公开(公告)号：US11870202B2

公开(公告)日：2024-01-09

申请号：US17009851

申请日：2020-09-02

Applicant: Applied Materials, Inc.

Inventor： Rajesh Kumar Putti ,  Vinodh Ramachandran ,  Ananthkrishna Jupudi ,  Lean Wui Koh ,  Prashant Agarwal

IPC: H03F1/52 ,  H01S3/041 ,  H01S3/067 ,  H01S3/042 ,  H01S3/23

CPC classification number: H01S3/041 ,  H01S3/042 ,  H01S3/06779 ,  H01S3/06783 ,  H01S3/2308

Abstract: Methods and apparatus for processing a substrate. For example, a processing chamber can include a power source, an amplifier connected to the power source, comprising at least one of a gallium nitride (GaN) transistor or a gallium arsenide (GaAs) transistor, and configured to amplify a power level of an input signal received from the power source to heat a substrate in a process volume, and a cooling plate configured to receive a coolant to cool the amplifier during operation.

公开(公告)号：US11699634B2

公开(公告)日：2023-07-11

申请号：US16460979

申请日：2019-07-02

Applicant: APPLIED MATERIALS, INC.

Inventor： Ribhu Gautam ,  Ananthkrishna Jupudi ,  Vinodh Ramachandran

IPC: H01L23/473 ,  F28F3/12 ,  H01L23/36 ,  H01L23/367 ,  H01L23/46

CPC classification number: H01L23/473 ,  F28F3/12 ,  H01L23/36 ,  H01L23/367 ,  H01L23/46 ,  F28F2210/10

Abstract: Methods and apparatus for a cooling plate for solid state power amplifiers are provided herein. In some embodiments, a cooling plate of a solid state power amplifier includes a body having a rectangular shape, a first sidewall opposite a second sidewall, and a third sidewall opposite a fourth sidewall; a plurality of holes disposed on a first side of the body configured to mount a plurality of heat generating microelectronic components; and a channel having a plurality of segments disposed within the body and extending from a first port disposed on the first sidewall to a second port disposed on the first sidewall.

公开(公告)号：US11480865B2

公开(公告)日：2022-10-25

申请号：US17120789

申请日：2020-12-14

Applicant: Applied Materials, Inc.

Inventor： Vibhu Jindal ,  Sanjay Bhat ,  Wen Xiao ,  Vinodh Ramachandran

IPC: G03F1/24 ,  G03F1/60

Abstract: Apparatus and methods for improving flatness of extreme ultraviolet (EUV) mask blanks are disclosed. The apparatus and methods may utilize one or more of heating the backside and/or the front side of the EUV mask blank and a cooling system. Interfacial layers of the EUV mask blank are selectively heated, resulting in improved flatness of the EUV mask blanks.

公开(公告)号：US12165907B2

公开(公告)日：2024-12-10

申请号：US16952979

申请日：2020-11-19

Applicant: Applied Materials, Inc.

Inventor： Giridhar Kamesh ,  Vinodh Ramachandran ,  Chaitanya A. Prasad ,  Mohammad Aamir ,  Daniel C. Glover

IPC: H01L21/687 ,  H01L21/02 ,  H01L21/311

Abstract: Embodiments of the present disclosure generally relate to apparatus for substrate processing, and more specifically to apparatus for rotating substrates and to uses thereof. In an embodiment, an apparatus for rotating a substrate is provided. The apparatus includes a levitatable rotor comprising a plurality of magnets embedded therein, a plurality of gas bearings positioned to levitate the levitatable rotor, and a stator magnetically coupled to the levitatable rotor, the stator for producing a rotating magnetic field. Apparatus for processing a substrate with the apparatus for rotating substrates as well as methods of use are also described.

公开(公告)号：US11476097B2

公开(公告)日：2022-10-18

申请号：US17012275

申请日：2020-09-04

Applicant: Applied Materials, Inc.

Inventor： Vinodh Ramachandran ,  Ananthkrishna Jupudi ,  Sarath Babu

IPC: H01L21/683 ,  H01J37/32 ,  H02N13/00

Abstract: An apparatus, methods and controllers for electrostatically chucking varied substrate materials are disclosed. Some embodiments of the disclosure provide electrostatic chucks with variable polarity and/or voltage. Some embodiments of the disclosure provide electrostatic chucks able to operate as monopolar and bipolar electrostatic chucks. Some embodiments of the disclosure provide bipolar electrostatic chucks able to compensate for substrate bias and produce approximately equal chucking force at different electrodes.

公开(公告)号：US10677830B2

公开(公告)日：2020-06-09

申请号：US15649600

申请日：2017-07-13

Applicant: APPLIED MATERIALS, INC.

Inventor： Ananthkrishna Jupudi ,  Yueh Sheng Ow ,  Jacob Newman ,  Preetham Rao ,  Yuichi Wada ,  Vinodh Ramachandran

IPC: G01R29/08 ,  H01L21/67 ,  H05B6/80 ,  H05B6/64

Abstract: An apparatus for relaying microwave field intensity in a microwave cavity. In some embodiments, the apparatus comprises a microwave transparent substrate with at least one Radio Frequency (RF) detector that is capable of detecting a microwave field and generating a signal associated with a field intensity of the detected microwave field and a transmitter that receives the signal associated with the detected microwave field from the RF detector and transmits or stores information about the detected microwave field intensity. In some embodiments, the apparatus relays the microwave intensity via a wired, wireless, or optical transmitter located in proximity of the RF detector.

公开(公告)号：US11860528B2

公开(公告)日：2024-01-02

申请号：US17129077

申请日：2020-12-21

Applicant: Applied Materials, Inc.

Inventor： Ribhu Gautam ,  Vibhu Jindal ,  Sanjay Bhat ,  Praveen Kumar Choragudi ,  Vinodh Ramachandran ,  Arun Rengaraj

IPC: H01L21/67 ,  G03F1/24 ,  H01L21/687 ,  B65G47/90 ,  C23C14/06 ,  C23C14/56 ,  C23C14/58 ,  C23C14/35

CPC classification number: G03F1/24 ,  B65G47/90 ,  C23C14/0641 ,  C23C14/35 ,  C23C14/566 ,  C23C14/568 ,  C23C14/5806 ,  H01L21/67167 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/68707 ,  H01L21/68742 ,  H01L21/68764

Abstract: Substrate processing systems or platforms and methods configured to process substrates including of extreme ultraviolet (EUV) mask blanks are disclosed. Systems or platforms provide a small footprint, high throughput of substrates and minimize defect generation. The substrate processing system platform comprises a single central transfer chamber, a single transfer robot, a substrate flipping fixture, and processing chambers are positioned around the single central transfer chamber.

公开(公告)号：US11630001B2

公开(公告)日：2023-04-18

申请号：US17073733

申请日：2020-10-19

Applicant: APPLIED MATERIALS, INC.

Inventor： Ananthkrishna Jupudi ,  Sai Kumar Kodumuri ,  Vinodh Ramachandran ,  Prashant Agarwal ,  Hadi Bin Amir Muhammad

IPC: G01K1/16 ,  G01K13/00 ,  G01K1/14 ,  G01K11/20

Abstract: An apparatus for determining temperatures of substrates in microwave and/or vacuum environments. A substrate holder with a plurality of support pins includes a temperature sensor assembly with at least a portion of a surface with a phosphorous coating is configured to be inserted in at least one pin support position from an inner area of the substrate holder and in at least one pin support position from an outer area of the substrate holder. The temperature sensor assembly includes a temperature sensor pin with a spring that is microwave transparent. The temperature sensor pin is made of a material with a thermal conductivity greater than approximately 200 W/mK and a low thermal mass which is microwave transparent. An optical transmission assembly is embedded into at least a portion of the substrate holder to receive light emissions from a surface of the temperature sensor pin.

公开(公告)号：US20220197128A1

公开(公告)日：2022-06-23

申请号：US17129077

申请日：2020-12-21

Applicant: Applied Materials, Inc.

Inventor： Ribhu Gautam ,  Vibhu Jindal ,  Sanjay Bhat ,  Praveen Kumar Choragudi ,  Vinodh Ramachandran ,  Arun Rengaraj

IPC: G03F1/24 ,  H01L21/67 ,  H01L21/687 ,  C23C14/06 ,  C23C14/56 ,  C23C14/58 ,  C23C14/35 ,  B65G47/90

Abstract: Substrate processing systems or platforms and methods configured to process substrates including of extreme ultraviolet (EUV) mask blanks are disclosed. Systems or platforms provide a small footprint, high throughput of substrates and minimize defect generation. The substrate processing system platform comprises a single central transfer chamber, a single transfer robot, a substrate flipping fixture, and processing chambers are positioned around the single central transfer chamber.

公开(公告)号：US20210074523A1

公开(公告)日：2021-03-11

申请号：US17012275

申请日：2020-09-04

Applicant: Applied Materials, Inc.

Inventor： Vinodh Ramachandran ,  Ananthkrishna Jupudi ,  Sarath Babu

IPC: H01J37/32 ,  H01L21/683

Abstract: An apparatus, methods and controllers for electrostatically chucking varied substrate materials are disclosed. Some embodiments of the disclosure provide electrostatic chucks with variable polarity and/or voltage. Some embodiments of the disclosure provide electrostatic chucks able to operate as monopolar and bipolar electrostatic chucks. Some embodiments of the disclosure provide bipolar electrostatic chucks able to compensate for substrate bias and produce approximately equal chucking force at different electrodes.