公开(公告)号：US12074010B2

公开(公告)日：2024-08-27

申请号：US17470294

申请日：2021-09-09

Applicant: Applied Materials, Inc.

Inventor： Michael R. Rice ,  Hanish Kumar Panavalappil Kumarankutty ,  Steven D. Marcus ,  Kirubanandan Naina Shanmugam ,  Sriharsha Dharmapura Sathyanarayanamurthy ,  Madhukar Krishna ,  Shivaprakash Padadayya Hiremath ,  Senthil Kumar Nattamai Subramanian ,  Sankar Menon Cherubala Pathayapura

IPC: H01J37/32 ,  C23C16/455 ,  C23C16/458 ,  C23C16/46

CPC classification number: H01J37/3244 ,  C23C16/45536 ,  C23C16/45544 ,  C23C16/4586 ,  C23C16/46 ,  C23C16/463 ,  H01J37/32357 ,  H01J37/32522 ,  H01J37/32724 ,  C23C16/4582

Abstract: Methods and apparatus for coating processing reactor component parts are provided herein. In some embodiments, a part coating reactor includes: a lower body and a lid assembly that together define and enclose an interior volume; one or more heaters disposed in the lid assembly; one or more coolant channels disposed in the lid assembly to flow a heat transfer medium therethrough; a plurality of gas passages disposed through the lid assembly to facilitate providing one or more gases to the interior volume, wherein the plurality of gas passages include a plurality of fluidly independent plenums disposed in the lid assembly; and one or more mounting brackets to facilitate coupling a workpiece to the lid assembly.

公开(公告)号：US11946140B2

公开(公告)日：2024-04-02

申请号：US17213908

申请日：2021-03-26

Applicant: Applied Materials, Inc.

Inventor： Anantha K. Subramani ,  Seyyed Abdolreza Fazeli ,  Yang Guo ,  Ramcharan Sundar ,  Arun Kumar Kotrappa ,  Steven Mosbrucker ,  Steven D. Marcus ,  Xinhai Han ,  Kesong Hu ,  Tianyang Li ,  Philip A. Kraus

IPC: C23C16/455 ,  C23C14/56 ,  C23C16/458 ,  H01J37/32

CPC classification number: C23C16/45565 ,  C23C14/564 ,  C23C16/45536 ,  C23C16/4586 ,  H01J37/32082

Abstract: Exemplary substrate processing systems may include a chamber body defining a transfer region. The systems may include a first lid plate seated on the chamber body. The first lid plate may define a plurality of apertures through the first lid plate. The systems may include a plurality of lid stacks equal to a number of the plurality of apertures. The systems may define a plurality of isolators. An isolator may be positioned between each lid stack and a corresponding aperture of the plurality of apertures. The systems may include a plurality of annular spacers. An annular spacer of the plurality of annular spacers may be positioned between each isolator and a corresponding lid stack of the plurality of lids stacks. The systems may include a plurality of manifolds. A manifold may be seated within an interior of each annular spacer of the plurality of annular spacers.

公开(公告)号：US11821083B2

公开(公告)日：2023-11-21

申请号：US17563773

申请日：2021-12-28

Applicant: Applied Materials, Inc.

Inventor： Ning Li ,  Steven D. Marcus ,  Tai T. Ngo ,  Kevin Griffin

IPC: C23C16/44 ,  C23C16/455

CPC classification number: C23C16/4412 ,  C23C16/4417 ,  C23C16/45519 ,  C23C16/45544 ,  C23C16/45557

Abstract: Apparatus and methods for spatial atomic layer deposition including at least one first exhaust system and at least one second exhaust system. Each exhaust system including a throttle valve and a pressure gauge to control the pressure in the processing region associated with the individual exhaust system.

公开(公告)号：US11932938B2

公开(公告)日：2024-03-19

申请号：US16935658

申请日：2020-07-22

Applicant: Applied Materials, Inc.

Inventor： Lisa J. Enman ,  Steven D. Marcus ,  Mark J. Saly ,  Lei Zhou

IPC: C23C16/40 ,  C23C16/455

CPC classification number: C23C16/40 ,  C23C16/45553 ,  C23C16/45555

Abstract: Disclosed is a coated chamber component comprising a body having a reduced metal surface such that the reduced metal surface has less metal oxide as compared to an amount of metal oxide on a metal surface that has not been reduced. The metal surface may be reduced by pulsing a reducing alcohol thereon. The reduced metal surface may be coated with a corrosion resistant film that may be deposited onto the reduced metal surface by a dry atomic layer deposition process.

公开(公告)号：US20220307131A1

公开(公告)日：2022-09-29

申请号：US17213908

申请日：2021-03-26

Applicant: Applied Materials, Inc.

Inventor： Anantha K. Subramani ,  Seyyed Abdolreza Fazeli ,  Yang Guo ,  Ramcharan Sundar ,  Arun Kumar Kotrappa ,  Steven Mosbrucker ,  Steven D. Marcus ,  Xinhai Han ,  Kesong Hu ,  Tianyang Li ,  Philip A. Kraus

IPC: C23C16/455 ,  C23C16/458 ,  H01J37/32 ,  C23C14/56

Abstract: Exemplary substrate processing systems may include a chamber body defining a transfer region. The systems may include a first lid plate seated on the chamber body. The first lid plate may define a plurality of apertures through the first lid plate. The systems may include a plurality of lid stacks equal to a number of the plurality of apertures. The systems may define a plurality of isolators. An isolator may be positioned between each lid stack and a corresponding aperture of the plurality of apertures. The systems may include a plurality of annular spacers. An annular spacer of the plurality of annular spacers may be positioned between each isolator and a corresponding lid stack of the plurality of lids stacks. The systems may include a plurality of manifolds. A manifold may be seated within an interior of each annular spacer of the plurality of annular spacers.

公开(公告)号：US10570511B2

公开(公告)日：2020-02-25

申请号：US14840485

申请日：2015-08-31

Applicant: Applied Materials, Inc.

Inventor： Ning Li ,  Steven D. Marcus ,  Tai T. Ngo ,  Kevin Griffin

IPC: C23C16/44 ,  C23C16/455

Abstract: Apparatus and methods for spatial atomic layer deposition including at least one first exhaust system and at least one second exhaust system. Each exhaust system including a throttle valve and a pressure gauge to control the pressure in the processing region associated with the individual exhaust system.

公开(公告)号：US20240003003A1

公开(公告)日：2024-01-04

申请号：US18368202

申请日：2023-09-14

Applicant: Applied Materials, Inc.

Inventor： Lisa J. Enman ,  Steven D. Marcus ,  Mark J. Saly ,  Lei Zhou

IPC: C23C16/40 ,  C23C16/455

CPC classification number: C23C16/40 ,  C23C16/45553 ,  C23C16/45555

Abstract: Disclosed is a coated chamber component comprising a body having a reduced metal surface such that the reduced metal surface has less metal oxide as compared to an amount of metal oxide on a metal surface that has not been reduced. The metal surface may be reduced by pulsing a reducing alcohol thereon. The reduced metal surface may be coated with a corrosion resistant film that may be deposited onto the reduced metal surface by a dry atomic layer deposition process.

公开(公告)号：US11658014B2

公开(公告)日：2023-05-23

申请号：US16846295

申请日：2020-04-11

Applicant: APPLIED MATERIALS, INC.

Inventor： Pingyan Lei ,  Dien-Yeh Wu ,  Xiao Ming He ,  Jennifer Y. Sun ,  Lei Zhou ,  Takashi Kuratomi ,  Avgerinos V. Gelatos ,  Mei Chang ,  Steven D. Marcus

IPC: C23C16/06 ,  C23C16/44 ,  H01J37/32 ,  H01L21/67 ,  C23C16/455 ,  H01L21/285

CPC classification number: H01J37/32477 ,  C23C16/06 ,  C23C16/4404 ,  C23C16/45536 ,  C23C16/45544 ,  C23C16/45565 ,  H01J37/32467 ,  H01L21/28556 ,  H01L21/67017 ,  H01J2237/3321

Abstract: Methods and apparatus for depositing a coating on a semiconductor manufacturing apparatus component are provided herein. In some embodiments, a method of depositing a coating on a semiconductor manufacturing apparatus component includes: sequentially exposing a semiconductor manufacturing apparatus component including nickel or nickel alloy to an aluminum precursor and a reactant to form an aluminum containing layer on a surface of the semiconductor manufacturing apparatus component by a deposition process.

公开(公告)号：US20200149161A1

公开(公告)日：2020-05-14

申请号：US16744560

申请日：2020-01-16

Applicant: Applied Materials, Inc.

Inventor： Ning Li ,  Steven D. Marcus ,  Tai T. Ngo ,  Kevin Griffin

IPC: C23C16/44 ,  C23C16/455

Abstract: Apparatus and methods for spatial atomic layer deposition including at least one first exhaust system and at least one second exhaust system. Each exhaust system including a throttle valve and a pressure gauge to control the pressure in the processing region associated with the individual exhaust system.

公开(公告)号：US20220119942A1

公开(公告)日：2022-04-21

申请号：US17563773

申请日：2021-12-28

Applicant: Applied Materials, Inc.

Inventor： Ning Li ,  Steven D. Marcus ,  Tai T. Ngo ,  Kevin Griffin

IPC: C23C16/44 ,  C23C16/455

Abstract: Apparatus and methods for spatial atomic layer deposition including at least one first exhaust system and at least one second exhaust system. Each exhaust system including a throttle valve and a pressure gauge to control the pressure in the processing region associated with the individual exhaust system.