公开(公告)号：US08796835B2

公开(公告)日：2014-08-05

申请号：US13153953

申请日：2011-06-06

Applicant: Yoon-Hoon Kim ,  Joong-Hyun Baek ,  Eun-Seok Cho

Inventor： Yoon-Hoon Kim ,  Joong-Hyun Baek ,  Eun-Seok Cho

IPC: H01L23/02

CPC classification number: H01L23/367 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided is a package on package (POP) having improved thermal and electric signal transmitting characteristics. The POP may include a first semiconductor package, a second semiconductor package larger than the first semiconductor package and mounted on the first semiconductor package, and a heat slug adhered to a bottom of a second substrate of the second semiconductor package and surrounding a side of the first semiconductor package. The heat slug may be a capacitor.

Abstract translation: 提供了具有改进的热和电信号传输特性的封装（POP）封装（POP）。 POP可以包括第一半导体封装，大于第一半导体封装并安装在第一半导体封装上的第二半导体封装，以及粘附到第二半导体封装的第二衬底的底部并围绕第二半导体封装的一侧的热块 第一个半导体封装。 散热片可以是电容器。

公开(公告)号：US20110304035A1

公开(公告)日：2011-12-15

申请号：US13153953

申请日：2011-06-06

Applicant: Yoon-hoon Kim ,  Joong-hyun Baek ,  Eun-seok Cho

Inventor： Yoon-hoon Kim ,  Joong-hyun Baek ,  Eun-seok Cho

IPC: H01L25/11

CPC classification number: H01L23/367 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided is a package on package (POP) having improved thermal and electric signal transmitting characteristics. The POP may include a first semiconductor package, a second semiconductor package larger than the first semiconductor package and mounted on the first semiconductor package, and a heat slug adhered to a bottom of a second substrate of the second semiconductor package and surrounding a side of the first semiconductor package. The heat slug may be a capacitor.

Abstract translation: 提供了具有改进的热和电信号传输特性的封装（POP）封装（POP）。 POP可以包括第一半导体封装，大于第一半导体封装并安装在第一半导体封装上的第二半导体封装，以及粘附到第二半导体封装的第二衬底的底部并围绕第二半导体封装的一侧的热块 第一个半导体封装。 散热片可以是电容器。