公开(公告)号：US20180239851A1

公开(公告)日：2018-08-23

申请号：US15900735

申请日：2018-02-20

Applicant: ASML NETHERLANDS B.V.

Inventor： Alexander YPMA ,  Maurits VAN DER SCHAAR ,  Georgios TSIROGIANNIS ,  Leendert Jan KARSSEMEIJER ,  Chi-Hsiang FAN

IPC: G06F17/50 ,  G06N7/00

CPC classification number: G06F17/5009 ,  G03F7/70516 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F9/7019 ,  G06N7/005

Abstract: A process of calibrating parameters of a stack model used to simulate the performance of measurement structures in a patterning process, the process including: obtaining a stack model used in a simulation of performance of measurement structures; obtaining calibration data indicative of performance of the measurement structures; calibrating parameters of the model by, until a termination condition occurs, repeatedly: simulating performance of the measurement structures with the simulation using a candidate model; approximating the simulation, based on a result of the simulation, with a surrogate function; and selecting a new candidate model based on the approximation.

公开(公告)号：US20220082949A1

公开(公告)日：2022-03-17

申请号：US17423325

申请日：2020-01-09

Applicant: ASML NETHERLANDS B.V.

Inventor： Arnaud HUBAUX ,  Johan Franciscus Maria BECKERS ,  Dylan John David DAVIES ,  Johan Gertrudis Cornelis KUNNEN ,  Willem Richard PONGERS ,  Ajinkya Ravindra DAWARE ,  Chung-Hsun LI ,  Georgios TSIROGIANNIS ,  Hendrik Cornelis Anton BORGER ,  Frederik Eduard DEJONG ,  Juan Manuel GONZALEZ HUESCA ,  Andriy HLOD ,  Maxim PISARENCO

IPC: G03F7/20 ,  G03F1/70 ,  G06F30/392

Abstract: A method for categorizing a substrate subject to a semiconductor manufacturing process including multiple operations, the method including: obtaining values of functional indicators derived from data generated during one or more of the multiple operations on the substrate, the functional indicators characterizing at least one operation; applying a decision model including one or more threshold values to the values of the functional indicators to obtain one or more categorical indicators; and assigning a category to the substrate based on the one or more categorical indicators.

公开(公告)号：US20220171299A1

公开(公告)日：2022-06-02

申请号：US17599302

申请日：2020-01-17

Applicant: ASML NETHERLANDS B.V.

Inventor： Ruud Hendrikus Martinus Johannes BLOKS ,  Hendrik Cornelis Anton BORGER ,  Frederik Eduard DE JONG ,  Johan Gertrudis Cornelis KUNNEN ,  Siebe LANDHEER ,  Chung-Hsun LI ,  Patricius Jacobus NEEFS ,  Georgios TSIROGIANNIS ,  Si-Han ZENG

IPC: G03F7/20

Abstract: A method of determining an overlay value of a substrate, the method including: obtaining temperature data that includes data on measured temperature at one or more positions on a substrate table after a substrate has been loaded onto the substrate table; and determining an overlay value of the substrate in dependence on the obtained temperature data. There is further disclosed a method of determining a performance of a clamping by a substrate table using a determined overlay value.

公开(公告)号：US20200233315A1

公开(公告)日：2020-07-23

申请号：US16486859

申请日：2018-02-22

Applicant: ASML NETHERLANDS B.V.

Inventor： Jelle NIJE ,  Alexander YPMA ,  Dimitra GKOROU ,  Georgios TSIROGIANNIS ,  Robert Jan VAN WIJK ,  Tzu-Chao CHEN ,  Frans Reinier SPIERING ,  Sarathi ROY ,  Cédric Désiré GROUWSTRA

IPC: G03F7/20

Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.

公开(公告)号：US20230341783A1

公开(公告)日：2023-10-26

申请号：US17796434

申请日：2021-01-19

Applicant: ASML NETHERLANDS B.V.

Inventor： Arnaud HUBAUX ,  Patrick WARNAAR ,  Scott Anderson MIDDLEBROOKS ,  Tijmen Pieter COLLIGNON ,  Chung-Hsun LI ,  Georgios TSIROGIANNIS ,  Sayyed Mojtaba SHAKERI

IPC: G03F7/00

CPC classification number: G03F7/705 ,  G03F7/70458 ,  G03F7/70633

Abstract: A method of determining matching performance between tools used in semiconductor manufacture and associated tools is described. The method includes obtaining a plurality of data sets related to a plurality of tools and a representation of the data sets in a reduced space having a reduced dimensionality. A matching metric and/or matching correction is determined based on matching the reduced data sets in the reduced space.

公开(公告)号：US20220004108A1

公开(公告)日：2022-01-06

申请号：US17479078

申请日：2021-09-20

Applicant: ASML NETHERLANDS B.V.

Inventor： Jelle NIJE ,  Alexander YPMA ,  Dimitra GKOROU ,  Georgios TSIROGIANNIS ,  Robert Jan VAN WIJK ,  Tzu-Chao CHEN ,  Frans Reinier SPIERING ,  Sarathi ROY ,  Cédric Désiré GROUWSTRA

IPC: G03F7/20

Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method includes: receiving object data representing one or more parameters measured across the product units and associated with different stages of processing of the product units; and determining fingerprints of variation of the object data across the product units, the fingerprints being associated with different respective stages of processing of the product units. The fingerprints may be determined by decomposing the object data into components using principal component analysis for each different respective stage; analyzing commonality of the fingerprints through the different stages to produce commonality results; and optimizing an apparatus for processing product units based on the commonality results.

公开(公告)号：US20210157247A1

公开(公告)日：2021-05-27

申请号：US16493326

申请日：2018-04-09

Applicant: ASML NETHERLANDS B.V.

Inventor： Alexander YPMA ,  Vahid BASTANI ,  Dag SONNTAG ,  Jelle NIJE ,  Hakki Ergün CEKLI ,  Georgios TSIROGIANNIS ,  Robert Jan VAN WIJK

IPC: G03F7/20

Abstract: A method of maintaining a set of fingerprints representing variation of one or more process parameters across wafers subjected to a device manufacturing method, the method including: receiving measurement data of one or more parameters measured on wafers; updating the set of fingerprints based on an expected evolution of the one or more process parameters; and evaluation of the updated set of fingerprints based on decomposition of the received measurement data in terms of the updated set of fingerprints. Each fingerprint may have a stored likelihood of occurrence, and the decomposition may involve: estimating, based the received measurement data, likelihoods of occurrence of the set of fingerprints in the received measurement data; and updating the stored likelihoods of occurrence based on the estimated likelihoods.