Circuitry for memory address collision prevention

    公开(公告)号:US12066926B2

    公开(公告)日:2024-08-20

    申请号:US17861084

    申请日:2022-07-08

    Applicant: Arm Limited

    CPC classification number: G06F12/023 G06F2212/1008

    Abstract: According to one implementation of the present disclosure, an integrated circuit includes comparator circuitry coupled to peripheral circuitry of a multiport memory and configured to transmit one or more data input signals or one or more write enable signals to respective memory outputs when a memory address collision is detected for one or more respective bitcells of the multi-port memory. In another implementation, a method comprises: detecting a read operation and a write operation to a same memory bitcell of a multiport memory in one clock cycle and in response to the detection, performing the read operation of a data input signal or a write enable signal of the multiport memory.

    Data compressor logic circuit
    3.
    发明授权

    公开(公告)号:US11831341B2

    公开(公告)日:2023-11-28

    申请号:US17001580

    申请日:2020-08-24

    Applicant: Arm Limited

    Abstract: A compressor includes a logic circuit having transistors of a first channel type to receive a plurality of bit signals, and transistors of a second channel type, different from the first channel type, to receive the plurality of bit signals. The transistors of the first channel type are configured to generate an XOR logic output based on the plurality of bit signals, and the transistors of the second channel type are configured to generate, substantially simultaneous with the generation of the XOR logic output, an XNOR logic output based on the plurality of bit signals. The compressor includes NAND gates to receive multiplicand and multiplier bit signals.

    TSV coupled integrated circuits and methods

    公开(公告)号:US11569219B2

    公开(公告)日:2023-01-31

    申请号:US17077532

    申请日:2020-10-22

    Applicant: Arm Limited

    Abstract: According to one implementation of the present disclosure, an integrated circuit includes a memory macro unit, and one or more through silicon vias (TSVs) at least partially coupled through the memory macro unit. According to one implementation of the present disclosure, a computer-readable storage medium comprising instructions that, when executed by a processor, cause the processor to perform operations including: receiving a user input corresponding to dimensions of respective pitches of one or more through silicon vias (TSVs); determining whether dimensions of a memory macro unit is greater than a size threshold, wherein the size threshold corresponds to the received user input; and determining one or more through silicon via (TSV) positionings based on the determined dimensions of the memory macro unit.

    Latch circuitry for memory applications

    公开(公告)号:US11568926B2

    公开(公告)日:2023-01-31

    申请号:US17101610

    申请日:2020-11-23

    Applicant: Arm Limited

    Abstract: Various implementations described herein are directed to an integrated circuit having first latch circuitry with multiple first latches that latch multiple input data signals. The integrated circuit may include second latch circuitry having a single second latch that receives the latched multiple input data signals from the multiple first latches and outputs a single latched data signal based on the latched multiple input data signals. The integrated circuit may include intermediate logic circuitry that is coupled between the first latch circuitry and the second latch circuitry. The intermediate logic circuitry may receive and combine the multiple input data signals from the first latch circuitry into a single data signal that is provided to the single second latch of the second latch circuitry for output as the single latched data signal.

    Column Redundancy Techniques
    7.
    发明申请

    公开(公告)号:US20230016339A1

    公开(公告)日:2023-01-19

    申请号:US17375887

    申请日:2021-07-14

    Applicant: Arm Limited

    Abstract: Various implementations described herein are directed to a device having memory architecture with an array of memory cells arranged in multiple columns with redundancy including first columns of memory cells disposed in a first region along with second columns of memory cells and redundancy columns of memory cells disposed in a second region that is laterally opposite the first region. The device may have column shifting logic that is configured to receive data from the multiple columns, shift the data from the first columns in the first region to a first set of the redundancy columns in the second region, and shift data from the second columns in the second region to a second set of the redundancy columns in the second region.

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