INTER-LOW-PERMITTIVITY LAYER INSULATING FILM, AND METHOD FOR FORMING INTER-LOW-PERMITTIVITY LAYER INSULATING FILM
    1.
    发明申请
    INTER-LOW-PERMITTIVITY LAYER INSULATING FILM, AND METHOD FOR FORMING INTER-LOW-PERMITTIVITY LAYER INSULATING FILM 审中-公开
    低密度层绝缘膜和低密度层绝缘膜的形成方法

    公开(公告)号:US20120328798A1

    公开(公告)日:2012-12-27

    申请号:US13582029

    申请日:2011-02-25

    IPC分类号: C09D5/00 C23C16/28

    摘要: A low-permittivity interlayer insulating film of the present invention is formed by a plasma CVD method and includes at least carbon and silicon, wherein a ratio of the carbon to the silicon is 2.5 or more, and relative permittivity is 3.8 or less. Also, a film formation method of a low-permittivity interlayer insulating film of the present invention includes forming a film of an insulating film material that includes at least carbon and silicon by a plasma CVD method, wherein a hydrocarbon is not used as the insulating film material, and a ratio of the carbon to the silicon is 2.5 or more, and relative permittivity is 3.8 or less in the formed low-permittivity interlayer insulating film.

    摘要翻译: 本发明的低介电常数层间绝缘膜通过等离子体CVD法形成,至少包括碳和硅,其中碳与硅的比例为2.5以上,相对介电常数为3.8以下。 此外,本发明的低介电常数层间绝缘膜的成膜方法包括通过等离子体CVD法形成至少包含碳和硅的绝缘膜材料的膜,其中不使用烃作为绝缘膜 在形成的低介电常数层间绝缘膜中,碳与硅的比例为2.5以上,相对介电常数为3.8以下。