公开(公告)号：US07421777B2

公开(公告)日：2008-09-09

申请号：US11063131

申请日：2005-02-22

申请人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuki Nishitani ,  Ken Orui

发明人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuki Nishitani ,  Ken Orui

IPC分类号： H05K3/36

CPC分类号： H05K3/4694 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0023 ,  H05K3/205 ,  H05K3/4617 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/09536 ,  H05K2201/09881 ,  H05K2201/09972 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiring substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.

摘要翻译： 本发明提供一种制造多层布线基板的方法，其可以以细间距保持导体图案的尺寸稳定性，从材料选择的角度解决对工艺的限制，并且进一步降低制造成本，并且 多层布线基板。 形成在由金属制成的支撑片和粘合剂层上的第二布线基板通过使用支撑片部分堆叠在第一布线基板的预定区域上。 在第二布线基板的层叠之后，最后蚀刻并去除支撑片。 第二布线基板仅堆叠在第一布线基板上需要多层的部分上，从而减少第二布线基板的结构材料的量。