公开(公告)号：US11088005B2

公开(公告)日：2021-08-10

申请号：US16421301

申请日：2019-05-23

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Konstantin Makhratchev ,  Jason Della Rosa ,  Hamid Noobakhsh ,  Brad L. Mays ,  Douglas A. Buchberger, Jr.

IPC: H01L21/683 ,  H01T23/00 ,  H01L21/67

Abstract: A substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that is bonded to the ceramic puck. The thermally conductive base includes a plurality of thermal zones and a thermally managed material embedded in the thermally conductive base at the upper surface of the thermally conductive base in one or more of the plurality of thermal zones. The thermally managed material has different thermal conductive properties along a first direction and a second direction. The thermally conductive base further includes a plurality of thermal isolators that extend from the upper surface of the thermally conductive base towards a lower surface of the thermally conductive base between two or more of the plurality of thermal zones without contacting the lower surface of the thermally conductive base. Each of the plurality of thermal isolators provides a degree of thermal isolation.

公开(公告)号：US20190279893A1

公开(公告)日：2019-09-12

申请号：US16421301

申请日：2019-05-23

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Konstantin Makhratchev ,  Jason Della Rosa ,  Hamid Noobakhsh ,  Brad L. Mays ,  Douglas A. Buchberger, JR.

IPC: H01L21/683 ,  H01L21/67

Abstract: A substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that is bonded to the ceramic puck. The thermally conductive base includes a plurality of thermal zones and a thermally managed material embedded in the thermally conductive base at the upper surface of the thermally conductive base in one or more of the plurality of thermal zones. The thermally managed material has different thermal conductive properties along a first direction and a second direction. The thermally conductive base further includes a plurality of thermal isolators that extend from the upper surface of the thermally conductive base towards a lower surface of the thermally conductive base between two or more of the plurality of thermal zones without contacting the lower surface of the thermally conductive base. Each of the plurality of thermal isolators provides a degree of thermal isolation.

公开(公告)号：US20130284373A1

公开(公告)日：2013-10-31

申请号：US13687512

申请日：2012-11-28

Applicant: APPLIED MATERIALS, INC.

Inventor： Jennifer Y. Sun ,  Biraja P. Kanungo ,  Ren-Guan Duan ,  Hamid Noobakhsh ,  Junhan Yuh ,  Dmitry Lubomirsky

IPC: C23F1/08 ,  B23K10/00 ,  H05K1/05 ,  B05D3/00

CPC classification number: C23F1/08 ,  B05D3/002 ,  B23K10/00 ,  B32B18/00 ,  C04B5/00 ,  C04B7/32 ,  C04B18/023 ,  C04B28/06 ,  C04B35/44 ,  C04B41/009 ,  C04B41/50 ,  C04B41/5045 ,  C04B41/87 ,  C22C29/12 ,  C22C32/00 ,  C22C32/0015 ,  C22C32/0021 ,  C22C32/0026 ,  H01J37/321 ,  H01J37/3244 ,  H01J37/32458 ,  H01J37/32467 ,  H01J37/32477 ,  H01J37/32495 ,  H05K1/053

Abstract: To manufacture a ceramic coated article, at least one surface of a conductive article is roughened to a roughness of approximately 100 micro-inches (μin) to approximately 300 μin. The conductive article may then be heated and coated with a ceramic coating comprising a yttrium containing oxide to a thickness of approximately 10-40 mil.

Abstract translation: 为了制造陶瓷涂层制品，将导电制品的至少一个表面粗糙化至约100微英寸（μin）至约300μm的粗糙度。 然后可以将导电制品加热并用包含含钇的氧化物的陶瓷涂层涂覆至约10-40密耳的厚度。