公开(公告)号：US08504057B2

公开(公告)日：2013-08-06

申请号：US11189061

申请日：2005-07-26

申请人： Yun-hwa Choi ,  Hyong-uk Choi

发明人： Yun-hwa Choi ,  Hyong-uk Choi

IPC分类号： H04W24/00 ,  H04W4/00 ,  H04L12/28 ,  H04L12/66

CPC分类号： H04W64/00 ,  H04B7/2612

摘要： A location tracking method in a coordinator-based wireless network is provided. The location tracking method in a coordinator-based wireless network includes transmitting a first frame including its own identifier and time information to the wireless network by a device associated with the wireless network in order to disclose its location information; and receiving a second frame including the location information of the device transmitted from the wireless network by the device, as a response to the first frame.

公开(公告)号：US07675148B2

公开(公告)日：2010-03-09

申请号：US12074225

申请日：2008-02-28

申请人： Seung-won Lim ,  O-Seob Jeon ,  Joon-seo Son ,  Keun-hyuk Lee ,  Yun-hwa Choi

发明人： Seung-won Lim ,  O-Seob Jeon ,  Joon-seo Son ,  Keun-hyuk Lee ,  Yun-hwa Choi

IPC分类号： H01L23/495

CPC分类号： H01L24/96 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/10 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2924/00012

摘要： Provided are a power module having a stacked flip-chip and a method of fabricating the power module. The power module includes a lead frame; a control device part including a control device chip; a power device part including a power device chip and being electrically connected to the lead frame; and an interconnecting substrate of which the control and power device parts are respectively disposed at upper and lower portions, and each of the control and power device chips may be attached to one of the lead frame and the interconnecting substrate using a flip-chip bonding method. The method includes forming bumps on power and control device chips on a wafer level; separately sawing the power and control device chips into individual chips; adhering the power device chip onto a thermal substrate and the control device chip onto an interconnecting substrate; combining a lead frame, the thermal substrate, and the interconnecting substrate with one another in a multi-jig; and sealing the power and control device chips, and the control and power device chips may be attached to one of the lead frame and the interconnecting substrate using a flip-chip bonding method.

摘要翻译： 提供了具有堆叠倒装芯片的功率模块和制造功率模块的方法。 电源模块包括引线框架; 控制装置部分，包括控制装置芯片; 功率器件部件，其包括电源器件芯片并且电连接到引线框架; 以及控制和功率器件部分分别设置在上部和下部的互连衬底，并且每个控制和功率器件芯片可以使用倒装芯片接合方法附接到引线框架和互连衬底之一 。 该方法包括在晶片级的功率和控制器件芯片上形成凸块; 将电源和控制芯片单独切割成单独的芯片; 将功率器件芯片粘附到热衬底上，并将控制器件芯片粘附到互连衬底上; 在多夹具中将引线框架，热基板和互连基板彼此组合; 并且密封功率和控制装置芯片，并且控制和功率器件芯片可以使用倒装芯片接合方法附接到引线框架和互连衬底中的一个。

公开(公告)号：US20060018295A1

公开(公告)日：2006-01-26

申请号：US11189061

申请日：2005-07-26

申请人： Yun-hwa Choi ,  Hyong-uk Choi

发明人： Yun-hwa Choi ,  Hyong-uk Choi

IPC分类号： H04Q7/20

CPC分类号： H04W64/00 ,  H04B7/2612

摘要： A location tracking method in a coordinator-based wireless network is provided. The location tracking method in a coordinator-based wireless network includes transmitting a first frame including its own identifier and time information to the wireless network by a device associated with the wireless network in order to disclose its location information; and receiving a second frame including the location information of the device transmitted from the wireless network by the device, as a response to the first frame.

公开(公告)号：US20160300309A1

公开(公告)日：2016-10-13

申请号：US15038472

申请日：2014-12-05

申请人： Yun hwa CHOI

发明人： Yun hwa CHOI

IPC分类号： G06Q40/00 ,  G09B7/02

CPC分类号： G06Q40/12 ,  G06Q10/10 ,  G09B7/02 ,  G09B19/18

摘要： Provided is a method for inputting household accounting data for double-entry bookkeeping, the method comprising steps of: a user device 200 which has a household accounting program in a double-entry bookkeeping scheme installed therein and runs the household accounting program, (1) providing a questionnaire for inputting a property overview; (2) receiving a response to the provided questionnaire; (3) automatically inputting property overview data obtained by processing the received response into a financial status of a user in accordance with a double-entry bookkeeping form; and (4) updating the financial status of the user from income or expense data that is received, wherein in (1), an owner item including a person concerned, family members, and a joint ownership is provided together with questions of the questionnaire, and a property owner is allowed to be selected from the owner item.

摘要翻译： 提供一种用于输入用于双重记录的家庭会计数据的方法，所述方法包括以下步骤：用户设备200，其安装在其中并进行家庭会计程序的双重记账方案中的家庭会计程序;（1） 提供输入物业概况的问卷; （2）收到对提供的问卷的答复; （3）根据双重簿记表格自动输入通过将接收到的响应处理成用户的财务状况而获得的财产综合数据; （4）从收到的收入或费用数据中更新用户的财务状况，其中在（1）中，包括有关个人，家庭成员和共同所有权的所有者项目与问卷的问题一起提供， 允许从所有者项目中选择属性所有者。

公开(公告)号：US08766419B2

公开(公告)日：2014-07-01

申请号：US12643901

申请日：2009-12-21

申请人： Seung-won Lim ,  O-Seob Jeon ,  Joon-seo Son ,  Keun-kyuk Lee ,  Yun-hwa Choi

发明人： Seung-won Lim ,  O-Seob Jeon ,  Joon-seo Son ,  Keun-kyuk Lee ,  Yun-hwa Choi

IPC分类号： H01L23/495 ,  H01L23/433 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L24/96 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/10 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2924/00012

摘要： Provided are a power module having a stacked flip-chip and a method of fabricating the power module. The power module includes a lead frame; a control device part including a control device chip; a power device part including a power device chip and being electrically connected to the lead frame; and an interconnecting substrate of which the control and power device parts are respectively disposed at upper and lower portions, and each of the control and power device chips may be attached to one of the lead frame and the interconnecting substrate using a flip-chip bonding method. The method includes forming bumps on power and control device chips on a wafer level; separately sawing the power and control device chips into individual chips; adhering the power device chip onto a thermal substrate and the control device chip onto an interconnecting substrate; combining a lead frame, the thermal substrate, and the interconnecting substrate with one another in a multi-jig; and sealing the power and control device chips, and the control and power device chips may be attached to one of the lead frame and the interconnecting substrate using a flip-chip bonding method.

摘要翻译： 提供了具有堆叠倒装芯片的功率模块和制造功率模块的方法。 电源模块包括引线框架; 控制装置部分，包括控制装置芯片; 功率器件部件，其包括电源器件芯片并且电连接到引线框架; 以及控制和功率器件部分分别设置在上部和下部的互连衬底，并且每个控制和功率器件芯片可以使用倒装芯片接合方法附接到引线框架和互连衬底之一 。 该方法包括在晶片级的功率和控制器件芯片上形成凸块; 将电源和控制芯片单独切割成单独的芯片; 将功率器件芯片粘附到热衬底上，并将控制器件芯片粘附到互连衬底上; 在多夹具中将引线框架，热基板和互连基板彼此组合; 并且密封功率和控制装置芯片，并且控制和功率器件芯片可以使用倒装芯片接合方法附接到引线框架和互连衬底中的一个。

公开(公告)号：US20100189082A1

公开(公告)日：2010-07-29

申请号：US12751131

申请日：2010-03-31

申请人： Yun-hwa Choi ,  Hyong-uk Choi

发明人： Yun-hwa Choi ,  Hyong-uk Choi

IPC分类号： H04W72/04 ,  H04J3/16

CPC分类号： H04W64/00 ,  H04B7/2612

摘要： A location tracking method in a coordinator-based wireless network is provided. The location tracking method in a coordinator-based wireless network includes transmitting a first frame including its own identifier and time information to the wireless network by a device associated with the wireless network in order to disclose its location information; and receiving a second frame including the location information of the device transmitted from the wireless network by the device, as a response to the first frame.

摘要翻译： 提供了一种基于协调器的无线网络中的位置跟踪方法。 基于协调器的无线网络中的位置跟踪方法包括：通过与无线网络相关联的设备向无线网络发送包括其自己的标识符和时间信息的第一帧，以便公开其位置信息; 以及作为对第一帧的响应，接收包括由设备从无线网络发送的设备的位置信息的第二帧。

公开(公告)号：US20100155914A1

公开(公告)日：2010-06-24

申请号：US12643901

申请日：2009-12-21

申请人： Seung-won Lim ,  O-Seob Jeon ,  Joon-seo Son ,  Keun-kyuk Lee ,  Yun-hwa Choi

发明人： Seung-won Lim ,  O-Seob Jeon ,  Joon-seo Son ,  Keun-kyuk Lee ,  Yun-hwa Choi

IPC分类号： H01L23/495 ,  H01L23/34

CPC分类号： H01L24/96 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/10 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2924/00012

摘要： Provided are a power module having a stacked flip-chip and a method of fabricating the power module. The power module includes a lead frame; a control device part including a control device chip; a power device part including a power device chip and being electrically connected to the lead frame; and an interconnecting substrate of which the control and power device parts are respectively disposed at upper and lower portions, and each of the control and power device chips may be attached to one of the lead frame and the interconnecting substrate using a flip-chip bonding method. The method includes forming bumps on power and control device chips on a wafer level; separately sawing the power and control device chips into individual chips; adhering the power device chip onto a thermal substrate and the control device chip onto an interconnecting substrate; combining a lead frame, the thermal substrate, and the interconnecting substrate with one another in a multi-jig; and sealing the power and control device chips, and the control and power device chips may be attached to one of the lead frame and the interconnecting substrate using a flip-chip bonding method.

摘要翻译： 提供了具有堆叠倒装芯片的功率模块和制造功率模块的方法。 电源模块包括引线框架; 控制装置部分，包括控制装置芯片; 功率器件部件，其包括电源器件芯片并且电连接到引线框架; 以及控制和功率器件部分分别设置在上部和下部的互连衬底，并且每个控制和功率器件芯片可以使用倒装芯片接合方法附接到引线框架和互连衬底之一 。 该方法包括在晶片级的功率和控制器件芯片上形成凸块; 将电源和控制芯片单独切割成单独的芯片; 将功率器件芯片粘附到热衬底上，并将控制器件芯片粘附到互连衬底上; 在多夹具中将引线框架，热基板和互连基板彼此组合; 并且密封功率和控制装置芯片，并且控制和功率器件芯片可以使用倒装芯片接合方法附接到引线框架和互连衬底中的一个。

公开(公告)号：US07551594B2

公开(公告)日：2009-06-23

申请号：US10942948

申请日：2004-09-17

申请人： Yun-hwa Choi ,  Hyong-uk Choi

发明人： Yun-hwa Choi ,  Hyong-uk Choi

IPC分类号： H04Q7/24

CPC分类号： H04W16/14 ,  H04B1/7163 ,  H04W72/0453 ,  H04W84/18

摘要： A method of allocating frequency subbands in an ultrawideband (UWB) wireless communication system and an apparatus adopting the same are provided. The method of allocating frequency subbands to a device in a communication system, the method including: (a) determining whether usage of a first frequency band including upper frequency subbands is necessary; and (b) if it is determined that the usage of the first frequency band is necessary, not setting usage permission for the first frequency band to the device and not granting access to the first frequency band if a request for usage of the first frequency band is received from the device. When generation of a new piconet is necessary or generation of a new piconet is requested in a multi-piconet environment, since subbands of a high frequency group are allocated through negotiation, frequency resources are efficiently managed.

摘要翻译： 提供了一种在超宽带（UWB）无线通信系统中分配频率子带的方法和采用该方法的装置。 将频率子带分配给通信系统中的设备的方法，所述方法包括：（a）确定是否需要包括高频子带的第一频带的使用; 以及（b）如果确定需要第一频带的使用，则不对设备使用第一频带的使用许可，并且如果第一频带的使用请求不准予对第一频带的访问 从设备接收。 当需要新的微微网的生成或者在多微微网环境中请求新的微微网的生成时，由于通过协商来分配高频组的子带，所以能够有效地管理频率资源。

公开(公告)号：US20080019346A1

公开(公告)日：2008-01-24

申请号：US11865421

申请日：2007-10-01

申请人： Yun-hwa CHOI ,  Hyong-uk Choi

发明人： Yun-hwa CHOI ,  Hyong-uk Choi

IPC分类号： H04J1/00

CPC分类号： H04W16/14 ,  H04B1/7163 ,  H04W72/0453 ,  H04W84/18

摘要： A method of allocating frequency subbands in an ultrawideband (UWB) wireless communication system and an apparatus adopting the same are provided. The method of allocating frequency subbands to a device in a communication system, the method including: (a) determining whether usage of a first frequency band including upper frequency subbands is necessary; and (b) if it is determined that the usage of the first frequency band is necessary, not setting usage permission for the first frequency band to the device and not granting access to the first frequency band if a request for usage of the first frequency band is received from the device. When generation of a new piconet is necessary or generation of a new piconet is requested in a multi-piconet environment, since subbands of a high frequency group are allocated through negotiation, frequency resources are efficiently managed.

摘要翻译： 提供了一种在超宽带（UWB）无线通信系统中分配频率子带的方法和采用该方法的装置。 将频率子带分配给通信系统中的设备的方法，所述方法包括：（a）确定是否需要包括高频子带的第一频带的使用; 以及（b）如果确定需要第一频带的使用，则不对设备使用第一频带的使用许可，并且如果第一频带的使用请求不准予对第一频带的访问 从设备接收。 当需要新的微微网的生成或者在多微微网环境中请求新的微微网的生成时，由于通过协商来分配高频组的子带，所以能够有效地管理频率资源。

公开(公告)号：US07957340B2

公开(公告)日：2011-06-07

申请号：US11865421

申请日：2007-10-01

申请人： Yun-hwa Choi ,  Hyong-uk Choi

发明人： Yun-hwa Choi ,  Hyong-uk Choi

IPC分类号： H04W4/00

CPC分类号： H04W16/14 ,  H04B1/7163 ,  H04W72/0453 ,  H04W84/18

摘要： A method of allocating frequency subbands in an ultrawideband (UWB) wireless communication system and an apparatus adopting the same are provided. The method of allocating frequency subbands to a device in a communication system, the method including: (a) determining whether usage of a first frequency band including upper frequency subbands is necessary; and (b) if it is determined that the usage of the first frequency band is necessary, not setting usage permission for the first frequency band to the device and not granting access to the first frequency band if a request for usage of the first frequency band is received from the device. When generation of a new piconet is necessary or generation of a new piconet is requested in a multi-piconet environment, since subbands of a high frequency group are allocated through negotiation, frequency resources are efficiently managed.

摘要翻译： 提供了一种在超宽带（UWB）无线通信系统中分配频率子带的方法和采用该方法的装置。 将频率子带分配给通信系统中的设备的方法，所述方法包括：（a）确定是否需要包括高频子带的第一频带的使用; 以及（b）如果确定需要第一频带的使用，则不对设备使用第一频带的使用许可，并且如果第一频带的使用请求不准予对第一频带的访问 从设备接收。 当需要新的微微网的生成或者在多微微网环境中请求新的微微网的生成时，由于通过协商来分配高频组的子带，所以能够有效地管理频率资源。