公开(公告)号：US20070178237A1

公开(公告)日：2007-08-02

申请号：US11496026

申请日：2006-07-31

申请人： Dong Shin ,  Ji Kim ,  Dae Kim ,  Sung Kim ,  Kyung Choi ,  Hee Park ,  Jung Ahn ,  Jae Choi ,  Sang Yoo ,  Yoon Heo ,  Han Kim ,  Jeong Yoon

发明人： Dong Shin ,  Ji Kim ,  Dae Kim ,  Sung Kim ,  Kyung Choi ,  Hee Park ,  Jung Ahn ,  Jae Choi ,  Sang Yoo ,  Yoon Heo ,  Han Kim ,  Jeong Yoon

IPC分类号： B05D5/00 ,  B05D3/12 ,  B05C1/00

CPC分类号： G03F7/0002 ,  B41M3/003 ,  B41M3/16 ,  B82Y10/00 ,  B82Y40/00 ,  G02F1/1303 ,  G02F1/1333 ,  G02F1/133516 ,  H01L27/1292

摘要： The invention provides a method for patterning coatings which includes the steps of: a) applying coatings onto a flat plate; b) allowing the coatings applied to the flat plate to contact with protrusions of a substrate so as to transfer portions of the coatings on the flat plate which contact with the protrusions of the substrate to the protrusions of the substrate from the flat plate, the substrate having unevenness formed with the protrusions and grooves; and c) allowing the coatings remaining on the flat plate or on the protrusions of the substrate to contact with a print surface of a print object so as to transfer the coatings to the print object. The method has simple processes, and ensures high precision and high speed in patterning functional materials, preferalby, electronic materials.

摘要翻译： 本发明提供一种用于图案化涂层的方法，其包括以下步骤：a）将涂层施加到平板上; b）允许施加到平板的涂层与基板的突起接触，以便将与基板的突起接触的平板上的涂层的一部分从平板，基板 具有由突起和槽形成的凹凸; 以及c）允许残留在平板上或基板的突起上的涂层与印刷对象的印刷表面接触，以便将涂层转移到印刷对象。 该方法工艺简单，确保了功能材料图案的高精度和高速度，优选电子材料。

公开(公告)号：US20080047897A1

公开(公告)日：2008-02-28

申请号：US11840187

申请日：2007-08-16

申请人： In-Ho Jeong ,  Jae-Dong Hwang ,  Sung-Kwang Eun ,  Byung-Moon Choi ,  Sun-Pil Kim ,  Deung-Yoon Heo

发明人： In-Ho Jeong ,  Jae-Dong Hwang ,  Sung-Kwang Eun ,  Byung-Moon Choi ,  Sun-Pil Kim ,  Deung-Yoon Heo

IPC分类号： C02F9/00 ,  C02F9/02 ,  C02F9/04

CPC分类号： C02F1/441 ,  C02F1/20 ,  C02F1/66 ,  C02F1/76 ,  C02F9/00 ,  C02F2001/425 ,  C02F2103/346 ,  C02F2209/06 ,  C02F2303/04 ,  C02F2303/185

摘要： A method of recycling waste water is preferably provided in which hardness and gas are removed from the waste water. Additionally, salt and organic carbon are preferably removed from the waste water using high-efficiency reverse osmosis. The pH of the waste water can be controlled to optimize the processes. The recycled semiconductor waste water can then be made available for use as industrial water for performing a semiconductor fabrication process. As a result, a cost for manufacturing a semiconductor device may be reduced. The principles of the present invention also provide a more environmentally friendly manufacturing method, since it produces less semiconductor waste water when being performed than conventional methods.

摘要翻译： 优选提供回收废水的方法，其中从废水中除去硬度和气体。 此外，优选使用高效反渗透从废水中除去盐和有机碳。 可以控制废水的pH以优化工艺。 再循环的半导体废水然后可以作为工业用水进行半导体制造过程。 结果，制造半导体器件的成本可能降低。 本发明的原理还提供了一种更环保的制造方法，因为当与常规方法相比时，其产生较少的半导体废水。