第一金属图案 。 第一金属图案的电压电位小于金属源的电压电位。

    Impedance matching circuit for optical transmitter
    7.
    发明申请
    Impedance matching circuit for optical transmitter 审中-公开
    光发射机阻抗匹配电路

    公开(公告)号：US20060221427A1

    公开(公告)日：2006-10-05

    申请号：US11096837

    申请日：2005-03-31

    申请人： Xin Wu ,  Xiaowei Yao

    发明人： Xin Wu ,  Xiaowei Yao

    IPC分类号： G02F1/03

    CPC分类号： G02F1/025 ,  G02F2001/0155

    摘要： Impedance matching circuits for optical transmitters are disclosed. In one aspect, an impedance matching circuit may include an equalizer circuit, a resistor coupled between the equalizer circuit and ground, and an electro-absorption modulator or other light intensity modulator coupled in series with the equalizer circuit and coupled in parallel with the resistor. In a further aspect, the equalizer circuit may have an impedance that varies with frequency and may include an inductor, and a second resistor that is coupled in parallel with the inductor. Methods of making and using the impedance matching circuits are also disclosed. Optical transmitters, transceivers, and other systems including the impedance matching circuits are also disclosed.

    摘要翻译： 公开了用于光发射机的阻抗匹配电路。 一方面，阻抗匹配电路可以包括均衡器电路，耦合在均衡器电路和地之间的电阻器，以及与均衡器电路串联耦合并与电阻器并联耦合的电吸收调制器或其他光强度调制器。 在另一方面，均衡器电路可以具有随频率变化的阻抗，并且可以包括电感器，以及与电感器并联耦合的第二电阻器。 还公开了制造和使用阻抗匹配电路的方法。 还公开了光发射机，收发机和包括阻抗匹配电路的其他系统。