公开(公告)号：US20170200527A1

公开(公告)日：2017-07-13

申请号：US15326224

申请日：2015-07-14

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Bawa SINGH ,  Ravi BHATKAL ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC: H01B1/22 ,  H05K3/12 ,  B23K35/02 ,  B22F1/02 ,  B23K35/36 ,  B23K35/362 ,  B22F1/00 ,  H05K1/09 ,  B23K35/30

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US20230374289A1

公开(公告)日：2023-11-23

申请号：US18247996

申请日：2021-10-07

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Nirmalya Kumar CHAKI ,  Chetan Pravinchandra SHAH ,  Bawa SINGH ,  Rahul RAUT ,  Vasuki Srinivas KAUSHIK ,  Ranjit PANDHER ,  Niveditha NAGARAJAN ,  Sandeesh M KUMAR ,  Anubhav RUSTOGI

IPC: C08L61/28 ,  C08K7/18 ,  C09D11/103 ,  C09D11/104 ,  C09J183/04 ,  C09D11/033 ,  C09J11/08

CPC classification number: C08L61/28 ,  C08K7/18 ,  C09D11/103 ,  C09D11/104 ,  C09J183/04 ,  C09D11/033 ,  C09J11/08 ,  C08L2205/035 ,  C08L2312/00 ,  C08L2201/50 ,  C08L2201/52 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/006

Abstract: A composition for use in the manufacture of an in-mould electronic (IME) component, the composition containing a binder comprising: a cross-linking agent comprising melamine formaldehyde, a thermoplastic resin comprising a hydroxyl group, and a solvent.

公开(公告)号：US20200294686A1

公开(公告)日：2020-09-17

申请号：US16887455

申请日：2020-05-29

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Bawa SINGH ,  Ravi BHATKAL ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/00 ,  B22F1/02 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US20240029916A1

公开(公告)日：2024-01-25

申请号：US18376896

申请日：2023-10-05

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Bawa SINGH ,  Ravi BHATKAL ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/17 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12

CPC classification number: H01B1/22 ,  H05K1/095 ,  B22F1/17 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/1216 ,  H05K3/1241 ,  H05K2201/0245 ,  H05K2201/0133 ,  H05K1/189

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US20210350949A1

公开(公告)日：2021-11-11

申请号：US17382980

申请日：2021-07-22

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Bawa SINGH ,  Ravi BHATKAL ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/00 ,  B22F1/02 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US20230287232A1

公开(公告)日：2023-09-14

申请号：US18113812

申请日：2023-02-24

Applicant: Alpha Assembly Solutions Inc. ,  MacDermid Autotype Limited

Inventor： Nirmalya Kumar CHAKI ,  Chetan Pravinchandra SHAH ,  Barun DAS ,  Supriya DEVARAJAN ,  Siuli SARKAR ,  Rahul RAUT ,  Bawa SINGH ,  Anubhav RUSTOGI ,  Anna Jane HARRIS ,  Keith Paul PARSONS ,  Jeffrey William BRAHAM

IPC: C09D11/52 ,  C09D11/033 ,  C09D11/037 ,  C09D11/104 ,  H01H13/704

CPC classification number: C09D11/52 ,  C09D11/033 ,  C09D11/037 ,  C09D11/104 ,  H01H13/704 ,  H01H2209/016

Abstract: This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.

公开(公告)号：US20220371089A1

公开(公告)日：2022-11-24

申请号：US17754125

申请日：2020-09-24

Applicant: Alpha Assembly Solutions Inc.

Inventor： Shamik GHOSHAL ,  Nirmalya Kumar CHAKI ,  Remya CHANDRAN ,  Manoharan VENODH ,  Bawa SINGH ,  Barun DAS ,  Niveditha NAGARAJAN ,  Rahul RAUT ,  Oscar KHASELEV ,  Ranjit PANDHER ,  Supriya DEVARAJAN ,  Anubhav RUSTOGI

IPC: B22F7/04 ,  B22F1/107 ,  B22F9/30 ,  H05K1/09 ,  H05K3/12 ,  H01B13/012 ,  H05K3/34 ,  H01L23/00 ,  H01B1/02 ,  B23K35/30

Abstract: A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.

公开(公告)号：US20200087528A1

公开(公告)日：2020-03-19

申请号：US16616701

申请日：2018-05-22

Applicant: Alpha Assembly Solutions Inc. ,  MacDermid Autotype Limited

Inventor： Nirmalya Kumar CHAKI ,  Chetan Pravinchandra SHAH ,  Barun DAS ,  Supriya DEVARAJAN ,  Siuli SARKAR ,  Rahul RAUT ,  Bawa SINGH ,  Anubhav RUSTOGI ,  Anna Jane HARRIS ,  Keith Paul PARSONS ,  Jeffrey William BRAHAM

IPC: C09D11/52 ,  C09D11/037 ,  C09D11/033 ,  C09D11/104 ,  H01H13/704

Abstract: This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.