公开(公告)号：US20200319118A1

公开(公告)日：2020-10-08

申请号：US16905629

申请日：2020-06-18

Applicant: ASML Netherlands B.V.

Inventor： Wouter Lodewijk ELINGS ,  Franciscus Bernardus Maria VAN BILSEN ,  Christianus Gerardus Maria DE MOL ,  Everhardus Cornelis MOS ,  Hoite Pieter Theodoor TOLSMA ,  Peter TEN BERGE ,  Paul Jacques VAN WIJNEN ,  Leonard us Henricus Marie VERSTAPPEN ,  Gerald DICKER ,  Reiner Maria JUNGBLUT ,  Chung-Hsun LI

IPC: G01N21/95 ,  G01B11/14 ,  G01B11/02 ,  G01N21/956 ,  G03F7/20 ,  H01L21/66 ,  G05B19/418 ,  G01B11/00 ,  G01B11/26

Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked to at least partially recompose the measurement results according to the sample plan.

公开(公告)号：US20230341783A1

公开(公告)日：2023-10-26

申请号：US17796434

申请日：2021-01-19

Applicant: ASML NETHERLANDS B.V.

Inventor： Arnaud HUBAUX ,  Patrick WARNAAR ,  Scott Anderson MIDDLEBROOKS ,  Tijmen Pieter COLLIGNON ,  Chung-Hsun LI ,  Georgios TSIROGIANNIS ,  Sayyed Mojtaba SHAKERI

IPC: G03F7/00

CPC classification number: G03F7/705 ,  G03F7/70458 ,  G03F7/70633

Abstract: A method of determining matching performance between tools used in semiconductor manufacture and associated tools is described. The method includes obtaining a plurality of data sets related to a plurality of tools and a representation of the data sets in a reduced space having a reduced dimensionality. A matching metric and/or matching correction is determined based on matching the reduced data sets in the reduced space.

公开(公告)号：US20220171299A1

公开(公告)日：2022-06-02

申请号：US17599302

申请日：2020-01-17

Applicant: ASML NETHERLANDS B.V.

Inventor： Ruud Hendrikus Martinus Johannes BLOKS ,  Hendrik Cornelis Anton BORGER ,  Frederik Eduard DE JONG ,  Johan Gertrudis Cornelis KUNNEN ,  Siebe LANDHEER ,  Chung-Hsun LI ,  Patricius Jacobus NEEFS ,  Georgios TSIROGIANNIS ,  Si-Han ZENG

IPC: G03F7/20

Abstract: A method of determining an overlay value of a substrate, the method including: obtaining temperature data that includes data on measured temperature at one or more positions on a substrate table after a substrate has been loaded onto the substrate table; and determining an overlay value of the substrate in dependence on the obtained temperature data. There is further disclosed a method of determining a performance of a clamping by a substrate table using a determined overlay value.

公开(公告)号：US20220390855A1

公开(公告)日：2022-12-08

申请号：US17775802

申请日：2020-10-12

Applicant: ASML Netherlands B.V.

Inventor： Cornelis Melchior BROUWER ,  Chung-Hsun LI

IPC: G03F7/20

Abstract: Disclosed is a method of determining calibrated reference exposure and measure grids for referencing position of a substrate stage in a lithographic system. The method comprises obtaining calibration data relating to one or more calibration substrates; and determining an exposure grid for an exposure side of the lithographic system from said calibration data and a measure grid for a measure side of the lithographic system from said calibration data. The exposure grid and said measure grid are decomposed so as to remove a calibration substrate dependent component from said exposure grid and from said measure grid to obtain a substrate independent exposure grid and substrate independent measure grid.

公开(公告)号：US20220082949A1

公开(公告)日：2022-03-17

申请号：US17423325

申请日：2020-01-09

Applicant: ASML NETHERLANDS B.V.

Inventor： Arnaud HUBAUX ,  Johan Franciscus Maria BECKERS ,  Dylan John David DAVIES ,  Johan Gertrudis Cornelis KUNNEN ,  Willem Richard PONGERS ,  Ajinkya Ravindra DAWARE ,  Chung-Hsun LI ,  Georgios TSIROGIANNIS ,  Hendrik Cornelis Anton BORGER ,  Frederik Eduard DEJONG ,  Juan Manuel GONZALEZ HUESCA ,  Andriy HLOD ,  Maxim PISARENCO

IPC: G03F7/20 ,  G03F1/70 ,  G06F30/392

Abstract: A method for categorizing a substrate subject to a semiconductor manufacturing process including multiple operations, the method including: obtaining values of functional indicators derived from data generated during one or more of the multiple operations on the substrate, the functional indicators characterizing at least one operation; applying a decision model including one or more threshold values to the values of the functional indicators to obtain one or more categorical indicators; and assigning a category to the substrate based on the one or more categorical indicators.

公开(公告)号：US20190384164A1

公开(公告)日：2019-12-19

申请号：US16485506

申请日：2018-02-16

Applicant: ASML NETHERLANDS B.V.

Inventor： Marcel Theodorus Maria VAN KESSEL ,  Frederik Eduard DE JONG ,  Cornelis Melchior BROUWER ,  Kevin VAN DE RUIT ,  Chung-Hsun LI

IPC: G03F1/62 ,  G03F7/20

Abstract: A method for mitigating an effect of non-uniform pellicle degradation on control of a substrate patterning process and an associated lithographic apparatus. The method includes quantifying an effect of the non-uniform pellicle degradation on one or more properties of patterned features, such as one or more metrology targets, formed on the substrate by the substrate patterning process. A process control correction is then determined based on the quantification of the effect of the non-uniform pellicle degradation.