公开(公告)号：US08665609B2

公开(公告)日：2014-03-04

申请号：US13083743

申请日：2011-04-11

Applicant: Shinichi Tamamoto ,  Yuichi Nishimura

Inventor： Shinichi Tamamoto ,  Yuichi Nishimura

IPC: H05K7/02 ,  H05K7/04

CPC classification number: H01H13/86 ,  H01H2223/034 ,  H01H2223/0345

Abstract: A key device includes: a chassis which has an opening divided by one of a vertical rib and a horizontal rib; a plurality of keys which are arranged along the opening; and a substrate which is housed in the chassis, wherein the rib is engaged with the substrate.

Abstract translation: 关键装置包括：具有由垂直肋和水平肋中的一个分开的开口的底盘; 沿着开口布置的多个键; 以及容纳在所述底架中的基板，其中所述肋与所述基板接合。

公开(公告)号：US20110012260A1

公开(公告)日：2011-01-20

申请号：US12892273

申请日：2010-09-28

Applicant: Shinya TOKUNAGA ,  Mitsumi Ito ,  Nobufusa Iwanishi ,  Koichi Seko ,  Hiroaki Suzuki ,  Hiroyuki Tanaka ,  Yuichi Nishimura ,  Kazuhiko Fujimoto

Inventor： Shinya TOKUNAGA ,  Mitsumi Ito ,  Nobufusa Iwanishi ,  Koichi Seko ,  Hiroaki Suzuki ,  Hiroyuki Tanaka ,  Yuichi Nishimura ,  Kazuhiko Fujimoto

IPC: H01L23/485 ,  G06F17/50

CPC classification number: G06F17/5068 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49112 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: To provide a method of designing a semiconductor integrated circuit with a high workability also in an increase in a scale of an LSI and an enhancement in an integration and designing a semiconductor integrated circuit system in which an unnecessary radiation is reduced and which is excellent in a heat characteristic, a reverse design flow to that in the conventional art is implemented, and a mounting substrate such as a printed-circuit board is first designed and a package substrate for mounting an LSI is designed based on a result of the design of the mounting substrate, and a layout design of the LSI to be mounted on the package substrate is then carried out.

Abstract translation: 为了提供一种设计具有高可加工性的半导体集成电路的方法，同时也增加了LSI的规模，并提高了集成度，并设计了一种半导体集成电路系统，其中不必要的辐射被减少，并且在 热特性，实现了与传统技术相反的设计流程，并且首先设计诸如印刷电路板的安装基板，并且基于安装的设计结果设计用于安装LSI的封装基板 然后执行基板和要安装在封装基板上的LSI的布局设计。

公开(公告)号：US20080022252A1

公开(公告)日：2008-01-24

申请号：US11819573

申请日：2007-06-28

Applicant: Shinya Tokunaga ,  Mitsumi Ito ,  Nobufusa Iwanishi ,  Koichi Seko ,  Hiroaki Suzuki ,  Hiroyuki Tanaka ,  Yuichi Nishimura ,  Kazuhiko Fujimoto

Inventor： Shinya Tokunaga ,  Mitsumi Ito ,  Nobufusa Iwanishi ,  Koichi Seko ,  Hiroaki Suzuki ,  Hiroyuki Tanaka ,  Yuichi Nishimura ,  Kazuhiko Fujimoto

IPC: G06F17/50 ,  H01L23/48

CPC classification number: G06F17/5068 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49112 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: To provide a method of designing a semiconductor integrated circuit with a high workability also in an increase in a scale of an LSI and an enhancement in an integration and designing a semiconductor integrated circuit system in which an unnecessary radiation is reduced and which is excellent in a heat characteristic, a reverse design flow to that in the conventional art is implemented, and a mounting substrate such as a printed-circuit board is first designed and a package substrate for mounting an LSI is designed based on a result of the design of the mounting substrate, and a layout design of the LSI to be mounted on the package substrate is then carried out.

Abstract translation: 为了提供一种设计具有高可加工性的半导体集成电路的方法，同时也增加了LSI的规模，并提高了集成度，并设计了一种半导体集成电路系统，其中不必要的辐射被减少，并且在 热特性，实现了与传统技术相反的设计流程，并且首先设计诸如印刷电路板的安装基板，并且基于安装的设计结果设计用于安装LSI的封装基板 然后执行基板和要安装在封装基板上的LSI的布局设计。

公开(公告)号：US5847968A

公开(公告)日：1998-12-08

申请号：US605540

申请日：1996-02-16

Applicant: Shinji Miura ,  Masayuki Tsuchida ,  Hirokazu Uemura ,  Hiroyuki Yoshimura ,  Yuichi Nishimura

Inventor： Shinji Miura ,  Masayuki Tsuchida ,  Hirokazu Uemura ,  Hiroyuki Yoshimura ,  Yuichi Nishimura

IPC: G06F17/50 ,  H05K13/08 ,  H02B1/24

CPC classification number: G06F17/5068

Abstract: When a component is placed on a circuit board, a placement position is determined by method of elastic center. Then, it is determined whether the component was placed on the circuit board. After that, connectors are routed between the component and a design candidate component which is already placed. After that, the next component is set, and the above mentioned packaging processing is repeated.

Abstract translation: 当组件放置在电路板上时，通过弹性中心的方法确定放置位置。 然后，确定组件是否放置在电路板上。 之后，连接器在组件和已经放置的设计候选组件之间布线。 之后，设定下一个部件，重复上述的包装处理。

公开(公告)号：US20110249412A1

公开(公告)日：2011-10-13

申请号：US13083743

申请日：2011-04-11

Applicant: Shinichi TAMAMOTO ,  Yuichi Nishimura

Inventor： Shinichi TAMAMOTO ,  Yuichi Nishimura

IPC: H05K5/00

CPC classification number: H01H13/86 ,  H01H2223/034 ,  H01H2223/0345

Abstract: A key device includes: a chassis which has an opening divided by one of a vertical rib and a horizontal rib; a plurality of keys which are arranged along the opening; and a substrate which is housed in the chassis, wherein the rib is engaged with the substrate.

Abstract translation: 关键装置包括：具有由垂直肋和水平肋中的一个分开的开口的底盘; 沿着开口布置的多个键; 以及容纳在所述底架中的基板，其中所述肋与所述基板接合。

公开(公告)号：US07831949B2

公开(公告)日：2010-11-09

申请号：US11819573

申请日：2007-06-28

Applicant: Shinya Tokunaga ,  Mitsumi Ito ,  Nobufusa Iwanishi ,  Koichi Seko ,  Hiroaki Suzuki ,  Hiroyuki Tanaka ,  Yuichi Nishimura ,  Kazuhiko Fujimoto

Inventor： Shinya Tokunaga ,  Mitsumi Ito ,  Nobufusa Iwanishi ,  Koichi Seko ,  Hiroaki Suzuki ,  Hiroyuki Tanaka ,  Yuichi Nishimura ,  Kazuhiko Fujimoto

IPC: G06F17/50

CPC classification number: G06F17/5068 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49112 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: To provide a method of designing a semiconductor integrated circuit with a high workability also in an increase in a scale of an LSI and an enhancement in an integration and designing a semiconductor integrated circuit system in which an unnecessary radiation is reduced and which is excellent in a heat characteristic, a reverse design flow to that in the conventional art is implemented, and a mounting substrate such as a printed-circuit board is first designed and a package substrate for mounting an LSI is designed based on a result of the design of the mounting substrate, and a layout design of the LSI to be mounted on the package substrate is then carried out.

Abstract translation: 为了提供一种设计具有高可加工性的半导体集成电路的方法，同时也增加了LSI的规模，并提高了集成度，并设计了一种半导体集成电路系统，其中不必要的辐射被减少，并且在 热特性，实现了与传统技术相反的设计流程，并且首先设计诸如印刷电路板的安装基板，并且基于安装的设计结果设计用于安装LSI的封装基板 然后执行基板和要安装在封装基板上的LSI的布局设计。

公开(公告)号：US5559997A

公开(公告)日：1996-09-24

申请号：US317859

申请日：1994-10-04

Applicant: Masayuki Tsuchida ,  Hirokazu Uemura ,  Shinji Miura ,  Yoshiyuki Saito ,  Hiroyuki Yoshimura ,  Yuichi Nishimura ,  Nobuo Sueda

Inventor： Masayuki Tsuchida ,  Hirokazu Uemura ,  Shinji Miura ,  Yoshiyuki Saito ,  Hiroyuki Yoshimura ,  Yuichi Nishimura ,  Nobuo Sueda

IPC: G06F17/50 ,  H05K1/02 ,  H05K3/00

CPC classification number: G06F17/5068 ,  G06F17/5036 ,  H05K3/0005 ,  H05K1/023 ,  Y10S706/919 ,  Y10S706/92

Abstract: According to the printed-circuit board of the preset invention, the circuit modification unit 120 adds a noise reduction component, based on circuit board information inputted to the design information input unit 106. Then, the layout unit 132 sets a layout after the design rule generation unit 133 generates a design rule. The rated value modification unit 124 determines rated values of noise reduction components in accordance with the layout. Thus, design rule generation, noise reduction component addition, and rated value determination are automatically performed to satisfy the electric characteristics of evaluation targets. Consequently, interactive process in designing is reduced and the efficiency of designing can be realized.

Abstract translation: 根据本发明的印刷电路板，电路修改单元120基于输入到设计信息输入单元106的电路板信息来添加噪声降低组件。然后，布局单元132在设计规则之后设置布局 生成单元133生成设计规则。 额定值修正单元124根据布局确定降噪成分的额定值。 因此，自动执行设计规则生成，降噪成分添加和额定值确定，以满足评价对象的电气特性。 因此，设计中的交互过程减少，设计效率可以实现。

公开(公告)号：US06443314B1

公开(公告)日：2002-09-03

申请号：US09792048

申请日：2001-02-26

Applicant: Kazuo Shiraiwa ,  Shin-ichi Waku ,  Masamichi Tawara ,  Yuichi Nishimura

Inventor： Kazuo Shiraiwa ,  Shin-ichi Waku ,  Masamichi Tawara ,  Yuichi Nishimura

IPC: B01D6308

Abstract: Disclosed is a membrane filter system comprising an integral plastic holder (1, 23) having a filter receiving section (2, 24) for receiving a membrane filter (3, 30) that collects target microorganism contained in sample solution, a funnel mount (9, 25) positioned at a level higher than the filter receiving section for carrying thereon a cup-shaped paper funnel (12, 33) adapted to receive the sample solution, and a drainage (7, 28) communicated with the filter receiving section. The funnel has a bottom sheet or a paper filter (14, 35) and a bottom peripheral flange (15, 36) surrounding the bottom sheet. Resin seal means (11, 22) is fitted to the funnel mount to provide liquid-tight engagement between the funnel and the holder. The bottom sheet of the funnel is positioned above the membrane filter and serves as a primary filter for collecting particles in the sample solution larger than the target microorganism before the sample solution reaches the membrane filter.

公开(公告)号：US4011411A

公开(公告)日：1977-03-08

申请号：US586584

申请日：1975-06-13

Applicant: Yuichi Nishimura

Inventor： Yuichi Nishimura

IPC: G11B31/00 ,  H04M1/65 ,  H04M1/652 ,  H04M1/656 ,  H04M1/64

CPC classification number: H04M1/652

Abstract: In an automatic telephone answering and recording device associated with a telephone set connected to a remote calling party through a telephone line wherein the message transmitted from the calling party is recorded, there is provided a sound recording tape provided with a plurality of sound tracks, sound recording and reproducing heads cooperating with the tape, a receiving circuit for receiving a message transmitted from the calling party, head switching means for selecting a head associated with the first sound track, control means responsive to the message received by the receiving circuit for recording the message in the first sound track by the selected head, remote control means responsive to a reproduction request signal transmitted from the calling party for causing the control means to reproduce the message in the first sound track by the selected head, and a line control circuit for transmitting the message reproduced from the first sound track to the remote calling party. The remote control means also responds to a new call signal for causing the head switching means to select another head associated with the second sound track to record a subsequent message in the second sound track.

Abstract translation: 在与通过电话线连接到远程主叫方的电话机相关联的自动电话应答和记录装置中，其中记录了从主叫方发送的消息，提供了一种设置有多个声轨，声音的录音带 与磁带协作的记录和再现磁头，用于接收从主叫方发送的消息的接收电路，用于选择与第一声道相关联的磁头的磁头切换装置，响应于由接收电路接收的消息记录 通过所选择的头部在第一声道中的消息，响应于从主叫方发送的再现请求信号的遥控装置，用于使控制装置通过所选择的头部再现第一声道中的消息;以及线路控制电路， 将从第一声道再现的信息发送到远程呼叫方。 遥控装置还响应新的呼叫信号，使得头切换装置选择与第二声道相关联的另一头，以在第二声道中记录后续消息。