公开(公告)号：US4638624A

公开(公告)日：1987-01-27

申请号：US554406

申请日：1983-11-22

申请人： Soichi Hakoyama ,  Shigetatu Mori ,  Yoshiyuki Takebe ,  Kanya Imaoka

发明人： Soichi Hakoyama ,  Shigetatu Mori ,  Yoshiyuki Takebe ,  Kanya Imaoka

IPC分类号： D02G3/24 ,  D02G1/06 ,  D01H7/92 ,  D02G3/38

CPC分类号： D02G1/06

摘要： The present invention provides a false twist crimped yarn having an improved coherent structure which is produced by the specific mode of processing realized by defining the processing conditions of false twist crimping system. Here the unitary effect generally takes the form of a structure in which several of the yarn composing filaments fasciate the rest of the filaments and accordingly the false twist crimped yarn can be submitted to the weaving process without undergoing the sizing, twisting and interlacing required conventionally.

摘要翻译： 本发明提供了一种具有改进的相干结构的假捻卷曲纱，其通过限定假捻卷曲系统的加工条件而实现的特定加工模式产生。 这里的整体效果通常采用这样一种结构的形式，其中几根构成长丝的纱线使其余长丝变形，因此假捻卷曲纱线可以经受编织过程，而不经历常规上的施胶，扭转和交织。

公开(公告)号：US07645514B2

公开(公告)日：2010-01-12

申请号：US10541586

申请日：2003-12-26

申请人： Koji Watanabe ,  Toshio Enami ,  Yoshiyuki Takebe ,  Tatsuo Suzuki

发明人： Koji Watanabe ,  Toshio Enami ,  Yoshiyuki Takebe ,  Tatsuo Suzuki

IPC分类号： B32B27/38 ,  C09J163/00 ,  C08L63/00

CPC分类号： C09J9/02 ,  C08L63/00 ,  C08L2666/22 ,  C09J7/10 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J2201/602 ,  C09J2463/00 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31525 ,  Y10T428/31529

摘要： It is an object of the invention to provide a curable resin composition excellent in mechanical strength, heat resistance, moisture resistance, flexibility, resistance to thermal cycles, resistance to solder reflow, dimensional stability, and the like after curing and providing high adhesion reliability and conduction reliability and an adhesive epoxy resin paste, an adhesive epoxy resin sheet, a conductive connection paste, and a conductive connection sheet using the curable resin composition, and an electronic component joined body. The invention relates to a curable resin composition, which contains an epoxy resin, a solid polymer having a functional group to react with the epoxy group and a curing agent for an epoxy resin, no phase separation structure being observed in a matrix of a resin when a cured product is dyed with a heavy metal and observed with a transmission electron microscope.

摘要翻译： 本发明的目的是提供一种在固化后机械强度，耐热性，耐湿性，柔韧性，耐热循环性，耐回焊性，尺寸稳定性等优异的粘合可靠性和高粘合性的固化性树脂组合物， 导电可靠性和粘合剂环氧树脂糊，粘合环氧树脂片，导电连接膏和使用该固化树脂组合物的导电连接片和电子部件接合体。 本发明涉及含有环氧树脂，具有与环氧基反应的官能团的固体聚合物和环氧树脂固化剂的固化性树脂组合物，在树脂基体中没有观察到相分离结构， 固化产物用重金属染色并用透射电子显微镜观察。

公开(公告)号：US20100099240A1

公开(公告)日：2010-04-22

申请号：US12374285

申请日：2007-07-19

申请人： Kouji Watanabe ,  Kazuyuki Shohara ,  Shota Matsuda ,  Masateru Fukuoka ,  Yoshiyuki Takebe

发明人： Kouji Watanabe ,  Kazuyuki Shohara ,  Shota Matsuda ,  Masateru Fukuoka ,  Yoshiyuki Takebe

IPC分类号： H01L21/78 ,  B32B33/00 ,  B32B27/30 ,  B32B5/16

CPC分类号： H01L24/83 ,  C09J7/385 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01094 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  Y10T428/25 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2891 ,  H01L2924/00 ,  H01L2924/3512

摘要： Obtained is a dicing and die bonding tape that makes it possible to pick up a semiconductor chip easily and reliably in dicing a semiconductor wafer to pickup the semiconductor chip together with the whole die bonding film. A dicing and die bonding tape used in dicing of a wafer, in obtaining a semiconductor chip, and in die bonding of the semiconductor chip, the dicing and die bonding tape having a die bonding film 3, and a non pressure sensitive adhesive film 4 bonded on one surface of the die bonding film 3, the separation strength between the die bonding film 3 and the non pressure sensitive adhesive film 4 being within a range of 1 to 6 N/m, the shear strength between the die bonding film 3 and the non pressure sensitive adhesive film 4 being 0.3 to 2 N/mm2.

摘要翻译： 获得的是切割和芯片粘合胶带，使得可以容易且可靠地拾取半导体芯片以切割半导体晶片以与整个芯片接合膜一起拾取半导体芯片。 用于切割晶片，获得半导体芯片以及半导体芯片的芯片接合，具有芯片接合薄膜3的切割和芯片粘合带以及粘结的非压敏粘合薄膜4的切割和芯片粘结胶带 在芯片接合薄膜3的一个表面上，芯片接合薄膜3和非压敏粘合薄膜4之间的分离强度在1至6N / m的范围内，芯片接合薄膜3与裸片接合薄膜3之间的剪切强度 非压敏粘合膜4为0.3〜2N / mm 2。

公开(公告)号：US20060154078A1

公开(公告)日：2006-07-13

申请号：US10541586

申请日：2003-12-26

申请人： Koji Watanabe ,  Toshio Enami ,  Yoshiyuki Takebe ,  Tatsuo Suzuki

发明人： Koji Watanabe ,  Toshio Enami ,  Yoshiyuki Takebe ,  Tatsuo Suzuki

IPC分类号： B32B27/38 ,  C08L63/00

CPC分类号： C09J9/02 ,  C08L63/00 ,  C08L2666/22 ,  C09J7/10 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J2201/602 ,  C09J2463/00 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31525 ,  Y10T428/31529

摘要： It is an object of the invention to provide a curable resin composition excellent in mechanical strength, heat resistance, moisture resistance, flexibility, resistance to thermal cycles, resistance to solder reflow, dimensional stability, and the like after curing and providing high adhesion reliability and conduction reliability and an adhesive epoxy resin paste, an adhesive epoxy resin sheet, a conductive connection paste, and a conductive connection sheet using the curable resin composition, and an electronic component joined body. The invention relates to a curable resin composition, which contains an epoxy resin, a solid polymer having a functional group to react with the epoxy group and a curing agent for an epoxy resin, no phase separation structure being observed in a matrix of a resin when a cured product is dyed with a heavy metal and observed with a transmission electron microscope.

摘要翻译： 本发明的目的是提供一种在固化后机械强度，耐热性，耐湿性，柔韧性，耐热循环性，耐回焊性，尺寸稳定性等优异的粘合可靠性和高粘合性的固化性树脂组合物， 导电可靠性和粘合剂环氧树脂糊，粘合环氧树脂片，导电连接膏和使用该固化树脂组合物的导电连接片和电子部件接合体。 本发明涉及含有环氧树脂，具有与环氧基反应的官能团的固体聚合物和环氧树脂固化剂的固化性树脂组合物，在树脂基体中没有观察到相分离结构， 固化产物用重金属染色并用透射电子显微镜观察。