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公开(公告)号：US12183559B2
公开(公告)日：2024-12-31
申请号：US17508493
申请日：2021-10-22
Applicant: Applied Materials, Inc.
Inventor： Vishwas Kumar Pandey , Colin John Dickinson , Dinkesh Huderi Somanna , Ala Moradian , Kartik Bhupendra Shah
Abstract: An adapter for a deposition chamber includes an adapter body extending longitudinally about a central axis between an upper side and lower side opposite the upper side. The adapter body has a central opening about the central axis. The adapter body has a radially outer portion having a connection surface on the lower side and a radially inner portion having a coolant channel and a stepped surface on the lower side. At least a portion of the coolant channel is spaced radially inwardly from a radially inner end of the connection surface. At least the portion of the coolant channel is disposed longitudinally below the connection surface between the connection surface and the stepped surface.
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公开(公告)号：US11733081B2
公开(公告)日：2023-08-22
申请号：US17229737
申请日：2021-04-13
Applicant: Applied Materials, Inc.
Inventor： Bindusagar Marath Sankarathodi , Zhiyuan Ye , Jyothi Rajeevan , Ala Moradian , Zuoming Zhu , Errol Antonio C. Sanchez , Patricia M. Liu
CPC classification number: G01F15/002 , G01F25/17
Abstract: Aspects generally relate to methods, systems, and apparatus for conducting a calibration operation for a plurality of mass flow controllers (MFCs) of a substrate processing system. In one aspect, a corrected flow curve is created for a range of target flow rates across a plurality of setpoints. In one implementation, a method of conducting a calibration operation for a plurality of mass flow controllers (MFCs) of a substrate processing system includes prioritizing the plurality of MFCs for the calibration operation. The prioritizing includes determining an operation time for each MFC of the plurality of MFCs, and ranking the plurality of MFCs in a rank list according to the operation time for each MFC. The method includes conducting the calibration operation for the plurality of MFCs according to the rank list and during an idle time for the substrate processing system.
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公开(公告)号：US10995419B2
公开(公告)日：2021-05-04
申请号：US16427812
申请日：2019-05-31
Applicant: Applied Materials, Inc.
Inventor： Brian H. Burrows , Ala Moradian , Kartik Shah , Shu-Kwan Lau
Abstract: Embodiment disclosed herein include a liner assembly, comprising an injector plate liner, a gas injector liner coupled to the injector plate liner, an upper process gas liner coupled to the gas injector liner, a lower process gas liner coupled to the upper process gas liner, and an injector plate positioned between the injector plate liner and the upper process gas liner, wherein a cooling fluid channel is formed in the injector plate adjacent to the gas injector liner.
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公开(公告)号：US12228905B2
公开(公告)日：2025-02-18
申请号：US17548334
申请日：2021-12-10
Applicant: Applied Materials, Inc.
Inventor： Ala Moradian , Umesh Madhav Kelkar , Elizabeth Neville , Orlando Trejo , Sergey Meirovich , Kartik B. Shah , Shreyas Suresh Kher
IPC: G05B19/18 , G05B19/406
Abstract: Technologies directed to an eco-efficiency monitoring and exploration platform for semiconductor manufacturing. One method includes receiving, by a processing device, first data indicating an update to a substrate fabrication system having a first configuration of manufacturing equipment and operating to one or more process procedures. The method further includes determining, by the processing device, using the first data with a digital replica, environmental resource data. The digital replica includes a digital reproduction of the substrate fabrication system. The environmental resource usage data indicates an environment resource consumption that corresponds to performing the one or more process procedures by the substrate fabrication system incorporating the update. The method further includes providing, by the processing device, the environmental resource usage data for display on a graphical user interface (GUI).
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公开(公告)号：US20250038053A1
公开(公告)日：2025-01-30
申请号：US18361326
申请日：2023-07-28
Applicant: Applied Materials, Inc.
Inventor： Zhepeng Cong , Tao Sheng , Ala Moradian
Abstract: A method of analyzing completion of seasoning of semiconductor processing chambers may include training a model using seasoning cycle characteristics data obtained from existing semiconductor processing chambers. A supervised learning process may label the characteristics data based on expert determined identify seasoning completion and may optionally label the characteristics data based on chamber open event information or preventive maintenance information. The trained model may be used to characterize another chamber during seasoning to determine whether seasoning is completed and/or when or how long or how many seasoning cycles may be performed until seasoning is complete.
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Patent Agency Ranking
公开(公告)号：US12001197B2
公开(公告)日：2024-06-04
申请号：US17230897
申请日：2021-04-14
Applicant: Applied Materials, Inc.
Inventor： Ala Moradian , Elizabeth Neville , Umesh Madhav Kelkar , Mark R. Denome , Prashanth Kothnur , Karthik Ramanathan , Kartik Shah , Orlando Trejo , Sergey Meirovich
IPC: H01L21/67 , G05B13/02 , G05B19/418 , G05B19/41
CPC classification number: G05B19/41885 , G05B13/027 , G05B2219/32335 , G05B2219/32359 , G05B2219/45031 , H01L21/67276
Abstract: A method including receiving, by a processing device, a first selection of at least one of a first fabrication process or first manufacturing equipment to perform manufacturing operations of the first fabrication process. The method can further include inputting the first selection into a digital replica of the first manufacturing equipment wherein the digital replica outputs physical conditions of the first fabrication process. The method may further include determining environmental resource usage data indicative of a first environmental resource consumption of the first fabrication process run on the first manufacturing equipment based on the physical conditions of the first fabrication process. The processing device may further determine a modification to the first fabrication process that reduces the environmental resource consumption of the first fabrication process run on the first manufacturing equipment. The method can further include performing at least one of applying the modification to the first fabrication.
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公开(公告)号：US20220092241A1
公开(公告)日：2022-03-24
申请号：US16948522
申请日：2020-09-22
Applicant: Applied Materials, Inc.
Inventor： Ala Moradian , James Omer L'Heureux , Shuran Sheng , Rohit Mahakali , Karthik Ramanathan , Lin Zhang , Umesh Madhav Kelkar , Gopalakrishna B. Prabhu , Zheng Yuan , Jeonghoon Oh
Abstract: A method includes receiving measurement data from multiple sensors positioned along a delivery line that delivers a liquid as a gas to one of a gas panel or a processing chamber; simulating, using a computer-generated model, one or more process parameters associated with the delivery line and a plurality of heater jackets positioned around the delivery line; comparing the measurement data with values of the one or more process parameters; and determining, based on at least a threshold deviation between the measurement data and the values of the one or more process parameters, that a fault exists that is associated with maintaining temperature within the delivery line consistent with a gaseous state of the liquid.
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公开(公告)号：US11162168B2
公开(公告)日：2021-11-02
申请号：US16512699
申请日：2019-07-16
Applicant: Applied Materials, Inc.
Inventor： Ala Moradian , Travis Tesch
Abstract: Described herein are apparatus and methods used to process a substrate in a chamber, in particular to position a non-round substrate in a holding chamber or a processing chamber. Further described herein are a 3D mapping device that is configured to measure the surface profile of a non-round substrate and a position of the substrate on the robot arm.
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公开(公告)号：US10930530B2
公开(公告)日：2021-02-23
申请号：US16249588
申请日：2019-01-16
Applicant: Applied Materials, Inc.
Inventor： Ji-Dih Hu , Ala Moradian
IPC: H01L21/67 , G01K11/12 , G01J5/34 , H01L21/687 , H01L21/66 , H01L21/324
Abstract: A method and apparatus to determine a temperature of a substrate using a spectrum of radiation is disclosed herein. In one aspect, a process chamber includes a lamp assembly optically coupled to a spectrometer. The spectrometer is used to determine a temperature of a substrate within the process chamber. A controller is coupled to the spectrometer and controls the lamp assembly to selectively heat and cool the substrate. In another aspect, a method of includes exposing a substrate to a radiation source. A spectrum of radiation is detected by a spectrometer across a substrate. The spectrum of radiation passed through the substrate is determined and used to determine a temperature of the substrate.
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公开(公告)号：US20240327988A1
公开(公告)日：2024-10-03
申请号：US18190970
申请日：2023-03-28
Applicant: Applied Materials, Inc.
Inventor： Zhepeng Cong , Ala Moradian
CPC classification number: C23C16/46 , G05D23/1917
Abstract: A method of characterizing thermal processing chambers may include training a model using temperature rate-of-change data from existing thermal processing chambers. A supervised learning process may label the rate-of-change data based on deposition profiles on substrates. The trained model may be used to characterize another chamber to determine if the predicted performance will match the chambers used to train the model. An inert process using carrier gasses may be used to capture temperature data and derive rate-of-change data without requiring the actual deposition of an layer on the substrate. The rate-of-change data may be provided to the model, which may generate component-specific outputs that characterize how well the chamber is predicted to match either finger print condition of the chamber (match at different time) or match between different chambers.
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