公开(公告)号：US11375584B2

公开(公告)日：2022-06-28

申请号：US16545901

申请日：2019-08-20

Applicant: APPLIED MATERIALS, INC.

Inventor： Tuck Foong Koh ,  Yueh Sheng Ow ,  Nuno Yen-Chu Chen ,  Ananthkrishna Jupudi ,  Preetham P. Rao

IPC: H05B1/02 ,  H05B6/80

Abstract: Methods and apparatus for processing a substrate are provided herein. The apparatus can include, for example, a microwave energy source configured to provide microwave energy from beneath a substrate support provided in an inner volume of the process chamber; a first microwave reflector positioned on the substrate support above a substrate supporting position of the substrate support; and a second microwave reflector positioned on the substrate support beneath the substrate supporting position, wherein the first microwave reflector and the second microwave reflector are positioned and configured such that microwave energy passes through the second microwave reflector and some of the microwave energy is reflected from a bottom surface of the first microwave reflector back to the substrate during operation.

公开(公告)号：US11670525B2

公开(公告)日：2023-06-06

申请号：US16363537

申请日：2019-03-25

Applicant: APPLIED MATERIALS, INC.

Inventor： Preetham P. Rao ,  Ananthkrishna Jupudi ,  Ribhu Gautam

IPC: H01L21/67 ,  H05B6/76 ,  H05B6/64

CPC classification number: H01L21/67115 ,  H05B6/6408 ,  H05B6/76

Abstract: Methods and apparatus for reducing leakage of microwaves at a slit valve of a process chamber. A multi-frequency resonant choke around the slit valve prevents microwave energy from a band of frequencies from escaping from the slit valve. The multi-frequency resonant choke may have a sloping bottom surface or a serrated bottom surface to enable multiple frequencies to resonant in the choke, canceling a range of microwave frequencies at gaps formed by a slit valve gate.

公开(公告)号：US10971383B2

公开(公告)日：2021-04-06

申请号：US16783702

申请日：2020-02-06

Applicant: APPLIED MATERIALS, INC.

Inventor： Preetham P. Rao ,  Ananthkrishna Jupudi

IPC: G01K11/20 ,  G01K13/00 ,  H01L21/67 ,  G01K11/32 ,  H01L21/687 ,  H01L21/66 ,  H01L23/00 ,  H01L23/31

Abstract: Methods and apparatus for measuring the temperature of epoxy resin in an electronics package are provided herein. In some embodiments, apparatus for encapsulating an electronics package includes: a process chamber having a chamber body enclosing a processing volume; a substrate support having a support surface for receiving and supporting a substrate for forming an electronics package; and a temperature sensor to measure a temperature of an epoxy resin in an electronics package. The temperature sensor includes: an input apparatus including at least a light source disposed outside the chamber body to provide an excitation light energy to a portion of the epoxy resin; and an output apparatus including at least a signal analyzer disposed outside the chamber body to detect fluorescent light energy emitted by the portion of the epoxy resin and determine a temperature of the epoxy resin based on the excitation light energy and the fluorescent light energy.

公开(公告)号：US11629409B2

公开(公告)日：2023-04-18

申请号：US16424302

申请日：2019-05-28

Applicant: APPLIED MATERIALS, INC.

Inventor： Ribhu Gautam ,  Ananthkrishna Jupudi ,  Tuck Foong Koh ,  Preetham P. Rao ,  Vinodh Ramachandran ,  Yueh Sheng Ow ,  Yuichi Wada ,  Cheng-Hsiung Tsai ,  Kai Liang Liew

IPC: C23C16/511 ,  B01J19/12 ,  C23C16/54 ,  H05B6/64 ,  H01J37/32

Abstract: Methods and apparatus for a substrate processing chamber are provided herein. In some embodiments, a substrate processing chamber includes a chamber body having sidewalls defining an interior volume having a polygon shape; a selectively sealable elongated opening disposed in an upper portion of the chamber body for transferring one or more substrates into or out of the chamber body; a funnel disposed at a first end of the chamber body, wherein the funnel increases in size along a direction from an outer surface of the chamber body to the interior volume; and a pump port disposed at a second end of the chamber body opposite the funnel.

公开(公告)号：US10950475B1

公开(公告)日：2021-03-16

申请号：US16545537

申请日：2019-08-20

Applicant: APPLIED MATERIALS, INC.

Inventor： Vinodh Ramachandran ,  Ananthkrishna Jupudi ,  Cheng-Hsiung Tsai ,  Yueh Sheng Ow ,  Preetham P. Rao ,  Ribhu Gautam ,  Prashant Agarwal

IPC: H01L21/67 ,  H01L21/324 ,  H05B6/64 ,  H01L21/66 ,  G01J5/10

Abstract: Methods and apparatus for processing a substrate are provided. The apparatus, for example, can include a process chamber comprising a chamber body defining a processing volume and having a view port coupled to the chamber body; a substrate support disposed within the processing volume and having a support surface to support a substrate; and an infrared temperature sensor (IRTS) disposed outside the chamber body adjacent the view port to measure a temperature of the substrate when being processed in the processing volume, the IRTS movable relative to the view port for scanning the substrate through the view port.