公开(公告)号：US06984878B2

公开(公告)日：2006-01-10

申请号：US10851112

申请日：2004-05-24

申请人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

发明人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

IPC分类号： H01L23/495

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/15 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A leadless leadframe with an improved die pad for mold locking includes a die pad and a plurality of leads. The leads are arranged around the die pad. A plurality of indentations, such as side semi-vias, are formed on the sidewall of the die pad for filling a package body of the semiconductor package so as to enhance the horizontal mold locking capability of the die pad.

摘要翻译： 具有用于模具锁定的改进的芯片焊盘的无引线框架包括芯片焊盘和多个引线。 引线布置在管芯焊盘的周围。 在管芯焊盘的侧壁上形成多个凹口，例如侧半通孔，用于填充半导体封装的封装体，以增强管芯焊盘的水平模具锁定能力。

公开(公告)号：US20050260795A1

公开(公告)日：2005-11-24

申请号：US10973385

申请日：2004-10-27

申请人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

发明人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

IPC分类号： H01L21/58 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/15 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for fabricating leadless packages with mold locking characteristics is disclosed. A provided leadless leadframe has a plurality of units in a matrix, each unit includes an improved die pad with a plurality of indentations, such as semi-vias in the sidewall thereof and a plurality of leads around the die pad. After chip attachment and electrical connection, a plurality of package bodies for semiconductor packages are individually formed on the corresponding units and covered the indentations in order to enhance the horizontal mold locking capability of the die pad. Using punching, connecting bars of the leadless leadframe are removed to isolate the leadless packages.

摘要翻译： 公开了一种用于制造具有锁模特性的无引线封装的方法。 提供的无引线框架具有矩阵中的多个单元，每个单元包括具有多个凹口的改进的管芯焊盘，例如其侧壁中的半通孔和围绕管芯焊盘的多个引线。 在芯片附接和电连接之后，用于半导体封装的多个封装主体分别形成在相应的单元上并覆盖压痕，以便提高芯片焊盘的水平模具锁定能力。 使用无引线框架的冲孔，连接条来拆除无引线封装。

公开(公告)号：US20050258521A1

公开(公告)日：2005-11-24

申请号：US10851112

申请日：2004-05-24

申请人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

发明人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

IPC分类号： H01L21/58 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/15 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A leadless leadframe with an improved die pad for mold locking includes a die pad and a plurality of leads. The leads are arranged around the die pad. A plurality of indentations, such as side semi-vias, are formed on the sidewall of the die pad for filling a package body of the semiconductor package so as to enhance the horizontal mold locking capability of the die pad.

摘要翻译： 具有用于模具锁定的改进的芯片焊盘的无引线框架包括芯片焊盘和多个引线。 引线布置在管芯焊盘的周围。 在管芯焊盘的侧壁上形成多个凹口，例如侧半通孔，用于填充半导体封装的封装体，以增强管芯焊盘的水平模具锁定能力。

公开(公告)号：US07211467B2

公开(公告)日：2007-05-01

申请号：US10973385

申请日：2004-10-27

申请人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

发明人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

IPC分类号： H01L21/00

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/15 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for fabricating leadless packages with mold locking characteristics is disclosed. A provided leadless leadframe has a plurality of units in a matrix, each unit includes an improved die pad with a plurality of indentations, such as semi-vias in the sidewall thereof and a plurality of leads around the die pad. After chip attachment and electrical connection, a plurality of package bodies for semiconductor packages are individually formed on the corresponding units and covered the indentations in order to enhance the horizontal mold locking capability of the die pad. Using punching, connecting bars of the leadless leadframe are removed to isolate the leadless packages.

摘要翻译： 公开了一种用于制造具有锁模特性的无引线封装的方法。 提供的无引线框架具有矩阵中的多个单元，每个单元包括具有多个凹口的改进的管芯焊盘，例如其侧壁中的半通孔和围绕管芯焊盘的多个引线。 在芯片附接和电连接之后，用于半导体封装的多个封装主体分别形成在相应的单元上并覆盖压痕，以便提高芯片焊盘的水平模具锁定能力。 使用无引线框架的冲孔，连接条来拆除无引线封装。

公开(公告)号：US20060199308A1

公开(公告)日：2006-09-07

申请号：US11068799

申请日：2005-03-02

申请人： Yong-Gill Lee ,  Jin-Young Hong ,  Hyung-Jun Park ,  Jin-Hee Won

发明人： Yong-Gill Lee ,  Jin-Young Hong ,  Hyung-Jun Park ,  Jin-Hee Won

IPC分类号： H01L21/50

CPC分类号： H01L21/6835 ,  H01L21/4828 ,  H01L21/561 ,  H01L21/568 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A process for manufacturing sawing type leadless semiconductor packages includes a post mold-curing step, which is performed after an encapsulant is formed and after connecting bars of a leadframe are removed. The connecting bars are formed between a plurality of package units of the leadframe to connect a plurality of leads in the package units. After die attachment and electrical connection, the encapsulant is formed over the package units and the connecting bars to encapsulate the chips. The connecting bars are removed prior to the post mold-curing step. Therefore the encapsulant can be cured without deformation or warpage, thereby facilitating the sequent processes.

摘要翻译： 一种用于制造锯切型无引线半导体封装件的方法，包括在形成密封剂之后并且在引线框架的连接条被移除之后进行的后模具固化步骤。 连接杆形成在引线框架的多个封装单元之间，以连接封装单元中的多个引线。 在管芯附接和电连接之后，密封剂形成在封装单元和连接条上以封装芯片。 在后模具固化步骤之前移除连接杆。 因此，密封剂可以在没有变形或翘曲的情况下固化，从而便于后续处理。

公开(公告)号：US08478302B2

公开(公告)日：2013-07-02

申请号：US13176955

申请日：2011-07-06

申请人： Seong-Hyeon Chae ,  Sang-Heon Kim ,  Hee-Won Kang ,  Jin-Hee Won

发明人： Seong-Hyeon Chae ,  Sang-Heon Kim ,  Hee-Won Kang ,  Jin-Hee Won

IPC分类号： H04W4/02

CPC分类号： H04W4/02 ,  H04W72/048

摘要： A method, an Advanced Base Station (ABS) and an Advanced Mobile Station (AMS) for transmitting Location Based Service (LBS) resource allocation information by an ABS in a mobile communication system are provided. The ABS transmits LBS resource allocation information including LBS zone configuration information representing an LBS zone transmission period. The LBS zone configuration information includes at least one of first information indicating that LBS zone transmission is switched off, second information indicating that the LBS zone transmission period corresponds to a first number of super frames, third information indicating that the LBS zone transmission period corresponds to a second number of super frames, and fourth information indicating that the LBS zone transmission period corresponds to a third number of super frames.

摘要翻译： 提供了一种用于在移动通信系统中通过ABS发送基于位置服务（LBS）资源分配信息的方法，高级基站（ABS）和高级移动站（AMS）。 ABS发送包括LBS区域配置信息的LBS资源分配信息，其表示LBS区域传输周期。 LBS区域配置信息包括指示LBS区域传输被关闭的第一信息中的至少一个，指示LBS区域传输周期对应于第一数量超帧的第二信息，指示LBS区域传输周期对应于的第三信息 第二数量的超帧，以及指示LBS区域发送周期对应于第三数量超帧的第四信息。

公开(公告)号：US08315208B2

公开(公告)日：2012-11-20

申请号：US12756458

申请日：2010-04-08

申请人： Jae-Hee Cho ,  Byung-Wook Jun ,  Jin-Hee Won ,  Yung-Soo Kim ,  Jong-Hyung Kwun ,  Ju-Mi Lee ,  Young-Bo Cho

发明人： Jae-Hee Cho ,  Byung-Wook Jun ,  Jin-Hee Won ,  Yung-Soo Kim ,  Jong-Hyung Kwun ,  Ju-Mi Lee ,  Young-Bo Cho

IPC分类号： H04W4/00 ,  H04L12/28 ,  H04W36/00 ,  H04W40/00

CPC分类号： H04W48/16 ,  H04W84/045

摘要： An apparatus and a method for detecting a femto Base Station (BS) of a Mobile Station (MS) in a wireless communication system including a macro BS and a femto BS are provided. The method includes receiving a request, from the macro BS, to monitor an UpLink (UL) signal of an MS permissible by the femto BS to access, and monitoring the UL signal of the MS permissible to access.

摘要翻译： 提供了一种用于在包括宏BS和毫微微BS的无线通信系统中检测移动台（MS）的毫微微基站（BS）的装置和方法。 该方法包括接收来自宏BS的请求，以监视由毫微微BS允许的MS访问的MS的UpLink（UL）信号，以及监视允许接入的MS的UL信号。

公开(公告)号：US09063216B2

公开(公告)日：2015-06-23

申请号：US13210649

申请日：2011-08-16

申请人： Jin-Hee Won ,  Sang-Heon Kim ,  Seong-Hyeon Chae ,  Hee-Won Kang

发明人： Jin-Hee Won ,  Sang-Heon Kim ,  Seong-Hyeon Chae ,  Hee-Won Kang

IPC分类号： H04W4/00 ,  H04W24/00 ,  H04B1/38 ,  G01S5/14 ,  G01S5/02 ,  H04W64/00 ,  H04W8/26

CPC分类号： G01S5/14 ,  G01S5/0236 ,  H04W8/26 ,  H04W64/00

摘要： A method and an apparatus for providing a location based service in a wireless communication system are provided. A method of a Base Station (BS) for a Location Based Service (LBS) in a wireless communication system includes allocating identifiers to a plurality of transmission devices in a service coverage area of the BS, generating a Reference Signal (RS) including the identifier of the corresponding transmission device and an identifier of the BS with respect to each of the transmission devices, and transmitting the RS generated for each of the transmission devices, to a Mobile Station (MS) via the corresponding transmission device.

摘要翻译： 提供了一种用于在无线通信系统中提供基于位置的服务的方法和装置。 在无线通信系统中用于基于位置的服务（LBS）的基站（BS）的方法包括：向BS的服务覆盖区域中的多个传输设备分配标识符，生成包括标识符的参考信号（RS） 和相对于每个传输设备的BS的标识符，并且通过相应的传输设备将为每个传输设备生成的RS发送到移动台（MS）。

公开(公告)号：US08503352B2

公开(公告)日：2013-08-06

申请号：US12912044

申请日：2010-10-26

申请人： Sang-Heon Kim ,  Jae-Weon Cho ,  Hee-Won Kang ,  Jin-Hee Won

发明人： Sang-Heon Kim ,  Jae-Weon Cho ,  Hee-Won Kang ,  Jin-Hee Won

IPC分类号： H04B7/204 ,  H04J1/00 ,  H04J3/24 ,  H04M3/42

CPC分类号： H04L5/0048 ,  G01S1/042 ,  G01S5/0226 ,  H04L1/1812 ,  H04W4/02 ,  H04W64/00

摘要： A method and apparatus for transmitting/receiving a reference signal for positioning in a wireless communication system are provided. In the method, a BS locates a PA preamble in a second frame among frames constituting each of multiple superframes, locates a SA preamble in first symbols of first and third frames among the frames constituting each of the multiple superframes, determines multiple consecutive first superframes belonging to an LBS zone from among the multiple superframes, includes a reference signal for LBS in a first symbol of a first subframe of a last frame among frames constituting each of the first superframes, includes data in a first symbol of a first subframe of a last frame among frames constituting each of second superframes that correspond to the multiple superframes excluding the first superframes when the data is to be transmitted, and communicates with an MS by using the first and second superframes.

摘要翻译： 提供了一种用于在无线通信系统中发送/接收用于定位的参考信号的方法和装置。 在该方法中，BS在构成多个超帧中的每一帧的帧之间的第二帧中定位PA前导码，在构成多个超帧中的每一个的帧中的第一和第三帧的第一符号中定位SA前导码，确定属于多个超帧的多个连续的第一超帧 包括在构成每个第一超帧的帧中的最后帧的第一子帧的第一符号中的LBS的参考信号，包括最后一帧的第一子帧的第一符号中的数据 构成与除了第一超帧之外的多个超帧对应的第二超帧的帧中的帧，并且通过使用第一和第二超帧与MS通信。