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公开(公告)号：US20160053045A1
公开(公告)日：2016-02-25
申请号：US14783444
申请日：2014-04-16
IPC分类号： C08G59/14 , B32B27/06 , B32B15/08 , C09J163/00 , B32B7/12
CPC分类号： B32B27/06 , B32B7/12 , B32B15/08 , B32B2363/00 , C08G59/4021 , C08G59/686 , C09J163/00
摘要： There is provided a one -part curable epoxy composition comprising a heat curable epoxy resin; and a latent curative system in an amount sufficient to cure the epoxy resin, where the latent curative system comprises at least one epoxy resin miscible first curative comprising a latent hardener, selected from dicyandiamide and its derivatives, and two or more latent accelerators selected from at least one of substituted ureas, substituted imidazoles, and combinations thereof. There are also provided adhesive compositions, cured adhesives and articles made using such one-part curable epoxy compositions.
摘要翻译： 提供了一种可固化环氧树脂的单组分可固化环氧组合物; 和潜在固化剂体系，其量足以固化环氧树脂，其中潜在固化剂体系包含至少一种环氧树脂可混溶的第一固化剂，其包含选自双氰胺及其衍生物的潜在硬化剂，以及两种或多种选自以下的潜在加速剂： 至少一种取代的脲，取代的咪唑及其组合。 还提供了使用这种一部分可固化环氧组合物制备的粘合剂组合物，固化的粘合剂和制品。
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公开(公告)号：US11384266B2
公开(公告)日：2022-07-12
申请号：US14875133
申请日：2015-10-05
IPC分类号： C09J163/00 , B32B37/16 , B32B37/12 , B32B38/00 , C09J7/21 , C09J7/35 , C08J7/04 , C08J7/043 , C09J121/00 , C09J133/04 , C08L9/02 , C08L77/10 , C08L81/06
摘要： A method for surfacing a polymeric composite article and/or for joining (for example, by bonding or by co-curing) the article and an adherend (for example, a second polymeric composite article) comprises (a) providing a cured or curable polymeric composite article; (b) providing a curable composition comprising (1) at least one thermosetting resin, and (2) at least one preformed, substantially non-functional, particulate modifier comprising at least one elastomer; and (c) directly or indirectly applying the composition to at least a portion of at least one surface of the article.
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公开(公告)号：US20160024356A1
公开(公告)日：2016-01-28
申请号：US14875133
申请日：2015-10-05
IPC分类号： C09J163/00 , C09J121/00 , C09J133/04
CPC分类号： C09J163/00 , C08J7/047 , C08L9/02 , C08L77/10 , C08L81/06 , C08L2666/02 , C08L2666/04 , C09J121/00 , C09J133/04 , Y10T428/254 , Y10T428/31504 , Y10T428/31511 , Y10T428/31721 , Y10T428/31786
摘要： A method for surfacing a polymeric composite article and/or for joining (for example, by bonding or by co-curing) the article and an adherend (for example, a second polymeric composite article) comprises (a) providing a cured or curable polymeric composite article; (b) providing a curable composition comprising (1) at least one thermosetting resin, and (2) at least one preformed, substantially non-functional, particulate modifier comprising at least one elastomer; and (c) directly or indirectly applying the composition to at least a portion of at least one surface of the article.
摘要翻译： 用于表面聚合复合制品和/或用于接合（例如通过粘合或共同固化）制品和被粘物（例如，第二聚合物复合制品）的方法包括（a）提供固化或固化的聚合物 复合制品; （b）提供可固化组合物，其包含（1）至少一种热固性树脂，和（2）至少一种预先形成的，基本上无功能的颗粒改性剂，其包含至少一种弹性体; 和（c）将所述组合物直接或间接施用于制品的至少一个表面的至少一部分。
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4.发明申请Electron Beam Cured, Nonfunctionalized Silicone Pressure Sensitive Adhesives 审中-公开电子束固化，非功能化硅胶压敏粘合剂公开(公告)号：US20130295373A1
公开(公告)日：2013-11-07
申请号：US13937256
申请日：2013-07-09
发明人： Junkang J. Liu , Clayton A. George
IPC分类号： C09J7/02 , C09J183/04
CPC分类号： C09J7/38 , C08G77/80 , C08J3/28 , C08J2383/04 , C08L83/04 , C09J7/26 , C09J183/04 , C09J2483/00 , Y10T428/249985 , Y10T428/254 , Y10T428/2809 , Y10T428/2848 , Y10T428/2852 , Y10T428/31663 , C08L83/00
摘要： Methods of preparing silicone pressure sensitive adhesives are described. The methods include electron beam curing nonfunctionalized silicone materials, e.g., silicone fluids and gums. Hot melt processing the nonfunctionalized silicone materials prior to electron beam crosslinking, and crosslinked adhesives prepared by such methods are also described. Adhesives prepared by hot melt coating and electron beam curing nonfunctionalized silicone materials and adhesive articles incorporating such adhesives are also disclosed.
摘要翻译： 描述制备硅氧烷压敏粘合剂的方法。 所述方法包括电子束固化的非官能化硅氧烷材料，例如硅氧烷流体和树胶。 在电子束交联之前热熔处理非官能化硅氧烷材料，还描述了通过这些方法制备的交联粘合剂。 还公开了通过热熔涂层和电子束固化非功能化硅氧烷材料制备的粘合剂和包含这种粘合剂的粘合剂制品。
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公开(公告)号：US20130295372A1
公开(公告)日：2013-11-07
申请号：US13937275
申请日：2013-07-09
发明人： Junkang J. Liu , Clayton A. George
IPC分类号： C09J7/02 , C09J183/04
CPC分类号： C08L83/00 , C08J3/28 , C08J9/32 , C08J2201/024 , C08J2207/02 , C08J2383/04 , C09J7/38 , C09J183/04 , C09J183/08 , Y10T428/249983 , Y10T428/2809 , Y10T428/2852
摘要： Methods of preparing silicone materials using electron beam curing are described. The materials are hot melt processed and cured in the absence of an effective amount of catalysts and initiators. Both functional and nonfunctionalized silicone materials may be used. Exemplary cured materials include silicone pressure sensitive adhesives, silicone foams, and non-tacky silicone films.
摘要翻译： 描述了使用电子束固化制备硅氧烷材料的方法。 在不存在有效量的催化剂和引发剂的情况下，将材料热熔融加工和固化。 可以使用功能性和非官能化的硅氧烷材料。 示例性的固化材料包括硅氧烷压敏粘合剂，硅氧烷泡沫和非粘性硅酮膜。
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