公开(公告)号：US20190180968A1

公开(公告)日：2019-06-13

申请号：US16266254

申请日：2019-02-04

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： JOSEPH C. SPAGNOLA ,  MARK A. ROEHRIG ,  THOMAS P. KLUN ,  ALAN K. NACHTIGAL ,  CHRISTOPHER S. LYONS ,  GUY D. JOLY

IPC: H01J1/70 ,  C23C28/00 ,  C08J7/04 ,  C23C14/02 ,  C23C14/58 ,  C23C14/34 ,  C23C14/22 ,  C23C14/08 ,  C23C14/12

Abstract: A barrier film including a substrate; a base polymer layer adjacent to the substrate; an oxide layer adjacent to the base polymer layer; a adhesion-modifying layer adjacent to the oxide layer; and a top coat polymer layer adjacent to the adhesion-modifying layer. An optional inorganic layer can be applied over the top coat polymer layer. The inclusion of a adhesion-modifying layer provides for enhanced resistance to moisture and improved peel strength adhesion of the top coat polymer layer to the underlying barrier stack layers.

公开(公告)号：US20180309005A1

公开(公告)日：2018-10-25

申请号：US16017128

申请日：2018-06-25

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： MARK D. WEIGEL ,  MARK A. ROEHRIG ,  ALAN K. NACHTIGAL ,  SAMUEL KIDANE ,  ANDREW J. HENDERSON

IPC: H01L31/048 ,  B32B27/36 ,  B32B27/34 ,  B32B27/32 ,  B32B27/30 ,  B32B27/28 ,  B32B7/12 ,  B32B27/08 ,  B32B17/10 ,  B32B7/02

Abstract: An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.

公开(公告)号：US20160284906A1

公开(公告)日：2016-09-29

申请号：US15176427

申请日：2016-06-08

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： MARK D. WEIGEL ,  MARK A. ROEHRIG ,  ALAN K. NACHTIGAL ,  SAMUEL KIDANE ,  ANDREW J. HENDERSON

IPC: H01L31/048 ,  B32B27/30 ,  B32B27/36 ,  B32B27/08

CPC classification number: H01L31/0481 ,  B32B7/02 ,  B32B7/12 ,  B32B17/10018 ,  B32B27/08 ,  B32B27/281 ,  B32B27/283 ,  B32B27/286 ,  B32B27/302 ,  B32B27/304 ,  B32B27/308 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2307/412 ,  B32B2307/416 ,  B32B2307/42 ,  B32B2307/546 ,  B32B2307/71 ,  B32B2307/712 ,  B32B2307/7246 ,  B32B2307/732 ,  B32B2327/12 ,  B32B2367/00 ,  B32B2457/12 ,  B32B2551/00 ,  Y02E10/50 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/31663 ,  Y10T428/31667

Abstract: An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.

Abstract translation: 提供了一种包括介于第一聚合物膜基材和压敏粘合剂层的第一主表面之间的阻挡膜的组合件。 第一聚合物膜基材具有第一热膨胀系数，在一些实施方案中为高达每百万开氏百万分之50。 压敏粘合剂层具有与设置在第二聚合物膜基底上的第一主表面相对的第二主表面。 第二聚合物膜基底通常耐紫外线降解。 在一些实施方案中，第二聚合物膜基材具有比第一热膨胀系数高至少40ppm /开氏度的第二热膨胀系数。 组件对可见光和红外光透射。