公开(公告)号：US20170200527A1

公开(公告)日：2017-07-13

申请号：US15326224

申请日：2015-07-14

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Bawa SINGH ,  Ravi BHATKAL ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC: H01B1/22 ,  H05K3/12 ,  B23K35/02 ,  B22F1/02 ,  B23K35/36 ,  B23K35/362 ,  B22F1/00 ,  H05K1/09 ,  B23K35/30

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US20200294686A1

公开(公告)日：2020-09-17

申请号：US16887455

申请日：2020-05-29

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Bawa SINGH ,  Ravi BHATKAL ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/00 ,  B22F1/02 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US20250063830A1

公开(公告)日：2025-02-20

申请号：US18719593

申请日：2022-12-09

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  P M KRITHIKA ,  Siuli SARKAR

IPC: H01L31/05 ,  B23K35/36 ,  B23K35/362 ,  B23K101/38 ,  H01L31/18

Abstract: A method of manufacturing a solar module, the method comprising: connecting a metallic interconnector to two or more solar cells; and applying a transparent cover sheet to the two or more solar cells, wherein connecting the metallic interconnector to each solar cell of the two or more solar cells comprises: providing a solar cell having a bus bar on a surface thereof; providing a metallic interconnector having solder flux on a contact surface thereof; providing solder between the bus bar and the contact surface; and reflowing the solder to connect the metallic interconnector to the bus bar, wherein the solder flux comprises a reflective additive.

公开(公告)号：US20240029916A1

公开(公告)日：2024-01-25

申请号：US18376896

申请日：2023-10-05

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Bawa SINGH ,  Ravi BHATKAL ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/17 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12

CPC classification number: H01B1/22 ,  H05K1/095 ,  B22F1/17 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/1216 ,  H05K3/1241 ,  H05K2201/0245 ,  H05K2201/0133 ,  H05K1/189

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US20220216357A1

公开(公告)日：2022-07-07

申请号：US17595690

申请日：2020-05-22

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Narahari PUJARI ,  Siuli SARKAR ,  Carl BILGRIEN

IPC: H01L31/05

Abstract: A method of fabricating a solar module by interconnection of a plurality of photovoltaic (PV) cells in which at least a first PV cell is interconnected to a second PV cell using an electrically-conductive adherent comprising or consisting of a solder paste. The solder paste comprises particles of solder alloy dispersed in a solder flux. The solder alloy comprises a Sn-containing solder alloy having a liquidus temperature of less than 225° C.

公开(公告)号：US20220064466A1

公开(公告)日：2022-03-03

申请号：US17524891

申请日：2021-11-12

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Jayaprakash SUNDARAMURTHY ,  Siuli SARKAR ,  Ravindra M. BHATKAL

IPC: C09D11/322 ,  B41F15/40 ,  B41M5/00 ,  C09D11/037 ,  C09D11/101 ,  C09D11/102 ,  C09D11/104 ,  C09D11/107 ,  C09D11/38 ,  H05K1/03 ,  H05K3/00

Abstract: The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuity and devices.

公开(公告)号：US20210350949A1

公开(公告)日：2021-11-11

申请号：US17382980

申请日：2021-07-22

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Bawa SINGH ,  Ravi BHATKAL ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/00 ,  B22F1/02 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.