公开(公告)号：US20230374289A1

公开(公告)日：2023-11-23

申请号：US18247996

申请日：2021-10-07

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Nirmalya Kumar CHAKI ,  Chetan Pravinchandra SHAH ,  Bawa SINGH ,  Rahul RAUT ,  Vasuki Srinivas KAUSHIK ,  Ranjit PANDHER ,  Niveditha NAGARAJAN ,  Sandeesh M KUMAR ,  Anubhav RUSTOGI

IPC: C08L61/28 ,  C08K7/18 ,  C09D11/103 ,  C09D11/104 ,  C09J183/04 ,  C09D11/033 ,  C09J11/08

CPC classification number: C08L61/28 ,  C08K7/18 ,  C09D11/103 ,  C09D11/104 ,  C09J183/04 ,  C09D11/033 ,  C09J11/08 ,  C08L2205/035 ,  C08L2312/00 ,  C08L2201/50 ,  C08L2201/52 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/006

Abstract: A composition for use in the manufacture of an in-mould electronic (IME) component, the composition containing a binder comprising: a cross-linking agent comprising melamine formaldehyde, a thermoplastic resin comprising a hydroxyl group, and a solvent.