摘要:
A semiconductor integrated circuit device according to an embodiment of the present invention includes: a semiconductor substrate; an internal circuit formed on the semiconductor substrate, a first potential and a second potential being supplied to the internal circuit, thereby applying an operating voltage to the internal circuit; a fuse disposed above a semiconductor region of a first conductivity type, and electrically connected to the internal circuit, the semiconductor region being supplied with the second potential and being formed in the semiconductor substrate; and a protective element formed in the semiconductor region of the first conductivity type and protecting the internal circuit in response to positive and negative abnormal voltages generated in a wiring through which the fuse and the internal circuit are connected to each other.
摘要:
A semiconductor memory device includes a fuse element including a first terminal and a second terminal, which stores data based on whether or not it is electrically blown by a laser beam, a resistance element connected to the first terminal, a node in which the data is transferred, and a transistor provided between the resistance element and the node, which sets the data to the node.
摘要:
There is provided a semiconductor storage device in which only a defective element is replaced by a row redundant element to compensate for a defect if at least one of a plurality of elements is defective in a case where the plurality of elements in a memory cell array are simultaneously activated. The semiconductor storage device includes an array control circuit which is configured to interrupt the operation of the defective element by preventing a word line state signal from being received based on a signal to determine whether a row redundancy replacement process is performed or not. The word line state signal is input to the plurality of memory blocks in the cell array unit via a single signal line.
摘要:
A semiconductor memory device has a cell array, first normal elements each defined within the cell array as a group of memory cells arranged in a first direction of the cell array, second normal elements each defined within the cell array as a group of memory cells arranged in a second direction of the cell array, each the second normal element selecting a memory cells in operative association with a corresponding one of the first normal elements, first redundant elements disposed for replacement of defective first normal elements within the cell array, and second redundant elements disposed for replacement of defective second normal elements within the cell array. There are defined within the cell array first/second repair regions as a group of first/second normal elements with permission of replacement by each first/second redundant element.
摘要:
There is provided a semiconductor storage device in which only a defective element is replaced by a row redundant element to compensate for a defect if at least one of a plurality of elements is defective in a case where the plurality of elements in a memory cell array are simultaneously activated. The semiconductor storage device includes an array control circuit which is configured to interrupt the operation of the defective element by preventing a word line state signal from being received based on a signal to determine whether a row redundancy replacement process is performed or not. The word line state signal is input to the plurality of memory blocks in the cell array unit via a single signal line.
摘要:
In a semiconductor memory device, assuming that the ratio of a memory capacity of a region of a memory array per one of elements, which are simultaneously activated in the memory array in which x elements (x is an integer of two or more) are simultaneously activated and which is divided into a plurality of repair regions, each of which has at least two elements, to a memory capacity in one of the repair regions corresponding to one of spare element groups is y (y is an integer of one or more), each of the repair regions is designed so that a plurality of elements are simultaneously activated in its own repair region, and each of the spare element groups is designed so that the number of spare elements simultaneously activated in each of the spare element groups is one. Thus, it is possible to effectively reduce electric current consumption in the total of redundant control circuits.
摘要:
A semiconductor memory device has sets of address fuses which are arranged in a plurality of fuse rows in order to provide a larger number of redundant elements. The sets of address fuses are associated with addresses, respectively, and at least one address fuse included in each of the sets of the address fuses is provided in only one of the fuse rows. Address buses are provided such that the number of address lines associated with the sets of the address fuses is less than the number of fuse rows. One of the address lines is located closer to one of the fuse rows which includes associated address fuses than a center line between the one of the fuse rows and another one of the fuse rows which is adjacent to the one of the fuse rows is. The address lines are connected to redundant element control circuits through local lines.
摘要:
A method and apparatus for repairing a semiconductor memory device. A row redundancy replacement arrangement is provided to repair the memory device consisting of a first plurality of redundant true word lines and a second plurality of redundant complement word lines to simultaneously replace the same first number of first normal word lines and the same second number of the normal complement word lines. An address reordering scheme, preferably implemented as a word line selector circuit and controlled by redundancy control logic and address inputs, allows the redundant true (complement) word lines to replace the normal true (complement) word lines when making the repair. The redundancy replacement arrangement ensures that consistency of the bit map is maintained at all times, irrespective whether the memory device operates in a normal or in a redundancy mode. This approach introduces an added flexibility of incorporating the redundancy replacement without affecting the column access speed.
摘要:
An integrated semiconductor device is disclosed which has a highly-integrated circuit formed on a substrate. A constant voltage generator is connected to the integrated circuit, for receiving an externally-supplied d.c. power supply voltage to produce a regulated d.c. voltage, the potential level of which is lower than the external power supply voltage and remains substantially constant irrespective of the external power supply voltage. A mode-change controller is connected in parallel with the voltage generator, for supplying the output d.c. voltage of the voltage generator to the integrated circuit as an internal power supply voltage in a normal operation mode. When the device is subjected to an accelerated test using an increased power supply voltage, a switching transistor is rendered conductive under the control of a control circuit, thereby allowing the external power supply voltage to be directly applied to the integrated circuit.
摘要:
An amplitude limiting circuit is arranged in a DRAM with (1/2) VCC precharge to equalize an amplitude between a precharge voltage and an "H" level output of each pair of bit lines charged and discharged in an active cycle with an amplitude of the precharge voltage and an "L" level output of each pair of bit lines.