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10 条记录 (耗时 0.032 秒)

    Telephone hand-free apparatus
    4.
    发明授权
    Telephone hand-free apparatus 失效
    电话免提设备

    公开(公告)号：US06216018B1

    公开(公告)日：2001-04-10

    申请号：US09129639

    申请日：1998-08-05

    申请人： Yukio Nakanishi ,  Yasuhisa Nakahara ,  Yasuhiro Kobayashi ,  Yoshihisa Takemori ,  Koichiro Haga ,  Kohei Hashimoto ,  Kazuhiko Fujimoto

    发明人： Yukio Nakanishi ,  Yasuhisa Nakahara ,  Yasuhiro Kobayashi ,  Yoshihisa Takemori ,  Koichiro Haga ,  Kohei Hashimoto ,  Kazuhiko Fujimoto

    IPC分类号： H04B138

    CPC分类号： H04M1/6041 ,  H04M1/6075

    摘要： A telephone hand-free apparatus comprises a housing; a telephone receiving case installed in the housing, the telephone receiving case being so sized and constructed as to receive therein a portable telephone; a board on which a control circuit is arranged, the board being installed in the housing; an external microphone operatively connected to the control circuit and exposed to the outside of the housing; an external speaker operatively connected to the control circuit and installed in the housing; a connection cable extending from the control circuit, so that when the connection cable is connected to a socket of the portable telephone, the external microphone and the external speaker become operative in place of a microphone and a speaker of the portable telephone; and an electric power source which energizes the control circuit. The control circuit includes a muting section which makes the external microphone inoperative while the control circuit is receiving a voice signal from the portable telephone through the connection cable.

    摘要翻译： 一种电话免提装置，包括一个外壳; 安装在外壳中的电话接收盒，电话接收盒的尺寸和构造尺寸被构造成在其中容纳便携式电话; 布置有控制电路的板，所述板安装在所述壳体中; 可操作地连接到所述控制电路并暴露于所述壳体的外部的外部麦克风; 可操作地连接到所述控制电路并安装在所述壳体中的外部扬声器; 从所述控制电路延伸的连接电缆，使得当所述连接电缆连接到所述便携式电话的插座时，所述外部麦克风和所述外部扬声器可操作地代替所述便携式电话的麦克风和扬声器; 以及使控制电路通电的电源。 控制电路包括使控制电路通过连接电缆从便携式电话接收语音信号时使外部麦克风不起作用的静噪部分。

    Power supply wiring method for semiconductor integrated circuit and semiconductor integrated circuit
    5.
    发明授权
    Power supply wiring method for semiconductor integrated circuit and semiconductor integrated circuit 有权
    半导体集成电路和半导体集成电路的电源布线方法

    公开(公告)号：US07093222B2

    公开(公告)日：2006-08-15

    申请号：US10653940

    申请日：2003-09-04

    申请人： Kazuhiko Fujimoto

    发明人： Kazuhiko Fujimoto

    IPC分类号： G06F17/50

    CPC分类号： G06F17/5068 ,  H01L23/5286 ,  H01L27/0203 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A power supply wiring method for a semiconductor integrated circuit is disclosed in which power supply provision for logic cells can be performed without invading the wiring area, and a semiconductor integrated circuit is also disclosed. In the power supply wiring method, a power supply is fed to logic cells located between the functional blocks of a semiconductor integrated circuit comprising a plurality of functional blocks. In the method, power supply provision similar to that for logic cells in the functional blocks is performed for the logic cells between the functional blocks by aligning logic cell rows in the functional blocks and logic cell rows located between the functional blocks. Thus, power supply provision similar to a power supply feeding method for the logic cells in the functional blocks is also possible for the logic cells located between the functional blocks.

    摘要翻译： 公开了一种用于半导体集成电路的电源布线方法，其中可以在不侵入布线区域的情况下执行用于逻辑单元的电源供给，并且还公开了半导体集成电路。 在电源布线方法中，电源被馈送到位于包括多个功能块的半导体集成电路的功能块之间的逻辑单元。 在该方法中，通过对准功能块中的逻辑单元行和位于功能块之间的逻辑单元行，对功能块之间的逻辑单元执行类似于功能块中的逻辑单元的电源供应。 因此，与位于功能块中的逻辑单元的电源馈送方法类似的电源提供对于位于功能块之间的逻辑单元也是可能的。

    Hydraulic press for forming metal plates
    6.
    发明授权
    Hydraulic press for forming metal plates 失效
    液压机用于成型金属板

    公开(公告)号：US6128987A

    公开(公告)日：2000-10-10

    申请号：US026329

    申请日：1998-02-19

    申请人： Tatsuji Nakagawa ,  Itaru Fujimura ,  Hiroshi Hosoya ,  Junkichi Comikawa ,  Kazuhiko Fujimoto

    发明人： Tatsuji Nakagawa ,  Itaru Fujimura ,  Hiroshi Hosoya ,  Junkichi Comikawa ,  Kazuhiko Fujimoto

    IPC分类号： B30B1/32 ,  B30B15/16 ,  B30B15/24 ,  B26D5/20 ,  B21D31/02 ,  B30B1/42

    CPC分类号： B30B1/323 ,  B30B15/161 ,  B30B15/24 ,  Y10T83/18 ,  Y10T83/4473

    摘要： A hydraulic press has closed loop feedback control on a slide, a slide pad and bolster cylinders. Hydraulic cylinders actuating various components of the press are controlled according to ideal position estimates to produce consistent and precise pressing action. A closed loop control consists of an ideal position/pressure value generator, a position/pressure detector and an arithmetic unit comparing the ideal and actual position/pressure values. Using the ideal and actual comparison result, the arithmetic unit produces a control signal to drive a cylinder to a desired position/pressure. The hydraulic press is capable of performing several operations on a workpiece in one press cycle, an improvement over presses requiring several operation steps or die changes. The bolster cylinders augment clamping force, reduce shock, and improve die alignment to produce better results with less wear on press components.

    摘要翻译： 液压机在滑块，滑垫和缓冲气缸上具有闭环反馈控制。 根据理想的位置估计来控制致动压力机各部件的液压缸，以产生一致和精确的按压作用。 闭环控制包括理想的位置/压力值发生器，位置/压力检测器和运算单元，比较理想位置/压力值。 使用理想和实际的比较结果，算术单元产生控制信号以将气缸驱动到期望的位置/压力。 液压机能够在一个冲压循环中对工件进行多次操作，对需要几个操作步骤或模具更换的冲压进行改进。 垫圈缸增加夹紧力，减少冲击，并改善模具对准以产生更好的结果，同时减少冲压部件的磨损。

    WIRING STRUCTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, AND METHOD AND DEVICE FOR DESIGNING THE SAME
    7.
    发明申请
    WIRING STRUCTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, AND METHOD AND DEVICE FOR DESIGNING THE SAME 审中-公开
    半导体集成电路装置的布线结构及其设计方法和装置

    公开(公告)号：US20080197449A1

    公开(公告)日：2008-08-21

    申请号：US12035230

    申请日：2008-02-21

    申请人： Takayuki ARAKI ,  Junichi Shimada ,  Hirokazu Ogawa ,  Kazuhiko Fujimoto ,  Tsutomu Fujii ,  Takuya Yasui

    发明人： Takayuki ARAKI ,  Junichi Shimada ,  Hirokazu Ogawa ,  Kazuhiko Fujimoto ,  Tsutomu Fujii ,  Takuya Yasui

    IPC分类号： H01L23/52

    CPC分类号： H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method is provided for designing a wiring structure of a wiring layer of a semiconductor integrated circuit device. The method includes a wire width detecting step of detecting a wire width of each wire in a wiring pattern of layout data, a wire identifying step of identifying a wire having a predetermined wire width or more based on a result of detection by the wire width detecting step, a wiring pitch detecting step of detecting a wiring pitch between the wire identified by the wire identifying step and another wire, and an air gap-forbidden region forming and removing step of forming or removing an air gap-forbidden region, depending on a result of detection by the wiring pitch detecting step.

    摘要翻译： 提供一种用于设计半导体集成电路器件的布线层的布线结构的方法。 该方法包括：线宽检测步骤，检测布线数据的布线图案中的每条线的线宽;线识别步骤，基于线宽检测的检测结果识别具有预定线宽或更大的线的线; 步骤，检测由线识别步骤识别的线与另一线之间的布线间距的接线间距检测步骤以及形成或除去气隙禁止区域的气隙禁止区形成和移除步骤， 通过布线间距检测步骤的检测结果。