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    TUNABLE LASER USING III-V GAIN MATERIALS
    1.
    发明申请
    TUNABLE LASER USING III-V GAIN MATERIALS 有权
    使用III-V增益材料的柔性激光

    公开(公告)号：US20140153601A1

    公开(公告)日：2014-06-05

    申请号：US13871343

    申请日：2013-04-26

    Applicant: Acacia Communications Inc.

    Inventor： Christopher DOERR ,  Eric SWANSON

    IPC: H01S5/04

    CPC classification number: H01S5/041 ,  H01L2224/48137 ,  H01S5/0064 ,  H01S5/021 ,  H01S5/02248 ,  H01S5/0612 ,  H01S5/1032 ,  H01S5/125 ,  H01S5/142

    Abstract: Disclosed herein are techniques, methods, structures and apparatus that provide a laser monolithically integrated in a silicon photonic integrated circuit (PIC) that is suitable for high-performance coherent fiber-optic telecommunications and other applications. Among the features of a laser according to the present disclosure, and in particular a hybrid InGaAsP/Si laser, is an integrated Si isolator to protect the laser from back reflections; optical, rather than electrical pumping; and coupling the optical pump using an InGaAsP grating coupler that acts simultaneously as a WDM coupler and laser mirror.

    Abstract translation: 本文公开了提供单片集成在硅光子集成电路（PIC）中的激光器的技术，方法，结构和装置，其适用于高性能相干光纤通信和其他应用。 在根据本公开的激光器的特征之中，特别是混合InGaAsP / Si激光器是集成的Si隔离器，用于保护激光免受后反射; 光学，而不是电泵送; 并使用同时作为WDM耦合器和激光反射镜的InGaAsP光栅耦合器耦合光泵。

    ELECTRONIC AND OPTICAL CO-PACKAGING OF COHERENT TRANSCEIVER
    3.
    发明申请
    ELECTRONIC AND OPTICAL CO-PACKAGING OF COHERENT TRANSCEIVER 有权
    电子和光学共包装的相干收发器

    公开(公告)号：US20140064659A1

    公开(公告)日：2014-03-06

    申请号：US14012876

    申请日：2013-08-28

    Applicant: ACACIA COMMUNICATIONS INC.

    Inventor： Christopher DOERR ,  Eric SWANSON ,  Jon STAHL ,  Diedrik VERMEULEN

    IPC: G02B6/12

    CPC classification number: G02B6/12 ,  G02B6/12004 ,  G02B6/42 ,  G02B6/423 ,  G02B6/428 ,  G02B6/43

    Abstract: Disclosed herein are co-packaging structures, devices, and methods for integrating a photonic integrated circuit (PIC), an electronic integrated circuit including drivers and transimpedance amplifiers (TIAs) and an ASIC having analog-to-digital converters and a digital signal processor positioned on a common (the same) carrier thereby resulting in a compact coherent transceiver while lowering its cost.

    Abstract translation: 本文公开了用于集成光子集成电路（PIC），包括驱动器和跨阻抗放大器（TIAs）的电子集成电路和具有模数转换器的ASIC和定位的数字信号处理器的共同封装结构，器件和方法 在相同的载体上，从而导致紧凑的相干收发器，同时降低其成本。

    INTEGRATED OPTICAL COHERENCE TOMOGRAPHY SYSTEMS AND METHODS
    4.
    发明申请
    INTEGRATED OPTICAL COHERENCE TOMOGRAPHY SYSTEMS AND METHODS 有权
    综合光学相干系统和方法

    公开(公告)号：US20140376000A1

    公开(公告)日：2014-12-25

    申请号：US14201827

    申请日：2014-03-08

    Applicant: ACACIA COMMUNICATIONS INC.

    Inventor： Eric SWANSON ,  Christopher DOERR

    IPC: G01B9/02

    CPC classification number: G01B9/02051 ,  G01B9/02004 ,  G01B9/02069 ,  G01B9/02091

    Abstract: Disclosed herein are optical integration technologies, designs, systems and methods directed toward Optical Coherence Tomography (OCT) and other interferometric optical sensor, ranging, and imaging systems wherein such systems, methods and structures employ tunable optical sources, coherent detection and other structures on a single or multichip monolithic integration. In contrast to contemporary, prior-art OCT systems and structures that employ simple, miniature optical bench technology using small optical components positioned on a substrate, systems and methods according to the present disclosure employ one or more photonic integrated circuits (PICs), use swept-source techniques, and employ a widely tunable optical source(s).

    Abstract translation: 本文公开的是针对光学相干层析成像（OCT）和其他干涉光学传感器，范围和其中这样的系统，方法和结构采用可调谐光源，相干检测和其他结构的光学集成技术，设计，系统和方法 单芯片或多芯片单片集成。 与采用使用位于衬底上的小型光学组件的简单的微型光学平台技术的现代的现有技术的OCT系统和结构不同，根据本公开的系统和方法采用一个或多个光子集成电路（PIC），使用扫描 源技术，并采用广泛可调谐的光源。

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