公开(公告)号：US20180314159A1

公开(公告)日：2018-11-01

申请号：US16027034

申请日：2018-07-03

Applicant: ASAHI KASEI E-MATERIALS CORPORATION

Inventor： Yoshimichi MITAMURA ,  Takuto NAKATA

IPC: G03F7/38 ,  G11B7/26 ,  G03F7/00 ,  B29C59/02 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/32 ,  G03F7/004 ,  B29C33/38 ,  C04B35/45 ,  B29C33/42 ,  G11B7/14

CPC classification number: G03F7/38 ,  B29C33/3857 ,  B29C33/424 ,  B29C59/022 ,  B29C2059/023 ,  B82Y10/00 ,  B82Y40/00 ,  C04B35/45 ,  G03F7/0002 ,  G03F7/0017 ,  G03F7/0043 ,  G03F7/32 ,  G03F7/322 ,  G11B7/14 ,  G11B7/261

Abstract: A heat-reactive resist material contains copper oxide, and silicon or silicon oxide, and is formed so that the content of silicon or silicon oxide in the heat-reactive resist material is 4.0 mol % or more less than 10.0 mol % in terms of mole of silicon. A heat-reactive resist layer is formed using the heat-reactive resist material, is exposed, and then, is developed with a developing solution. Using the obtained heat-reactive resist layer as a mask, dry etching is performed on a substrate with a fluorocarbon to manufacture a mold having a concavo-convex shape on the substrate surface. At this point, it is possible to control a fine pattern comprised of the concavo-convex shape.

公开(公告)号：US20150183152A1

公开(公告)日：2015-07-02

申请号：US14656012

申请日：2015-03-12

Applicant: ASAHI KASEI E-MATERIALS CORPORATION

Inventor： Yoshimichi MITAMURA

IPC: B29C59/00 ,  B29C33/42 ,  B29C33/38 ,  G03F7/075 ,  G03F7/04

CPC classification number: B29C33/3842 ,  B29C33/38 ,  B29C33/42 ,  B29C59/002 ,  B29K2905/06 ,  B29L2031/757 ,  B81C99/0085 ,  C09K13/00 ,  C23F1/00 ,  G03F7/0002 ,  G03F7/04 ,  G03F7/0755 ,  H01L21/0337 ,  Y10T428/24612

Abstract: A fine concavo-convex structure product (10) is provided with an etching layer (11), and a resist layer (12) comprised of a heat-reactive resist material for dry etching provided on the etching layer (11), a concavo-convex structure associated with opening portions (12a) formed in the resist layer (12) is formed in the etching layer (11), a pattern pitch P of a fine pattern of the concavo-convex structure ranges from 1 nm to 10 μm, a pattern depth H of the fine pattern ranges from 1 nm to 10 μm, and a pattern cross-sectional shape of the fine pattern is a trapezoid, a triangle or a mixed shape thereof. The heat-reactive resist material for dry etching has, as a principal constituent element, at least one species selected from the group consisting of Cu, Nb, Sn, Mn, oxides thereof, nitrides thereof and NiBi.

Abstract translation: 具有蚀刻层（11）的精细凹凸结构体（10）和设置在蚀刻层（11）上的用于干蚀刻的热反应型抗蚀剂材料的抗蚀剂层（12） 在蚀刻层（11）中形成与形成在抗蚀剂层（12）中的开口部（12a）相关联的凸起结构，凹凸结构的精细图案的图案间距P为1nm〜10μm， 精细图案的图案深度H为1nm〜10μm，精细图案的图案截面形状为梯形，三角形或其混合形状。 用于干蚀刻的热反应抗蚀剂材料作为主要构成元素，选自Cu，Nb，Sn，Mn，其氧化物，其氮化物和NiBi中的至少一种。

公开(公告)号：US20140091058A1

公开(公告)日：2014-04-03

申请号：US14098109

申请日：2013-12-05

Applicant: ASAHI KASEI E-MATERIALS CORPORATION

Inventor： Norikiyo NAKAGAWA ,  Takuto NAKATA ,  Yoshimichi MITAMURA

IPC: C09K13/00

CPC classification number: C09K13/00 ,  B82Y40/00 ,  H01L21/0337 ,  H01L21/32134

Abstract: In order to provide a copper oxide etchant and an etching method using the same capable of selectively etching exposure/non-exposure portions when laser light exposure is performed by using copper oxide as a thermal-reactive resist material, the copper oxide etchant for selectively etching copper oxides having different oxidation numbers in a copper oxide-containing layer containing the copper oxide as a main component contains at least a chelating agent or salts thereof.

Abstract translation: 为了提供铜氧化物蚀刻剂和使用该氧化铜蚀刻剂的蚀刻方法，当使用氧化铜作为热反应型抗蚀剂材料进行激光曝光时，可以选择性地蚀刻曝光/非曝光部分的蚀刻方法，用于选择性刻蚀的氧化铜蚀刻剂 含有氧化铜作为主要成分的含氧化铜的层中氧化数不同的铜氧化物至少含有螯合剂或其盐。

公开(公告)号：US20160114503A1

公开(公告)日：2016-04-28

申请号：US14986027

申请日：2015-12-31

Applicant: ASAHI KASEI E-MATERIALS CORPORATION

Inventor： Masaru Suzuki ,  Yoshimichi MITAMURA ,  Masatoshi MAEDA

IPC: B29C33/42 ,  G03F7/00 ,  B29C33/38 ,  C23C14/34

CPC classification number: B29C33/424 ,  B29C33/3842 ,  B29C33/56 ,  B29K2833/04 ,  B29K2905/00 ,  B41C1/05 ,  B82Y10/00 ,  B82Y40/00 ,  C23C14/3407 ,  G03F7/0002 ,  H01J2237/281

Abstract: A seamless mold manufacturing method of the invention is a seamless mold manufacturing method having the steps of forming a thermal reaction type resist layer on a sleeve-shaped mold, and exposing using a laser and developing the thermal reaction type resist layer and thereby forming a fine mold pattern, and is characterized in that the thermal reaction type resist layer is comprised of a thermal reaction type resist having a property of reacting in predetermined light intensity or more in a light intensity distribution in a spot diameter of the laser.

Abstract translation: 本发明的无缝模具制造方法是一种无缝模具制造方法，其具有以下步骤：在套筒状模具上形成热反应型抗蚀剂层，并使用激光曝光并显影热反应型抗蚀剂层，从而形成精细 模具图案，其特征在于，热反应型抗蚀剂层由具有在激光的光点直径的光强度分布中以预定的光强度以上反应的性质的热反应型抗蚀剂构成。

公开(公告)号：US20150183136A1

公开(公告)日：2015-07-02

申请号：US14656091

申请日：2015-03-12

Applicant: ASAHI KASEI E-MATERIALS CORPORATION

Inventor： Yoshimichi MITAMURA

IPC: B29C33/38

CPC classification number: B29C33/3842 ,  B29C33/38 ,  B29C33/42 ,  B29C59/002 ,  B29K2905/06 ,  B29L2031/757 ,  B81C99/0085 ,  C09K13/00 ,  C23F1/00 ,  G03F7/0002 ,  G03F7/04 ,  G03F7/0755 ,  H01L21/0337 ,  Y10T428/24612

Abstract: A fine concavo-convex structure product (10) is provided with an etching layer (11), and a resist layer (12) comprised of a heat-reactive resist material for dry etching provided on the etching layer (11), a concavo-convex structure associated with opening portions (12a) formed in the resist layer (12) is formed in the etching layer (11), a pattern pitch P of a fine pattern of the concavo-convex structure ranges from 1 nm to 10 μm, a pattern depth H of the fine pattern ranges from 1 nm to 10 μm, and a pattern cross-sectional shape of the fine pattern is a trapezoid, a triangle or a mixed shape thereof. The heat-reactive resist material for dry etching has, as a principal constituent element, at least one species selected from the group consisting of Cu, Nb, Sn, Mn, oxides thereof, nitrides thereof and NiBi.