公开(公告)号：US20130236037A1

公开(公告)日：2013-09-12

申请号：US13871177

申请日：2013-04-26

Applicant: ANALOG DEVICES, INC.

Inventor： Jason W. Weigold ,  Kieran P. Harney

IPC: H04R1/08

CPC classification number: H04R1/083 ,  H04R1/406 ,  H04R19/005 ,  H04R19/04

Abstract: A microphone system implements multiple microphones on a single base. To that end, the microphone system has a base, and a plurality of substantially independently movable diaphragms secured to the base. Each of the plurality of diaphragms forms a variable capacitance with the base and thus, each diaphragm effectively forms a generally independent, separate microphone with the base.

Abstract translation: 麦克风系统在单个基座上实现多个麦克风。 为此，麦克风系统具有基座和固定到基座的多个基本可独立移动的隔膜。 多个隔膜中的每一个与基座形成可变电容，因此，每个隔膜有效地形成与基座大致独立的分开的麦克风。

公开(公告)号：US20130236036A1

公开(公告)日：2013-09-12

申请号：US13854438

申请日：2013-04-01

Applicant: ANALOG DEVICES, INC.

Inventor： Jason W. Weigold

IPC: H04R3/00

CPC classification number: H04R3/00 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81C1/00182 ,  H01L2224/48137 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/15151 ,  H04R19/005 ,  H04R2499/11

Abstract: A microphone includes a diaphragm assembly supported by a substrate. The diaphragm assembly includes at least one carrier, a diaphragm, and at least one spring coupling the diaphragm to the at least one carrier such that the diaphragm is spaced from the at least one carrier. An insulator (or separate insulators) between the substrate and the at least one carrier electrically isolates the diaphragm and the substrate.

Abstract translation: 麦克风包括由基板支撑的隔膜组件。 隔膜组件包括至少一个载体，隔膜和至少一个弹簧，其将隔膜耦合到至少一个载体，使得隔膜与至少一个载体间隔开。 衬底和至少一个载体之间的绝缘体（或单独的绝缘体）电隔离隔膜和衬底。

公开(公告)号：US20130101151A1

公开(公告)日：2013-04-25

申请号：US13712325

申请日：2012-12-12

Applicant: ANALOG DEVICES, INC.

Inventor： Kieran P. Harney ,  Jason W. Weigold ,  Gary W. Elko

IPC: H04R1/04

CPC classification number: H04R1/04 ,  H04M1/0214 ,  H04M1/03 ,  H04M1/035 ,  H04M1/19 ,  H04M1/6008 ,  H04R1/245 ,  H04R3/005 ,  H04R2410/05

Abstract: A microphone system has a base coupled with first and second microphone apparatuses. The first microphone apparatus is capable of producing a first output signal having a noise component, while the second microphone apparatus is capable of producing a second output signal. The first microphone apparatus may have a first back-side cavity and the second microphone may have a second back-side cavity. The first and second back-side cavities may be fluidly unconnected. The system also has combining logic operatively coupled with the first microphone apparatus and the second microphone apparatus. The combining logic uses the second output signal to remove at least a portion of the noise component from the first output signal.

Abstract translation: 麦克风系统具有与第一和第二麦克风装置耦合的基座。 第一麦克风装置能够产生具有噪声分量的第一输出信号，而第二麦克风装置能够产生第二输出信号。 第一麦克风装置可以具有第一后侧腔，并且第二麦克风可以具有第二后侧空腔。 第一和第二后侧空腔可以是流体不连接的。 该系统还具有与第一麦克风装置和第二麦克风装置操作耦合的组合逻辑。 组合逻辑使用第二输出信号从第一输出信号中去除噪声分量的至少一部分。

公开(公告)号：US20130104384A1

公开(公告)日：2013-05-02

申请号：US13719858

申请日：2012-12-19

Applicant: Analog Devices, Inc.

Inventor： Jason W. Weigold

IPC: H04R31/00

CPC classification number: H04R31/003 ,  G01L9/0042 ,  H04R7/14 ,  H04R19/005 ,  H04R19/04 ,  H04R27/00 ,  H04R31/00 ,  H04R2499/11 ,  Y10T29/43 ,  Y10T29/49005

Abstract: A microphone is formed to have a diaphragm that is configured to improve signal to noise ratio. To that end, the microphone has a backplate having a hole therethrough, and a diaphragm movably coupled with the backplate. The diaphragm has a bottom surface (facing the backplate) with a convex portion aligned with the hole in the backplate.

Abstract translation: 麦克风被形成为具有被配置为提高信噪比的隔膜。 为此，麦克风具有穿过其中的孔的背板，以及与该背板可移动地联接的隔膜。 隔膜具有与背板中的孔对准的凸部的底面（面对背板）。

公开(公告)号：US20130065344A1

公开(公告)日：2013-03-14

申请号：US13669857

申请日：2012-11-06

Applicant: Analog Devices, Inc.

Inventor： Jason W. Weigold

IPC: H01L21/02

CPC classification number: B81C1/00944 ,  B81B2201/0257 ,  H04R19/005

Abstract: A method of forming a microphone forms a backplate, and a flexible diaphragm on at least a portion of a wet etch removable sacrificial layer. The method adds a wet etch resistant material, where a portion of the wet etch resistant material is positioned between the diaphragm and the backplate to support the diaphragm. Some of the wet etch resistant material is not positioned between the diaphragm and backplate. The method then removes the sacrificial material before removing any of the wet etch resistant material added during the prior noted act of adding. The wet etch resistant material then is removed substantially in its entirety after removing at least part of the sacrificial material.