MICRO-HOTPLATE DEVICES WITH RING STRUCTURES
    1.
    发明申请

    公开(公告)号:US20170343500A1

    公开(公告)日:2017-11-30

    申请号:US15168464

    申请日:2016-05-31

    Abstract: We disclose a micro-hotplate comprising a substrate comprising an etched portion and a substrate portion and a dielectric region over the substrate. The dielectric region comprises first and second portions. The first portion is adjacent to the etched portion of the substrate and the second portion is adjacent to the substrate portion of the substrate. The micro-hotplate further comprises a heater formed in the dielectric region, and a ring structure formed within and/or over the dielectric region such that the ring structure is coupled with the first and second portions of the dielectric region.

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